JPS59135664U - Printed board - Google Patents

Printed board

Info

Publication number
JPS59135664U
JPS59135664U JP2917283U JP2917283U JPS59135664U JP S59135664 U JPS59135664 U JP S59135664U JP 2917283 U JP2917283 U JP 2917283U JP 2917283 U JP2917283 U JP 2917283U JP S59135664 U JPS59135664 U JP S59135664U
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
printed board
grade material
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2917283U
Other languages
Japanese (ja)
Inventor
片股 正信
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to JP2917283U priority Critical patent/JPS59135664U/en
Publication of JPS59135664U publication Critical patent/JPS59135664U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のプリント基板の銅箔面の平面図、第2図
はこの考案のプリント基板の一実施例の銅箔面の平面図
である。 1・・・・・・プリント基板、1a・・・・・・パター
ン間容量が問題になる部分、1b・・・・・・高グレー
ド品のプリント基板、2,2a、2b・・・・・・パタ
ーン、3・・・・・・部品。
FIG. 1 is a plan view of the copper foil surface of a conventional printed circuit board, and FIG. 2 is a plan view of the copper foil surface of an embodiment of the printed circuit board of this invention. 1...Printed circuit board, 1a...Part where inter-pattern capacitance is a problem, 1b...High grade printed circuit board, 2, 2a, 2b...・Pattern, 3...Parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 低グレード材のプリント基板本体の一部を切り抜いて、
この切り抜いた部分に高グレード材のプリント基板を埋
め込み、この高グレード材のプリント基板と上記プリン
ト基板本体との間は、部品を介して接続してなることを
特徴とするプリント基板。
Cut out a part of the printed circuit board body made of low grade material,
The printed circuit board is characterized in that a printed circuit board made of high-grade material is embedded in the cut-out portion, and the printed circuit board made of high-grade material and the printed circuit board body are connected via parts.
JP2917283U 1983-02-28 1983-02-28 Printed board Pending JPS59135664U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2917283U JPS59135664U (en) 1983-02-28 1983-02-28 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2917283U JPS59135664U (en) 1983-02-28 1983-02-28 Printed board

Publications (1)

Publication Number Publication Date
JPS59135664U true JPS59135664U (en) 1984-09-10

Family

ID=30160030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2917283U Pending JPS59135664U (en) 1983-02-28 1983-02-28 Printed board

Country Status (1)

Country Link
JP (1) JPS59135664U (en)

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