JPS5987167U - printed circuit board equipment - Google Patents
printed circuit board equipmentInfo
- Publication number
- JPS5987167U JPS5987167U JP18148982U JP18148982U JPS5987167U JP S5987167 U JPS5987167 U JP S5987167U JP 18148982 U JP18148982 U JP 18148982U JP 18148982 U JP18148982 U JP 18148982U JP S5987167 U JPS5987167 U JP S5987167U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- board equipment
- printed
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の分解斜視図、第2図ははんだ付は時の第
1図A部の断面図である。第3図と第4図は本案一実施
例の第1図と第2図の相当図である。
11はプリント基板、17a、17b・・・は透孔、1
“0ハ部品、16は底部、23a、23b−・・は印刷
部、22a、22b・・・は凹溝を示す。FIG. 1 is an exploded perspective view of a conventional device, and FIG. 2 is a sectional view of part A in FIG. 1 during soldering. FIGS. 3 and 4 are equivalent views of FIGS. 1 and 2 of the embodiment of the present invention. 11 is a printed circuit board, 17a, 17b... are through holes, 1
0 parts, 16 is the bottom, 23a, 23b, . . . are printed portions, 22a, 22b, . . . are grooves.
Claims (1)
プリント基板の表面に密着する下面を有する部品を、該
部品のリード端子を前記プリント基板の表面から前記透
孔に挿通し、かつ前記プリント基板の裏面に設けたプリ
ント箔にはんだ付けすると共に、前記プリント基板の表
面に、前記透孔に連なり、かつ前記部品の下面密着部の
外方まで延びた凹溝を形成する印刷部を設けて成るプリ
ント基板装置。A through hole for inserting a lead terminal is formed in a printed circuit board, and a component having a lower surface that is in close contact with the surface of the printed circuit board is inserted into the through hole from the surface of the printed circuit board, and the A printed portion is soldered to the printed foil provided on the back surface of the printed circuit board, and a printed portion is provided on the surface of the printed circuit board to form a groove that is connected to the through hole and extends to the outside of the lower surface contact portion of the component. Printed circuit board equipment consisting of
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18148982U JPS5987167U (en) | 1982-11-30 | 1982-11-30 | printed circuit board equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18148982U JPS5987167U (en) | 1982-11-30 | 1982-11-30 | printed circuit board equipment |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5987167U true JPS5987167U (en) | 1984-06-13 |
Family
ID=30393259
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18148982U Pending JPS5987167U (en) | 1982-11-30 | 1982-11-30 | printed circuit board equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5987167U (en) |
-
1982
- 1982-11-30 JP JP18148982U patent/JPS5987167U/en active Pending
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