JPS5956574A - チタン・シリサイド膜の形成方法 - Google Patents
チタン・シリサイド膜の形成方法Info
- Publication number
- JPS5956574A JPS5956574A JP16610582A JP16610582A JPS5956574A JP S5956574 A JPS5956574 A JP S5956574A JP 16610582 A JP16610582 A JP 16610582A JP 16610582 A JP16610582 A JP 16610582A JP S5956574 A JPS5956574 A JP S5956574A
- Authority
- JP
- Japan
- Prior art keywords
- gaseous
- gas
- titanium
- reaction
- titanium silicide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/42—Silicides
Landscapes
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16610582A JPS5956574A (ja) | 1982-09-24 | 1982-09-24 | チタン・シリサイド膜の形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16610582A JPS5956574A (ja) | 1982-09-24 | 1982-09-24 | チタン・シリサイド膜の形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5956574A true JPS5956574A (ja) | 1984-04-02 |
| JPH032950B2 JPH032950B2 (cg-RX-API-DMAC7.html) | 1991-01-17 |
Family
ID=15825102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16610582A Granted JPS5956574A (ja) | 1982-09-24 | 1982-09-24 | チタン・シリサイド膜の形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5956574A (cg-RX-API-DMAC7.html) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2554132A1 (fr) * | 1983-10-31 | 1985-05-03 | Advanced Semiconductor Mat | Procede de depot de siliciure metallique par depot de vapeur chimique, exalte par du plasma |
| FR2623014A1 (fr) * | 1987-11-09 | 1989-05-12 | France Etat | Procede de depot selectif d'un siliciure de metal refractaire sur des zones de silicium |
| US5167986A (en) * | 1988-04-15 | 1992-12-01 | Gordon Roy G | Titanium silicide-coated glass windows |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100126A (en) * | 1980-01-08 | 1981-08-11 | Konishiroku Photo Ind Co Ltd | Manufacture of amorphous silicon |
| JPS5767016A (en) * | 1980-10-09 | 1982-04-23 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of thin silicon film |
-
1982
- 1982-09-24 JP JP16610582A patent/JPS5956574A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56100126A (en) * | 1980-01-08 | 1981-08-11 | Konishiroku Photo Ind Co Ltd | Manufacture of amorphous silicon |
| JPS5767016A (en) * | 1980-10-09 | 1982-04-23 | Nippon Telegr & Teleph Corp <Ntt> | Manufacture of thin silicon film |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2554132A1 (fr) * | 1983-10-31 | 1985-05-03 | Advanced Semiconductor Mat | Procede de depot de siliciure metallique par depot de vapeur chimique, exalte par du plasma |
| JPS6096763A (ja) * | 1983-10-31 | 1985-05-30 | アドヴアンスト セミコンダクタ− マテイリアルズ アメリカ インコ−ポレ−テツド | プラズマ強化化学蒸着によるケイ化チタンを含む低抵抗率膜の製造方法 |
| FR2623014A1 (fr) * | 1987-11-09 | 1989-05-12 | France Etat | Procede de depot selectif d'un siliciure de metal refractaire sur des zones de silicium |
| US5167986A (en) * | 1988-04-15 | 1992-12-01 | Gordon Roy G | Titanium silicide-coated glass windows |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032950B2 (cg-RX-API-DMAC7.html) | 1991-01-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1238822A (en) | Method for the manufacture of metal silicide layers by means of reduced pressure gas phase deposition | |
| US5238866A (en) | Plasma enhanced chemical vapor deposition process for producing an amorphous semiconductive surface coating | |
| EP0076426B1 (en) | Multiple chamber deposition and isolation system and method | |
| US5173327A (en) | LPCVD process for depositing titanium films for semiconductor devices | |
| US4292343A (en) | Method of manufacturing semiconductor bodies composed of amorphous silicon | |
| US5653810A (en) | Apparatus for forming metal film and process for forming metal film | |
| JPS62156811A (ja) | 薄膜半導体素子及びその形成法 | |
| JPS5956574A (ja) | チタン・シリサイド膜の形成方法 | |
| JP2654790B2 (ja) | 気相成長法 | |
| JPS62156813A (ja) | 薄膜半導体素子及びその形成法 | |
| KR100249825B1 (ko) | 유기금속 화합물 전구체에 의한 구리박막의 화학증착 방법 | |
| JP2006128611A (ja) | 膜形成材料、膜形成方法、及び素子 | |
| JPH079059B2 (ja) | 炭素薄膜の製造方法 | |
| US7300890B1 (en) | Method and apparatus for forming conformal SiNx films | |
| JPS59207828A (ja) | シリコン薄膜の形成方法 | |
| JPH02110919A (ja) | 成膜装置 | |
| JPH0156142B2 (cg-RX-API-DMAC7.html) | ||
| JPH11260726A (ja) | 単結晶シリコン薄膜と多結晶シリコン薄膜の製造方法 | |
| KR980011792A (ko) | 화학기상증착(cvd)장치를 이용한 박막 형성방법 | |
| JPH04116155A (ja) | 薄膜の形成方法 | |
| JPS58101421A (ja) | 堆積膜の製造装置 | |
| JPS62163314A (ja) | 薄膜多層構造およびその形成方法 | |
| JPS59184519A (ja) | イオン化クラスタビーム発生方法 | |
| JP2006097099A (ja) | 膜形成材料、膜形成方法、及び素子 | |
| JPS6318856B2 (cg-RX-API-DMAC7.html) |