JPS5968959A - 電子回路形成方法 - Google Patents
電子回路形成方法Info
- Publication number
- JPS5968959A JPS5968959A JP17829982A JP17829982A JPS5968959A JP S5968959 A JPS5968959 A JP S5968959A JP 17829982 A JP17829982 A JP 17829982A JP 17829982 A JP17829982 A JP 17829982A JP S5968959 A JPS5968959 A JP S5968959A
- Authority
- JP
- Japan
- Prior art keywords
- vapor
- deposited
- circuit unit
- passive
- depositing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title description 4
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 239000003990 capacitor Substances 0.000 claims abstract description 8
- 238000000151 deposition Methods 0.000 claims abstract 4
- 238000010030 laminating Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 9
- 239000010408 film Substances 0.000 abstract description 8
- 229910000859 α-Fe Inorganic materials 0.000 abstract description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 abstract description 3
- 239000010409 thin film Substances 0.000 abstract description 3
- 238000003475 lamination Methods 0.000 abstract description 2
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 206010051602 Laziness Diseases 0.000 description 1
- 229910010280 TiOH Inorganic materials 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000000469 dry deposition Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17829982A JPS5968959A (ja) | 1982-10-13 | 1982-10-13 | 電子回路形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17829982A JPS5968959A (ja) | 1982-10-13 | 1982-10-13 | 電子回路形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5968959A true JPS5968959A (ja) | 1984-04-19 |
| JPH0228912B2 JPH0228912B2 (cs) | 1990-06-27 |
Family
ID=16046040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17829982A Granted JPS5968959A (ja) | 1982-10-13 | 1982-10-13 | 電子回路形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5968959A (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300593A (ja) * | 1987-05-29 | 1988-12-07 | Nec Corp | セラミック複合基板 |
| EP0789390A3 (en) * | 1989-01-14 | 1998-01-14 | TDK Corporation | A method for producing multilayer hybrid circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5365972A (en) * | 1976-11-24 | 1978-06-12 | Nippon Electric Co | Method of producing thin film cr circuit |
| JPS5431572A (en) * | 1977-08-15 | 1979-03-08 | Nippon Electric Co | Method of manufacturing thin film circuit |
-
1982
- 1982-10-13 JP JP17829982A patent/JPS5968959A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5365972A (en) * | 1976-11-24 | 1978-06-12 | Nippon Electric Co | Method of producing thin film cr circuit |
| JPS5431572A (en) * | 1977-08-15 | 1979-03-08 | Nippon Electric Co | Method of manufacturing thin film circuit |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63300593A (ja) * | 1987-05-29 | 1988-12-07 | Nec Corp | セラミック複合基板 |
| EP0789390A3 (en) * | 1989-01-14 | 1998-01-14 | TDK Corporation | A method for producing multilayer hybrid circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0228912B2 (cs) | 1990-06-27 |
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