JPS5956753U - integrated circuit package - Google Patents
integrated circuit packageInfo
- Publication number
- JPS5956753U JPS5956753U JP15226982U JP15226982U JPS5956753U JP S5956753 U JPS5956753 U JP S5956753U JP 15226982 U JP15226982 U JP 15226982U JP 15226982 U JP15226982 U JP 15226982U JP S5956753 U JPS5956753 U JP S5956753U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- printed wiring
- circuit package
- ceramic
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の第１の例を示す斜視図、第２図は第１図
に示す従来例の下面図、第３図は従来の第２の例を実装
した正面図、第４図は従来の第３の例を実装した正面図
、第５図は本考案の一実施例を示す斜視図、第６図は第
５図に示す実施例を実装した平面図である。FIG. 1 is a perspective view showing the first conventional example, FIG. 2 is a bottom view of the conventional example shown in FIG. 1, FIG. 3 is a front view of the second conventional example, and FIG. FIG. 5 is a perspective view showing an embodiment of the present invention, and FIG. 6 is a plan view of the embodiment shown in FIG. 5.
Claims (1)
ク基板に搭載され前記印刷配線で相互に接続された集積
回路チップと、外部と電気信号を授受するために前記印
刷配線に接続された信号接続ピンと、前記セラミック基
板の裏面に取り付けられ六角形の細管の集合体からなり
蜂の巣状をなすヒートシンクとを含むことを特徴とする
集積回路パッケージ。A ceramic substrate with printed wiring, integrated circuit chips mounted on the ceramic mink substrate and interconnected by the printed wiring, and signal connections connected to the printed wiring for transmitting and receiving electrical signals to and from the outside. An integrated circuit package comprising: a pin; and a honeycomb-shaped heat sink made of a collection of hexagonal thin tubes attached to the back surface of the ceramic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15226982U JPS5956753U (en) | 1982-10-07 | 1982-10-07 | integrated circuit package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15226982U JPS5956753U (en) | 1982-10-07 | 1982-10-07 | integrated circuit package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5956753U true JPS5956753U (en) | 1984-04-13 |
Family
ID=30337199
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15226982U Pending JPS5956753U (en) | 1982-10-07 | 1982-10-07 | integrated circuit package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5956753U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02260448A (en) * | 1989-03-30 | 1990-10-23 | Mitsubishi Electric Corp | Semiconductor device and radiating fin |
-
1982
- 1982-10-07 JP JP15226982U patent/JPS5956753U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02260448A (en) * | 1989-03-30 | 1990-10-23 | Mitsubishi Electric Corp | Semiconductor device and radiating fin |
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