JPS5954949U - Heat dissipation structure of DIP type integrated circuit components - Google Patents
Heat dissipation structure of DIP type integrated circuit componentsInfo
- Publication number
- JPS5954949U JPS5954949U JP14797882U JP14797882U JPS5954949U JP S5954949 U JPS5954949 U JP S5954949U JP 14797882 U JP14797882 U JP 14797882U JP 14797882 U JP14797882 U JP 14797882U JP S5954949 U JPS5954949 U JP S5954949U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat dissipation
- type integrated
- heat sink
- dip type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のＤＩＰ型集積回路部品の放熱構造の一例
を示す斜視図、第２図はその部分断面図、第３図は本考
案の一実施例を示す斜視図、第４図はその部分断面図で
ある。
図において、１・・・印刷配線基板、２・・・ＤＩＰ型
集積回路部品、３・・・端子、４・・・座、５・・・ね
じ穴、６・・・放熱用ヒートシンク、７・・・ねじ、８
・・・ねじ挿通孔、９・・・係止具、１０・・・挿通孔
、１１・・・雌ねじ、９ａ・・・係止具９の先端部、９
ｂ・・・係止具９の底部。Fig. 1 is a perspective view showing an example of the heat dissipation structure of a conventional DIP type integrated circuit component, Fig. 2 is a partial sectional view thereof, Fig. 3 is a perspective view showing an embodiment of the present invention, and Fig. 4 is the same. FIG. In the figure, 1... printed wiring board, 2... DIP type integrated circuit component, 3... terminal, 4... seat, 5... screw hole, 6... heat sink for heat dissipation, 7... ...Screw, 8
...screw insertion hole, 9...locking tool, 10...insertion hole, 11...female thread, 9a...tip part of locking tool 9, 9
b... Bottom of the locking tool 9.
Claims (1)
ヒートシンクの両端部にねじ挿通孔を穿設し、上記放熱
用ヒートシンクに螺着されたときその先端部で前記ＤＩ
Ｐ型集積回路部品を前記放熱用ヒートシンクの方へ押圧
挾持する係止具を備えて、ＤＩＰ型集積回路部品を前記
放熱用ヒートシンクと前記係止具とで挾持し前記ねじ挿
通孔に挿通されたねじで前記係止具を螺着してなること
を特徴とするＤＩＰ型集積回路部品の放熱構造。Screw insertion holes are formed at both ends of a heat sink for heat dissipation that is placed in contact with the heat dissipation surface of the DIP type integrated circuit component, and when the heat sink is screwed onto the heat sink for heat dissipation, the tip of the heat sink is inserted into the DI.
A locking tool is provided to press and hold the P-type integrated circuit component toward the heat sink for heat dissipation, and the DIP integrated circuit component is held between the heat sink for heat radiation and the locking tool and inserted into the screw insertion hole. A heat dissipation structure for a DIP type integrated circuit component, characterized in that the locking tool is screwed on with a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14797882U JPS5954949U (en) | 1982-10-01 | 1982-10-01 | Heat dissipation structure of DIP type integrated circuit components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14797882U JPS5954949U (en) | 1982-10-01 | 1982-10-01 | Heat dissipation structure of DIP type integrated circuit components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5954949U true JPS5954949U (en) | 1984-04-10 |
| JPS6244539Y2 JPS6244539Y2 (en) | 1987-11-25 |
Family
ID=30328918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14797882U Granted JPS5954949U (en) | 1982-10-01 | 1982-10-01 | Heat dissipation structure of DIP type integrated circuit components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5954949U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115057U (en) * | 1979-02-08 | 1980-08-13 | ||
| JPS56112945U (en) * | 1980-01-31 | 1981-08-31 |
-
1982
- 1982-10-01 JP JP14797882U patent/JPS5954949U/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115057U (en) * | 1979-02-08 | 1980-08-13 | ||
| JPS56112945U (en) * | 1980-01-31 | 1981-08-31 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6244539Y2 (en) | 1987-11-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS5954949U (en) | Heat dissipation structure of DIP type integrated circuit components | |
| JPS58128589U (en) | Sockets for integrated circuit components | |
| JPS60113667U (en) | Structure of electronic components for printed wiring | |
| JPS58122461U (en) | Mounting board | |
| JPS5937742U (en) | Heat dissipation structure | |
| JPS5879881U (en) | Connector for printed circuit board mounting | |
| JPS587380U (en) | Electronic component inserting device | |
| JPS6052629U (en) | Hybrid integrated circuit device | |
| JPS58159184U (en) | Printed wiring board terminal connection structure | |
| JPS58111945U (en) | semiconductor equipment | |
| JPS58106999U (en) | shield case | |
| JPS60185344U (en) | semiconductor equipment | |
| JPS5832657U (en) | semiconductor equipment | |
| JPS5972706U (en) | Positioning structure of chip parts and board | |
| JPS59159954U (en) | Heat dissipation device for printed circuit boards | |
| JPS5911450U (en) | Mounting board for integrated circuit elements | |
| JPS6085866U (en) | Printed board | |
| JPS5944051U (en) | semiconductor equipment | |
| JPH01153697U (en) | ||
| JPS60179087U (en) | Semiconductor device holder structure | |
| JPS606267U (en) | connection device | |
| JPS5987167U (en) | printed circuit board equipment | |
| JPS614490U (en) | Heat sink for electronic components | |
| JPS5834743U (en) | Power diode mounting structure | |
| JPS6039295U (en) | printed wiring board |