JPS5946096A - フラットパッケ−ジ形電子部品のはんだ付け装置 - Google Patents

Info

Publication number

JPS5946096A

JPS5946096A JP57156157A JP15615782A JPS5946096A JP S5946096 A JPS5946096 A JP S5946096A JP 57156157 A JP57156157 A JP 57156157A JP 15615782 A JP15615782 A JP 15615782A JP S5946096 A JPS5946096 A JP S5946096A

Authority

JP

Japan

Prior art keywords

flat package

wiring board

printed wiring

pattern

electronic component

Prior art date

1982-09-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Granted

Links

• Espacenet
• Global Dossier
• Discuss

• 238000005476 soldering Methods 0.000 title description 11
• 229910000679 solder Inorganic materials 0.000 claims description 10
• 230000032258 transport Effects 0.000 claims 2
• XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
• 230000000694 effects Effects 0.000 description 2
• 230000017525 heat dissipation Effects 0.000 description 2
• 239000000463 material Substances 0.000 description 2
• 238000000034 method Methods 0.000 description 2
• LHASLBSEALHFGO-ASZAQJJISA-N 1-[(4s,5r)-4-hydroxy-5-(hydroxymethyl)oxolan-2-yl]-5-[[(2r,3r,4s,5s,6r)-3,4,5-trihydroxy-6-(hydroxymethyl)oxan-2-yl]oxymethyl]pyrimidine-2,4-dione Chemical compound C1[C@H](O)[C@@H](CO)OC1N1C(=O)NC(=O)C(CO[C@H]2[C@@H]([C@@H](O)[C@H](O)[C@@H](CO)O2)O)=C1 LHASLBSEALHFGO-ASZAQJJISA-N 0.000 description 1
• 241000238413 Octopus Species 0.000 description 1
• 235000008753 Papaver somniferum Nutrition 0.000 description 1
• 241000218180 Papaveraceae Species 0.000 description 1
• 240000004808 Saccharomyces cerevisiae Species 0.000 description 1
• 238000006073 displacement reaction Methods 0.000 description 1
• 239000011521 glass Substances 0.000 description 1
• 229910052742 iron Inorganic materials 0.000 description 1
• 239000012780 transparent material Substances 0.000 description 1

Cited By (4)