JPS5970352U - Plug-in semiconductor package - Google Patents
Plug-in semiconductor packageInfo
- Publication number
- JPS5970352U JPS5970352U JP16394182U JP16394182U JPS5970352U JP S5970352 U JPS5970352 U JP S5970352U JP 16394182 U JP16394182 U JP 16394182U JP 16394182 U JP16394182 U JP 16394182U JP S5970352 U JPS5970352 U JP S5970352U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- plug
- type semiconductor
- terminal pins
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のプラグイン型半導体パッケージを配線基
板に実装したときの要部断面図、第2図は第1図絶縁筐
体の要部拡大斜視図、第3図は本考案実施例の要部斜視
図、第4図は本考案のプラグイン型半導体パッケージを
絶縁筐体の底部から見た正面図、第5図は本考案プラグ
イン型半導体パッケージを配線基板に実装したときの要
部断面図、そして、第6図及び第7図は突起部の変形態
様を示した要部拡大斜視図である。 −1・・・絶縁
筐体、2,2a・・・端子ピン、3・・・配線基板、4
・・・ホール、5・・・膨大形状部、7・・・突起部。
第1図 /1
.,5’ 2 2(164−第5図
/1
′“ 第6図 −
−第4図−
゛ 72d
−第7図Fig. 1 is a sectional view of the main parts of a conventional plug-in semiconductor package mounted on a wiring board, Fig. 2 is an enlarged perspective view of the main parts of the insulating casing shown in Fig. Figure 4 is a front view of the plug-in semiconductor package of the present invention viewed from the bottom of the insulating casing; Figure 5 is a perspective view of the main parts of the plug-in semiconductor package of the present invention when it is mounted on a wiring board. The cross-sectional view, and FIGS. 6 and 7 are enlarged perspective views of essential parts showing modified forms of the protrusion. -1... Insulating case, 2, 2a... Terminal pin, 3... Wiring board, 4
... Hole, 5... Huge shape part, 7... Protrusion part. Figure 1 /1. , 5' 2 2 (164-Fig. 5/1'" Fig. 6 - - Fig. 4- ゛ 72d - Fig. 7
Claims (1)
半導体パッケージにおいて、前記端子ピンのうち選択さ
れた端子ピンに、その取付方向を認識し得る突起部を形
成したことを特徴とするプラグイン型半導体パッケージ
。A plug-in type semiconductor package having a large number of terminal pins on the lower surface of an insulating casing, characterized in that a protrusion is formed on a selected one of the terminal pins so that the mounting direction thereof can be recognized. type semiconductor package.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16394182U JPS5970352U (en) | 1982-10-28 | 1982-10-28 | Plug-in semiconductor package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16394182U JPS5970352U (en) | 1982-10-28 | 1982-10-28 | Plug-in semiconductor package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5970352U true JPS5970352U (en) | 1984-05-12 |
JPS6334288Y2 JPS6334288Y2 (en) | 1988-09-12 |
Family
ID=30359557
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16394182U Granted JPS5970352U (en) | 1982-10-28 | 1982-10-28 | Plug-in semiconductor package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5970352U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62257755A (en) * | 1986-04-30 | 1987-11-10 | Ibiden Co Ltd | Substrate for loading semiconductor |
JPH0631156U (en) * | 1992-09-24 | 1994-04-22 | 京セラ株式会社 | Package for storing semiconductor devices |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842951U (en) * | 1981-09-18 | 1983-03-23 | 富士通株式会社 | semiconductor package |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842951B2 (en) * | 1979-02-13 | 1983-09-22 | 住友電気工業株式会社 | Terminal crimping method for aluminum conductor wire |
-
1982
- 1982-10-28 JP JP16394182U patent/JPS5970352U/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5842951U (en) * | 1981-09-18 | 1983-03-23 | 富士通株式会社 | semiconductor package |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62257755A (en) * | 1986-04-30 | 1987-11-10 | Ibiden Co Ltd | Substrate for loading semiconductor |
JPH0631156U (en) * | 1992-09-24 | 1994-04-22 | 京セラ株式会社 | Package for storing semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
JPS6334288Y2 (en) | 1988-09-12 |
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