JPS5970352U - Plug-in semiconductor package - Google Patents

Plug-in semiconductor package

Info

Publication number
JPS5970352U
JPS5970352U JP16394182U JP16394182U JPS5970352U JP S5970352 U JPS5970352 U JP S5970352U JP 16394182 U JP16394182 U JP 16394182U JP 16394182 U JP16394182 U JP 16394182U JP S5970352 U JPS5970352 U JP S5970352U
Authority
JP
Japan
Prior art keywords
semiconductor package
plug
type semiconductor
terminal pins
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16394182U
Other languages
Japanese (ja)
Other versions
JPS6334288Y2 (en
Inventor
小林 敏由紀
誠 嶋田
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Priority to JP16394182U priority Critical patent/JPS5970352U/en
Publication of JPS5970352U publication Critical patent/JPS5970352U/en
Application granted granted Critical
Publication of JPS6334288Y2 publication Critical patent/JPS6334288Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のプラグイン型半導体パッケージを配線基
板に実装したときの要部断面図、第2図は第1図絶縁筐
体の要部拡大斜視図、第3図は本考案実施例の要部斜視
図、第4図は本考案のプラグイン型半導体パッケージを
絶縁筐体の底部から見た正面図、第5図は本考案プラグ
イン型半導体パッケージを配線基板に実装したときの要
部断面図、そして、第6図及び第7図は突起部の変形態
様を示した要部拡大斜視図である。  −1・・・絶縁
筐体、2,2a・・・端子ピン、3・・・配線基板、4
・・・ホール、5・・・膨大形状部、7・・・突起部。 第1図    /1 .,5’      2   2(164−第5図 /1 ′“    第6図  − −第4図− ゛   72d −第7図
Fig. 1 is a sectional view of the main parts of a conventional plug-in semiconductor package mounted on a wiring board, Fig. 2 is an enlarged perspective view of the main parts of the insulating casing shown in Fig. Figure 4 is a front view of the plug-in semiconductor package of the present invention viewed from the bottom of the insulating casing; Figure 5 is a perspective view of the main parts of the plug-in semiconductor package of the present invention when it is mounted on a wiring board. The cross-sectional view, and FIGS. 6 and 7 are enlarged perspective views of essential parts showing modified forms of the protrusion. -1... Insulating case, 2, 2a... Terminal pin, 3... Wiring board, 4
... Hole, 5... Huge shape part, 7... Protrusion part. Figure 1 /1. , 5' 2 2 (164-Fig. 5/1'" Fig. 6 - - Fig. 4- ゛ 72d - Fig. 7

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 絶縁筐体の下面に多数の端子ピンを有するプラグイン型
半導体パッケージにおいて、前記端子ピンのうち選択さ
れた端子ピンに、その取付方向を認識し得る突起部を形
成したことを特徴とするプラグイン型半導体パッケージ
A plug-in type semiconductor package having a large number of terminal pins on the lower surface of an insulating casing, characterized in that a protrusion is formed on a selected one of the terminal pins so that the mounting direction thereof can be recognized. type semiconductor package.
JP16394182U 1982-10-28 1982-10-28 Plug-in semiconductor package Granted JPS5970352U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16394182U JPS5970352U (en) 1982-10-28 1982-10-28 Plug-in semiconductor package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16394182U JPS5970352U (en) 1982-10-28 1982-10-28 Plug-in semiconductor package

Publications (2)

Publication Number Publication Date
JPS5970352U true JPS5970352U (en) 1984-05-12
JPS6334288Y2 JPS6334288Y2 (en) 1988-09-12

Family

ID=30359557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16394182U Granted JPS5970352U (en) 1982-10-28 1982-10-28 Plug-in semiconductor package

Country Status (1)

Country Link
JP (1) JPS5970352U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257755A (en) * 1986-04-30 1987-11-10 Ibiden Co Ltd Substrate for loading semiconductor
JPH0631156U (en) * 1992-09-24 1994-04-22 京セラ株式会社 Package for storing semiconductor devices

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842951U (en) * 1981-09-18 1983-03-23 富士通株式会社 semiconductor package

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842951B2 (en) * 1979-02-13 1983-09-22 住友電気工業株式会社 Terminal crimping method for aluminum conductor wire

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5842951U (en) * 1981-09-18 1983-03-23 富士通株式会社 semiconductor package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62257755A (en) * 1986-04-30 1987-11-10 Ibiden Co Ltd Substrate for loading semiconductor
JPH0631156U (en) * 1992-09-24 1994-04-22 京セラ株式会社 Package for storing semiconductor devices

Also Published As

Publication number Publication date
JPS6334288Y2 (en) 1988-09-12

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