JPS5952566A - 粘性物質の塗出方法 - Google Patents

粘性物質の塗出方法

Info

Publication number
JPS5952566A
JPS5952566A JP57163004A JP16300482A JPS5952566A JP S5952566 A JPS5952566 A JP S5952566A JP 57163004 A JP57163004 A JP 57163004A JP 16300482 A JP16300482 A JP 16300482A JP S5952566 A JPS5952566 A JP S5952566A
Authority
JP
Japan
Prior art keywords
viscous substance
pins
viscous
coated
engraved plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57163004A
Other languages
English (en)
Japanese (ja)
Other versions
JPH033542B2 (enrdf_load_stackoverflow
Inventor
Takeshi Mori
健 森
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP57163004A priority Critical patent/JPS5952566A/ja
Publication of JPS5952566A publication Critical patent/JPS5952566A/ja
Publication of JPH033542B2 publication Critical patent/JPH033542B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Application Of Or Painting With Fluid Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP57163004A 1982-09-18 1982-09-18 粘性物質の塗出方法 Granted JPS5952566A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57163004A JPS5952566A (ja) 1982-09-18 1982-09-18 粘性物質の塗出方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57163004A JPS5952566A (ja) 1982-09-18 1982-09-18 粘性物質の塗出方法

Publications (2)

Publication Number Publication Date
JPS5952566A true JPS5952566A (ja) 1984-03-27
JPH033542B2 JPH033542B2 (enrdf_load_stackoverflow) 1991-01-18

Family

ID=15765361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57163004A Granted JPS5952566A (ja) 1982-09-18 1982-09-18 粘性物質の塗出方法

Country Status (1)

Country Link
JP (1) JPS5952566A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223193A (ja) * 1984-03-06 1985-11-07 ノ−ザン・テレコム・リミテツド 回路板にはんだペ−ストを塗布するための装置及び方法
EP1328009A3 (de) * 2002-01-15 2005-08-03 Robert Bosch Gmbh Vorrichtung zum Aufbringen eines Mediums auf einem Substrat
CN110899892A (zh) * 2019-12-16 2020-03-24 王强 一种组装电路板的电器元件引脚定位焊接一体机

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60223193A (ja) * 1984-03-06 1985-11-07 ノ−ザン・テレコム・リミテツド 回路板にはんだペ−ストを塗布するための装置及び方法
EP1328009A3 (de) * 2002-01-15 2005-08-03 Robert Bosch Gmbh Vorrichtung zum Aufbringen eines Mediums auf einem Substrat
CN110899892A (zh) * 2019-12-16 2020-03-24 王强 一种组装电路板的电器元件引脚定位焊接一体机

Also Published As

Publication number Publication date
JPH033542B2 (enrdf_load_stackoverflow) 1991-01-18

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