JPS5951535A - パタ−ン認識方法及びその装置 - Google Patents
パタ−ン認識方法及びその装置Info
- Publication number
- JPS5951535A JPS5951535A JP57160113A JP16011382A JPS5951535A JP S5951535 A JPS5951535 A JP S5951535A JP 57160113 A JP57160113 A JP 57160113A JP 16011382 A JP16011382 A JP 16011382A JP S5951535 A JPS5951535 A JP S5951535A
- Authority
- JP
- Japan
- Prior art keywords
- pattern data
- pattern
- area
- small area
- image memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Image Processing (AREA)
- Wire Bonding (AREA)
- Image Analysis (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57160113A JPS5951535A (ja) | 1982-09-14 | 1982-09-14 | パタ−ン認識方法及びその装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57160113A JPS5951535A (ja) | 1982-09-14 | 1982-09-14 | パタ−ン認識方法及びその装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5951535A true JPS5951535A (ja) | 1984-03-26 |
| JPH0142499B2 JPH0142499B2 (enrdf_load_stackoverflow) | 1989-09-13 |
Family
ID=15708134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57160113A Granted JPS5951535A (ja) | 1982-09-14 | 1982-09-14 | パタ−ン認識方法及びその装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5951535A (enrdf_load_stackoverflow) |
-
1982
- 1982-09-14 JP JP57160113A patent/JPS5951535A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0142499B2 (enrdf_load_stackoverflow) | 1989-09-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4450579A (en) | Recognition method and apparatus | |
| JPS5951535A (ja) | パタ−ン認識方法及びその装置 | |
| JPH0410112B2 (enrdf_load_stackoverflow) | ||
| JPS60189951A (ja) | 方形体のエツジ検出方法 | |
| JPH0131693B2 (enrdf_load_stackoverflow) | ||
| JP3169046B2 (ja) | チップの認識方法及びその認識装置 | |
| JPS58217085A (ja) | パタ−ン認識方式 | |
| JPS60254743A (ja) | 半導体チツプの位置検出方法 | |
| JPH04315905A (ja) | 物体検査装置 | |
| JP3300264B2 (ja) | 半導体チップ認識方法 | |
| JPS6146053B2 (enrdf_load_stackoverflow) | ||
| JP3278555B2 (ja) | ボンディングワイヤの認識方法 | |
| JPH0576185B2 (enrdf_load_stackoverflow) | ||
| JPH04340740A (ja) | 重欠点異物自動検査装置及び検査方法 | |
| JPS5867033A (ja) | ワイヤボンデイング方法 | |
| JPS61294831A (ja) | ウエハチツプの検出方法 | |
| JPH04250347A (ja) | ボンディングワイヤ検査装置 | |
| JPH0524667B2 (enrdf_load_stackoverflow) | ||
| JPS5930175A (ja) | パタ−ン認識装置 | |
| JPS63298142A (ja) | 混成集積回路用半田付検査装置 | |
| JPS61193053A (ja) | 画像処理による検査の方法 | |
| JPS5927095B2 (ja) | フルオ−トワイヤボンディングのパタ−ン検出方法 | |
| JPS5823448A (ja) | ペレツト位置決め認識方式 | |
| JPH05327298A (ja) | 電子部品搭載装置 | |
| JPS5957389A (ja) | パタ−ン認識装置 |