JPS58175862U - Soldering object for solder balls - Google Patents
Soldering object for solder ballsInfo
- Publication number
- JPS58175862U JPS58175862U JP7064582U JP7064582U JPS58175862U JP S58175862 U JPS58175862 U JP S58175862U JP 7064582 U JP7064582 U JP 7064582U JP 7064582 U JP7064582 U JP 7064582U JP S58175862 U JPS58175862 U JP S58175862U
- Authority
- JP
- Japan
- Prior art keywords
- solder balls
- soldering object
- soldering
- solder ball
- soldered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の一実施例の被はんだ付は体にはんだ付
けを行うときの説明図、第２図はそのはんだボールをセ
ットしたときの断面図、第３図は他の実施例の被はんだ
付は体の斜視図である。 ”図中、１は回路基板
、２は回路基板本体、３は銅箔部、４．４“は凹部、５
ははんだボール、６は端子、７は透孔である。Fig. 1 is an explanatory diagram of one embodiment of the present invention when soldering is performed on the body, Fig. 2 is a sectional view when the solder ball is set, and Fig. 3 is an illustration of another embodiment of the present invention. The object to be soldered is a perspective view of the body. In the figure, 1 is the circuit board, 2 is the circuit board body, 3 is the copper foil part, 4.4 is the recessed part, 5
1 is a solder ball, 6 is a terminal, and 7 is a through hole.
Claims (1)
れる被はんだ付は体において、上記はんだ付は部に位置
ずれを防止する凹部を設けたことを特徴とするはんだボ
ール川波はんだ付は体。The solder ball Kawanami soldering body is characterized in that the soldering part is supplied with a solder ball to be soldered, and the soldering part is provided with a recessed part to prevent misalignment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7064582U JPS58175862U (en) | 1982-05-17 | 1982-05-17 | Soldering object for solder balls |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7064582U JPS58175862U (en) | 1982-05-17 | 1982-05-17 | Soldering object for solder balls |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58175862U true JPS58175862U (en) | 1983-11-24 |
Family
ID=30080303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7064582U Pending JPS58175862U (en) | 1982-05-17 | 1982-05-17 | Soldering object for solder balls |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175862U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979943A (en) * | 1972-08-04 | 1974-08-01 | ||
| JPS5914294A (en) * | 1982-07-15 | 1984-01-25 | 松下電器産業株式会社 | High frequency heater |
-
1982
- 1982-05-17 JP JP7064582U patent/JPS58175862U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4979943A (en) * | 1972-08-04 | 1974-08-01 | ||
| JPS5914294A (en) * | 1982-07-15 | 1984-01-25 | 松下電器産業株式会社 | High frequency heater |
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