JPS5947461B2 - lead frame - Google Patents
lead frameInfo
- Publication number
- JPS5947461B2 JPS5947461B2 JP15652676A JP15652676A JPS5947461B2 JP S5947461 B2 JPS5947461 B2 JP S5947461B2 JP 15652676 A JP15652676 A JP 15652676A JP 15652676 A JP15652676 A JP 15652676A JP S5947461 B2 JPS5947461 B2 JP S5947461B2
- Authority
- JP
- Japan
- Prior art keywords
- tab
- lead frame
- pellet
- lead
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】
レジンモールド型のトランジスタ、ＩＣ等においては、
リードフレームに一体となつた正方形あるいは長方形又
はそれと類似した形のタブに半導体ペレットを載置して
固着し、次にタブの周辺に近接して設けられた複数のリ
ード部分と、ペレットの電極との間をワイヤボンディン
グ法によりリード線で電気的に接続する。[Detailed Description of the Invention] In resin molded transistors, ICs, etc.,
A semiconductor pellet is placed and fixed on a square, rectangular, or similar shaped tab integrated into a lead frame, and then a plurality of lead portions provided close to the periphery of the tab and electrodes of the pellet are connected to each other. A lead wire is used to electrically connect between them using a wire bonding method.
トランジスタの如＜、エミッタベースのリード線の場合
では簡単であるが、ＩＣ等の様に多数の電極を持つペレ
ットではワイヤーボンディング作業は高度な操業性が要
求される。一般に、リードフレームにおけるタブ寸法と
ペレット寸法は略一致しているのが好ましい。Although it is simple in the case of an emitter-based lead wire such as a transistor, wire bonding requires a high degree of operability in the case of a pellet having a large number of electrodes such as an IC. Generally, it is preferable that the tab dimensions in the lead frame and the pellet dimensions substantially match.
しかし、現実には両者を一致させるのが困難である。通
常リードフレームのタブは、作業性等の点から標準化さ
れ数種のタブしか作られていない。現在の半導体ペレッ
トはその機能によつて寸法は各種形成され一定となつて
いない。従つて現在存するタブに合うペレットもあれば
時にはタブからはみ出すペレットもタブより小さいペレ
ットがありうることになる。タブからはみ出した大きな
ペレットの場合、そのペレットをタブに固着後ワイヤー
ボンディングする作業時にボンディングの機械力のため
にペレットにクラックが生じ、高価なペレットに損傷を
与える事故が時々起つていた。However, in reality, it is difficult to match the two. Normally, lead frame tabs are standardized for reasons such as workability, and only a few types of tabs are made. Current semiconductor pellets have various sizes depending on their functions and are not constant. Therefore, there may be pellets that fit into the currently existing tabs, and sometimes pellets that protrude from the tabs or pellets that are smaller than the tabs. In the case of large pellets protruding from the tab, when the pellet is fixed to the tab and then wire bonded, the mechanical force of the bonding causes cracks in the pellet, sometimes resulting in damage to the expensive pellet.
また、タブより小さなペレットの場合には、ボンディン
グワイヤとタブとが接触して、しばしば短絡事故が生じ
ていた。本発明の目的はこれらの従来技術の問題点を解
決し、タブとペレットが多少寸法が合わな〈てもワイヤ
ーボンディングの際のペレットクラック及びタブ−ワイ
ヤ間短絡事故を軽減しうる改良されたリードフレームを
提供することである。Further, in the case of pellets smaller than the tab, the bonding wire and the tab often come into contact, resulting in short circuit accidents. The purpose of the present invention is to solve these problems in the prior art, and to provide an improved lead that can reduce pellet cracks and short-circuit accidents between tabs and wires during wire bonding even if the dimensions of the tab and pellet do not match. It is to provide a frame.
本発明の一実施例は、リードフレームに一体となつた正
方形あるいは長方形又はそれと類似した形のタブの周辺
に放射状に突出する複数の突起部を設けたことにある。In one embodiment of the present invention, a plurality of protrusions projecting radially around a square, rectangular, or similar tab integrally formed on the lead frame is provided.
このようにすると、タブの突起部ではみ出したペレット
の部分を支え、ワイヤーボンディング時にペレットに機
械力が加わつてもクラックが入らない様にすることがで
きる。In this way, the protruding portion of the pellet can be supported by the protrusion of the tab, and can be prevented from cracking even if mechanical force is applied to the pellet during wire bonding.
突起部は各辺に１つのみならず複数設けることができる
。突起部と突起部との間にリードフレームのリード部分
を配置すると、ペレットがタブより小さい場合にボンデ
ィングワイヤがタブに接触するのを防止できる。以下本
発明の一実施例を図によつて説明する。１はリードフレ
ームの主リード部分でその先端部に所望のタブ２が設け
られている。Not only one protrusion but also a plurality of protrusions can be provided on each side. Placing the lead portion of the lead frame between the protrusions prevents the bonding wire from contacting the tabs if the pellet is smaller than the tabs. An embodiment of the present invention will be described below with reference to the drawings. 1 is the main lead portion of the lead frame, and a desired tab 2 is provided at the tip thereof.
このタブ２の周辺に本発明に係わる突起部３が複数放射
状に突出するように形成されている。タブ２の周辺には
これに接近してリードフレームのリード部分４〜９が特
に突起部３の間に位置する様に配置されている。今、半
導体ペレツトの寸法がタブ寸法より大きく点線１０で示
す如くタブ２からはみ出しているものとすると半導体ペ
レツトのはみ出し部は突起３によつて強固に保持される
ので、ペレツト周辺に存する電極にワイャーボンデイン
グを施こしてもペレツトにクラツタの入る心配はない。A plurality of protrusions 3 according to the present invention are formed around this tab 2 so as to protrude radially. Lead parts 4 to 9 of the lead frame are arranged around and close to the tab 2 in such a way that they are located in particular between the protrusions 3. Now, assuming that the size of the semiconductor pellet is larger than the tab size and protrudes from the tab 2 as shown by the dotted line 10, the protruding portion of the semiconductor pellet is firmly held by the protrusion 3, so that the electrode existing around the pellet is not exposed to the wire. Even if you apply earbonding, there is no need to worry about clutter getting into the pellets.
また、これと反対にペレツトがタブ２におけるほぼ正方
形の部分と同じくらいに小さい場合には、突起部３の間
でその上方にボンデイングワイャがはりわたされるので
タプ２がボンデングワイャに接触する機会は殆んどなく
なり、メブーワイヤ間短絡事故は大幅に減少する。本発
明によるリードフレームは、上述したように、ペレツト
の多少の寸法変化に容易に対処することができ、利用性
の高いリードフレームである。On the other hand, if the pellet is as small as the approximately square portion of the tab 2, the bonding wire is stretched between the protrusions 3 and above, so there is no chance that the tab 2 will come into contact with the bonding wire. This almost eliminates the possibility of short-circuit accidents between meboo wires. As described above, the lead frame according to the present invention is a highly usable lead frame that can easily cope with slight dimensional changes in pellets.
図は本発明の説明図である。
符号の説明、１，４〜９・・・・・・リードフレームの
リード部分、２・・・・・・タブ、３・・・・・・突起
部。The figure is an explanatory diagram of the present invention. Explanation of symbols: 1, 4 to 9...Lead portion of lead frame, 2...Tab, 3...Protrusion.
Claims (1)
形又はそれと類似した形のタブの周辺に突起部を設けた
ことを特徴とするリードフレーム。1. A lead frame characterized in that a protrusion is provided around a square, rectangular, or similar tab that is integrated into the lead frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15652676A JPS5947461B2 (en) | 1976-12-27 | 1976-12-27 | lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15652676A JPS5947461B2 (en) | 1976-12-27 | 1976-12-27 | lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS53124068A JPS53124068A (en) | 1978-10-30 |
| JPS5947461B2 true JPS5947461B2 (en) | 1984-11-19 |
Family
ID=15629708
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15652676A Expired JPS5947461B2 (en) | 1976-12-27 | 1976-12-27 | lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5947461B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS634665U (en) * | 1986-06-26 | 1988-01-13 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5479563A (en) * | 1977-12-07 | 1979-06-25 | Kyushu Nippon Electric | Lead frame for semiconductor |
| JPH0447966Y2 (en) * | 1986-10-28 | 1992-11-12 | ||
| JPH01102945A (en) * | 1987-10-15 | 1989-04-20 | Nec Kyushu Ltd | Lead frame for semiconductor device and manufacture thereof |
| WO1995024732A1 (en) * | 1994-03-09 | 1995-09-14 | National Semiconductor Corporation | A molded lead frame and method of making same |
-
1976
- 1976-12-27 JP JP15652676A patent/JPS5947461B2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS634665U (en) * | 1986-06-26 | 1988-01-13 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS53124068A (en) | 1978-10-30 |
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