JPS5954290A - 印刷回路板 - Google Patents

印刷回路板

Info

Publication number
JPS5954290A
JPS5954290A JP58151476A JP15147683A JPS5954290A JP S5954290 A JPS5954290 A JP S5954290A JP 58151476 A JP58151476 A JP 58151476A JP 15147683 A JP15147683 A JP 15147683A JP S5954290 A JPS5954290 A JP S5954290A
Authority
JP
Japan
Prior art keywords
poly
printed circuit
circuit board
arylene sulfide
conductive metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58151476A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0326549B2 (enExample
Inventor
ハロルド・デニ−・ボウルテイングハウス
ポ−ル・ジヨン・ボ−ケ
ロバ−ト・エドワ−ド・ベネフイ−ルド・ジユニア
ジヨン・エバラ−ド・レランド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phillips Petroleum Co
Original Assignee
Phillips Petroleum Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=23621990&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS5954290(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Phillips Petroleum Co filed Critical Phillips Petroleum Co
Publication of JPS5954290A publication Critical patent/JPS5954290A/ja
Publication of JPH0326549B2 publication Critical patent/JPH0326549B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/12—Chemical modification
    • C08J7/14—Chemical modification with acids, their salts or anhydrides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/22—Roughening, e.g. by etching
    • C23C18/24—Roughening, e.g. by etching using acid aqueous solutions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0333—Organic insulating material consisting of one material containing S
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2381/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen, or carbon only; Polysulfones; Derivatives of such polymers
    • C08J2381/02—Polythioethers; Polythioether-ethers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/917—Treatment of workpiece between coating steps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/92—Electrolytic coating of circuit board or printed circuit, other than selected area coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S205/00—Electrolysis: processes, compositions used therein, and methods of preparing the compositions
    • Y10S205/924—Electrolytic coating substrate predominantly comprised of specified synthetic resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Burglar Alarm Systems (AREA)
JP58151476A 1982-08-20 1983-08-19 印刷回路板 Granted JPS5954290A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/409,792 US4532015A (en) 1982-08-20 1982-08-20 Poly(arylene sulfide) printed circuit boards
US409792 1982-08-20

Publications (2)

Publication Number Publication Date
JPS5954290A true JPS5954290A (ja) 1984-03-29
JPH0326549B2 JPH0326549B2 (enExample) 1991-04-11

Family

ID=23621990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58151476A Granted JPS5954290A (ja) 1982-08-20 1983-08-19 印刷回路板

Country Status (9)

Country Link
US (1) US4532015A (enExample)
EP (1) EP0103149B1 (enExample)
JP (1) JPS5954290A (enExample)
KR (1) KR910000077B1 (enExample)
AT (1) ATE33436T1 (enExample)
CA (1) CA1232864A (enExample)
DE (1) DE3376245D1 (enExample)
ES (1) ES8405577A1 (enExample)
SG (1) SG59588G (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257395A (ja) * 1988-04-07 1989-10-13 Hokuriku Electric Ind Co Ltd 印刷回路基板の製造方法
US5134190A (en) * 1989-02-22 1992-07-28 Idemitsu Petrochemical Company Limited Polyarylene sulfide resin compositions and molded articles
US5200271A (en) * 1989-02-22 1993-04-06 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin compositions and molded articles

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4615907A (en) * 1984-11-23 1986-10-07 Phillips Petroleum Company Plating poly(arylene sulfide) surfaces
US4803097A (en) * 1987-04-20 1989-02-07 Allied-Signal Inc. Metal plating of plastic materials
DE3731167A1 (de) * 1987-09-14 1989-05-11 Schering Ag Verfahren zur haftfesten metallisierung von emails
DE3901029A1 (de) * 1989-01-14 1990-07-19 Bayer Ag Verfahren zum metallisieren von formkoerpern aus polyarylensulfiden
US5230927A (en) * 1989-02-16 1993-07-27 Mitsubishi Gas Chemical Company, Inc. Method for metal-plating resin molded articles and metal-plated resin molded articles
US5300208A (en) * 1989-08-14 1994-04-05 International Business Machines Corporation Fabrication of printed circuit boards using conducting polymer
DE3931649A1 (de) * 1989-09-22 1991-04-04 Basf Ag Thermoplastische formmassen aus faserverstaerkten hochtemperaturbestaendigen thermoplasten
US5211803A (en) * 1989-10-02 1993-05-18 Phillips Petroleum Company Producing metal patterns on a plastic surface
JPH03197687A (ja) * 1989-12-26 1991-08-29 Mitsubishi Gas Chem Co Inc 樹脂成形品の金属メッキ前処理方法
DE4008462A1 (de) * 1990-03-16 1991-09-19 Bayer Ag Polyarylensulfid-leiterplatten mit guter metallhaftung
JPH05170956A (ja) * 1991-06-14 1993-07-09 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
JPH0525298A (ja) * 1991-06-19 1993-02-02 Kureha Chem Ind Co Ltd 樹脂成形品の金属化に好適な粗面化方法
US5509557A (en) * 1994-01-24 1996-04-23 International Business Machines Corporation Depositing a conductive metal onto a substrate
US5591354A (en) * 1994-10-21 1997-01-07 Jp Laboratories, Inc. Etching plastics with nitrosyls
DE19620935A1 (de) * 1996-05-24 1997-11-27 Daimler Benz Ag Verfahren zur haftfesten Beschichtung von Polymeren
WO2002004705A1 (fr) * 1999-01-20 2002-01-17 National Institute Of Advanced Industrial Science And Technology Procede de traitement preliminaire d'un materiau devant etre soumis a un depot autocatalytique
US8263196B2 (en) * 2003-09-25 2012-09-11 Hewlett-Packard Development Company, L.P. Protection of printed images from gasfade
US20060204780A1 (en) * 2005-03-14 2006-09-14 Vega Luis F Development of low gloss coated surfaces on vehicle wheels
CN108695585B (zh) 2017-04-12 2021-03-16 日本电产株式会社 高频构件的制造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052943A (ja) * 1983-09-02 1985-03-26 Victor Co Of Japan Ltd ドロツプアウト持続検出装置
JPS6153880A (ja) * 1984-08-23 1986-03-17 Fujitsu Ltd 文字画像表示制御装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3354129A (en) 1963-11-27 1967-11-21 Phillips Petroleum Co Production of polymers from aromatic compounds
US3567594A (en) * 1969-03-17 1971-03-02 Phillips Petroleum Co Electroplating plastics
US3770571A (en) * 1969-04-02 1973-11-06 Richardson Co Fabrication of printed circuit boards
GB1463304A (en) * 1973-09-25 1977-02-02 Canning & Co Ltd W Treatment of the surfaces of synthetic polymeric materials for electroless metal deposition
DE2424702A1 (de) * 1974-05-21 1975-12-11 Standard Elektrik Lorenz Ag Verfahren zur herstellung von traegerplatten fuer duenn- und dickschichtschaltungen
FR2427350B1 (fr) * 1978-05-30 1986-08-14 Asahi Glass Co Ltd Poly(sulfure de phenylene) moulable
DE2930710A1 (de) * 1979-07-28 1981-02-19 Bayer Ag Verfahren zur herstellung von polyarylensulfiden
US4447471A (en) * 1982-12-30 1984-05-08 Gould Inc. Method of treating thermoplastic surfaces

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6052943A (ja) * 1983-09-02 1985-03-26 Victor Co Of Japan Ltd ドロツプアウト持続検出装置
JPS6153880A (ja) * 1984-08-23 1986-03-17 Fujitsu Ltd 文字画像表示制御装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01257395A (ja) * 1988-04-07 1989-10-13 Hokuriku Electric Ind Co Ltd 印刷回路基板の製造方法
US5134190A (en) * 1989-02-22 1992-07-28 Idemitsu Petrochemical Company Limited Polyarylene sulfide resin compositions and molded articles
US5200271A (en) * 1989-02-22 1993-04-06 Idemitsu Petrochemical Co., Ltd. Polyarylene sulfide resin compositions and molded articles

Also Published As

Publication number Publication date
JPH0326549B2 (enExample) 1991-04-11
US4532015A (en) 1985-07-30
CA1232864A (en) 1988-02-16
ES525046A0 (es) 1984-06-01
KR910000077B1 (ko) 1991-01-19
EP0103149B1 (en) 1988-04-06
ATE33436T1 (de) 1988-04-15
ES8405577A1 (es) 1984-06-01
SG59588G (en) 1989-03-10
KR840006119A (ko) 1984-11-21
DE3376245D1 (en) 1988-05-11
EP0103149A1 (en) 1984-03-21

Similar Documents

Publication Publication Date Title
JPS5954290A (ja) 印刷回路板
US4615907A (en) Plating poly(arylene sulfide) surfaces
JP4528634B2 (ja) 金属膜の形成方法
US4647315A (en) Copper stainproofing technique
FR2606580A1 (fr) Procede pour produire des plaques a circuit ayant des dessins metalliques deposes, et plaques a circuit ainsi produites
JPS63500133A (ja) 配線基板材料
JPH05235542A (ja) 印刷回路用銅箔及びその製造方法
JPH03119701A (ja) 抵抗層付導電材料及び抵抗層付プリント回路基板
JPH05504167A (ja) 誘電体基板を直接電気メッキする方法で製造されたメッキ基板
JPS601890A (ja) プリント回路製造のアデイテイブ法
JPH01195280A (ja) 付着強固に化学的金属化するためのプラスチックの前処理方法、およびそれにより製造されたプリント配線板
JP2002322586A (ja) ファインパターン用電解銅箔とその製造方法
TW201250015A (en) Two-layered copper-clad laminate material, and method for producing same
JPS63103075A (ja) マイクロ樹枝状体配列を介して結合された金属層で被覆可能とされる表面を有する樹脂製品並びに該金属層被覆樹脂製品
JPS6015654B2 (ja) 銅箔のクロメ−ト処理層と樹脂基材との接着方法
CN100512595C (zh) 用于印刷电路板的铜箔
EP0283771A1 (de) Verfahren zur haftfesten Metallisierung von Kunststoffen
TWI277377B (en) Method for manufacturing an electrodeposited copper foil with a high-temperature resistant carrier and an electrodeposited copper foil with a high-temperature resistant carrier obtained through the method
JPH0235033B2 (enExample)
Abu-Isa Metal plating of polymeric surfaces
JPH05507767A (ja) 耐変色処理後の銅箔の洗浄
JPS63500249A (ja) 金属めっき前にプラスチック支持体の表面をコンディショニングする方法
DE1696108C3 (de) Verfahren zur Herstellung eines mit Kupfer, Nickel und/oder Silber plattierten nichtmetallischen Schichtträgers
JPS5856383A (ja) 印刷配線板の製造法
JP2007077475A (ja) 金属ガラス部品の表面処理方法と該方法で表面処理された金属ガラス部品