JPS5946095A - Method of producing conductor circuit for printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention provides a method for using conductor circuits for printed circuits.
In DC, the circuit pattern is formed using the FI7 plating process using the full additive method for inner leads and outer leads! J,i
Regarding the 7i law, I. It was not possible to protrude from the first conductor for the flint circuit in the full additive method since f1Y.
-1.

The present invention seeks to eliminate the above-mentioned drawbacks. J
, \11b corner example V of the present invention together with the drawings below
Explain the rules.

Figure 1 shows the hole punching lf of the conductor circuit for printed circuits of the present invention.
Q[, A schematic diagram showing the base board, I121S1p-.

A conductive circuit pattern formed by electroplating is adhesively transferred onto a base plate, and the pattern shown in FIG. This is an abbreviation 1 showing the inner lead portion of a conductor circuit for a printed circuit board manufactured by the above method.

As shown in FIG. 1, the base lever 1a. Apply the adhesive evenly with a VCO coater, pre-bake and dry the adhesive. : After that, a hole 2 for the blister is made by pressing, and an island 1b for reinforcing the transfer is also formed. Next, a conductive circuit pattern 6, which was separately formed by electroplating, is placed on the base substrate shown in FIG.
Figure). Next, the conductive circuit pattern 3'i is transferred and adhered.
, cut the island 1b of the eaves sill reinforcement by pressing, remove the island 1b and attach the conductor circuit pattern 3 to the base base e i
Make it stick out from a.

Since the present invention is manufactured as described in detail above, it solves the problem of the inability to form inner leads and outer leads, which was a drawback of the conventional fully additive method, and simplifies mounting of integrated circuits.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view showing a base substrate that serves as a support base for a conductor circuit for a flint circuit board having press holes punched therein according to the present invention. , 2 is a schematic plan view of a base substrate subjected to transfer adhesion, and FIG. 3 is a schematic plan view of a conductor circuit for a printed circuit manufactured according to the present invention. 1a...Base board 1b...Island 2...Hole 5...34 Body circuit pattern Jli-1 Applicant Sokunikki Tsha Co., Ltd. Agent Patent attorney Go (11) y + Figure 11) 3 Funeral 3 Figure

Claims (1)

[Claims] In the method for manufacturing a conductor circuit for a printed circuit formed by circuit pattern lJ & air plating, there is a separate step (1) of applying an adhesive layer to the base substrate of the conductor circuit for a printed circuit 7, and punching out all holes at the base of the base by pressing or the like. A process of forming a conductor circuit pattern by the hot plating method, transferring the conductor circuit pattern to the above-mentioned punched base plate with K adhesive, and making a part of the conductor circuit pattern into a brittle shape. A method for producing a conductive circuit for a glued circuit board, comprising the steps of: cutting one side of the base substrate of the conductive circuit pattern with a press or the like, and causing the conductive circuit pattern to protrude from the base substrate.