JPS5923746U - semiconductor package - Google Patents
semiconductor packageInfo
- Publication number
- JPS5923746U JPS5923746U JP11808882U JP11808882U JPS5923746U JP S5923746 U JPS5923746 U JP S5923746U JP 11808882 U JP11808882 U JP 11808882U JP 11808882 U JP11808882 U JP 11808882U JP S5923746 U JPS5923746 U JP S5923746U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- enlarged portion
- plug
- view
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプラグイン形半導体パッケージを配線基
板に実装したときの要部断面図、第２図は第１図絶縁筒
体の要部拡大斜視図、第３図は本考案実施例の要部拡大
斜視図、第４図は本考案のプラグイン形半導体パッケー
ジを配線基板に実装したときの要部断面図、第５図及び
第６図は膨大形状部の変形態様を示した要部拡大斜視図
である。
１・・・絶縁筐体、２・・・端子ピン、３・・・配線基
盤、４・・・スルーホール、５・・・膨大形状部、７・
・・絶縁性薄板。Fig. 1 is a cross-sectional view of the main parts of a conventional plug-in semiconductor package mounted on a wiring board, Fig. 2 is an enlarged perspective view of the main parts of the insulating cylinder shown in Fig. 1, and Fig. 3 is an embodiment of the present invention. FIG. 4 is an enlarged perspective view of the main part, FIG. 4 is a sectional view of the main part when the plug-in semiconductor package of the present invention is mounted on a wiring board, and FIGS. 5 and 6 are main parts showing the deformation of the enlarged part. It is an enlarged perspective view. DESCRIPTION OF SYMBOLS 1... Insulating housing, 2... Terminal pin, 3... Wiring board, 4... Through hole, 5... Enormous shape part, 7...
...Insulating thin plate.
Claims (1)
イン型乎導体パッケージにおいて、前記膨大形状部の下
面側に絶縁部材を固着したことを特撮とする半導体パッ
ケージ。What is claimed is a plug-in type conductor package in which at least one terminal bin is provided with an enlarged portion, and a special feature of the semiconductor package is that an insulating member is fixed to the lower surface of the enlarged portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11808882U JPS5923746U (en) | 1982-08-02 | 1982-08-02 | semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11808882U JPS5923746U (en) | 1982-08-02 | 1982-08-02 | semiconductor package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5923746U true JPS5923746U (en) | 1984-02-14 |
Family
ID=30271570
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11808882U Pending JPS5923746U (en) | 1982-08-02 | 1982-08-02 | semiconductor package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5923746U (en) |
-
1982
- 1982-08-02 JP JP11808882U patent/JPS5923746U/en active Pending
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