JPS5943879A - 過酸化水素含有硫酸溶液を用いるプリント回路エツチングのための組成物及びその方法 - Google Patents

過酸化水素含有硫酸溶液を用いるプリント回路エツチングのための組成物及びその方法

Info

Publication number
JPS5943879A
JPS5943879A JP58130396A JP13039683A JPS5943879A JP S5943879 A JPS5943879 A JP S5943879A JP 58130396 A JP58130396 A JP 58130396A JP 13039683 A JP13039683 A JP 13039683A JP S5943879 A JPS5943879 A JP S5943879A
Authority
JP
Japan
Prior art keywords
hydrogen peroxide
acid
etching
sulfuric acid
thiosulfate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58130396A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219508B2 (enExample
Inventor
リチヤ−ド・シエリンガ−・ジユニア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FMC Corp
Original Assignee
FMC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FMC Corp filed Critical FMC Corp
Publication of JPS5943879A publication Critical patent/JPS5943879A/ja
Publication of JPS6219508B2 publication Critical patent/JPS6219508B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP58130396A 1982-09-07 1983-07-19 過酸化水素含有硫酸溶液を用いるプリント回路エツチングのための組成物及びその方法 Granted JPS5943879A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/415,002 US4401509A (en) 1982-09-07 1982-09-07 Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide
US415002 1982-09-07

Publications (2)

Publication Number Publication Date
JPS5943879A true JPS5943879A (ja) 1984-03-12
JPS6219508B2 JPS6219508B2 (enExample) 1987-04-28

Family

ID=23643942

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58130396A Granted JPS5943879A (ja) 1982-09-07 1983-07-19 過酸化水素含有硫酸溶液を用いるプリント回路エツチングのための組成物及びその方法

Country Status (2)

Country Link
US (1) US4401509A (enExample)
JP (1) JPS5943879A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215199A (ja) * 1988-02-23 1989-08-29 Meisei Sangyo:Kk ボイスコイル用ボビンの製造方法
JP2012062572A (ja) * 2010-08-16 2012-03-29 Advanced Technology Materials Inc 銅または銅合金用エッチング液

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4544439A (en) * 1984-07-26 1985-10-01 International Business Machines Corporation System for repairing electrical short circuits between parallel printed circuits
US4754803A (en) * 1987-02-02 1988-07-05 Phelps Dodge Industries, Inc. Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling
US4946520A (en) * 1987-02-02 1990-08-07 Phelps Dodge Industries, Inc. Copper rod manufactured by casting, hot rolling and chemically shaving and pickling
US4859281A (en) * 1987-06-04 1989-08-22 Pennwalt Corporation Etching of copper and copper bearing alloys
GB8813889D0 (en) * 1988-06-11 1988-07-13 Micro Image Technology Ltd Solutions of permonosulphuric acid
US4904340A (en) * 1988-10-31 1990-02-27 Microelectronics And Computer Technology Corporation Laser-assisted liquid-phase etching of copper conductors
US4952275A (en) * 1989-12-15 1990-08-28 Microelectronics And Computer Technology Corporation Copper etching solution and method
FR2707896B1 (fr) * 1993-07-22 1995-09-01 Chemoxal Sa Procédé de traitement d'un article et nouvelle solution aqueuse de peroxyde d'hydrogène.
JP3481379B2 (ja) * 1995-08-23 2003-12-22 メック株式会社 電気めっき法
KR100379824B1 (ko) * 2000-12-20 2003-04-11 엘지.필립스 엘시디 주식회사 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판
GB2386865B (en) * 2000-12-20 2004-09-15 Lg Philips Lcd Co Ltd Etchant and array substrate having copper lines etched by the etchant
US7459005B2 (en) * 2002-11-22 2008-12-02 Akzo Nobel N.V. Chemical composition and method
US7063800B2 (en) * 2003-11-10 2006-06-20 Ying Ding Methods of cleaning copper surfaces in the manufacture of printed circuit boards
US8858755B2 (en) 2011-08-26 2014-10-14 Tel Nexx, Inc. Edge bevel removal apparatus and method
CN104170532B (zh) * 2012-03-16 2017-02-22 住友电木株式会社 层压板及印刷电路板的制造方法
US9301399B2 (en) * 2013-04-23 2016-03-29 Mitsubishi Gas Chemical Company, Inc. Method of treating wiring substrate and wiring substrate manufactured by the same
CN114807943B (zh) * 2022-06-27 2022-09-16 深圳市板明科技股份有限公司 一种5g高频线路生产工艺用微蚀刻液和微蚀方法及其应用
CN115094421B (zh) * 2022-08-24 2022-11-08 深圳市板明科技股份有限公司 一种高频印制线路板用铜面粗化溶液及其制备方法
CN115637456B (zh) * 2022-09-30 2024-06-21 重庆师范大学 一种核壳结构Cu2O@(Co,Cu)(OH)2纳米立方体电催化剂及其制备和应用

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL252116A (enExample) * 1959-06-03
BE657708A (enExample) * 1963-12-30
US3314811A (en) * 1964-01-02 1967-04-18 Mitchell Bradford Chemical Co Metal treating compositions and processes
BE663291A (enExample) * 1964-05-04
US3234140A (en) * 1964-06-05 1966-02-08 Monsanto Co Stabilization of peroxy solutions
DE1253008B (de) * 1964-08-22 1967-10-26 Degussa Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen
DE1255443B (de) * 1964-08-22 1967-11-30 Degussa Verfahren zum chemischen AEtzen von gedruckten Schaltungen
US3383174A (en) * 1965-04-07 1968-05-14 Fmc Corp Stabilization of hydrogen peroxide
NL154561B (nl) * 1965-04-27 1977-09-15 Lancy Lab Werkwijze voor het verwijderen van koper(i)oxyde en koper(ii)oxyde van een voorwerp met een oppervlak van koper of een koperlegering, werkwijze voor het bereiden van een hiervoor toe te passen beitsvloeistof en de door toepassing van deze beitswerkwijze verkregen voorwerpen.
US3407141A (en) * 1966-02-03 1968-10-22 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
US3597290A (en) * 1968-03-25 1971-08-03 Mitsubishi Edogawa Kagaku Kk Method for chemically dissolving metal
US3668131A (en) * 1968-08-09 1972-06-06 Allied Chem Dissolution of metal with acidified hydrogen peroxide solutions
US3839534A (en) * 1969-09-18 1974-10-01 Tokai Electro Chem Co Ltd Process for the treatment of consumed etching solution
BE758162A (fr) * 1969-10-28 1971-04-01 Fmc Corp Stabilisation de solutions acidifiees d'eau
US3681022A (en) * 1970-05-01 1972-08-01 Fmc Corp Manufacture of stable hydrogen peroxide solutions
US3701825A (en) * 1970-10-23 1972-10-31 Fmc Corp Stabilization of hydrogen peroxide with ethylenediamine tetra (methylenephosphonic acid)
JPS5120972B1 (enExample) * 1971-05-13 1976-06-29
BE791457A (fr) * 1971-11-18 1973-05-16 Du Pont Solutions acides stabilisees d'eau oxygenee
US3781409A (en) * 1972-02-28 1973-12-25 Fmc Corp Stabilization of hydrogen peroxide
US3903244A (en) * 1973-02-02 1975-09-02 Fmc Corp Stabilized hydrogen peroxide
JPS5037159B2 (enExample) * 1973-02-21 1975-12-01
JPS5332341B2 (enExample) * 1973-03-27 1978-09-07
US3902896A (en) * 1974-05-22 1975-09-02 Int Nickel Co Cementation of metals from acid solutions
US3945865A (en) * 1974-07-22 1976-03-23 Dart Environment And Services Company Metal dissolution process
US3959436A (en) * 1974-09-26 1976-05-25 E. I. Du Pont De Nemours And Company Process for leaching sulfide minerals
JPS5286933A (en) * 1976-01-14 1977-07-20 Tokai Electro Chemical Co Method of treating surface of copper and copper alloy
US4130455A (en) * 1977-11-08 1978-12-19 Dart Industries Inc. Dissolution of metals-utilizing H2 O2 -H2 SO4 -thiosulfate etchant

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01215199A (ja) * 1988-02-23 1989-08-29 Meisei Sangyo:Kk ボイスコイル用ボビンの製造方法
JP2012062572A (ja) * 2010-08-16 2012-03-29 Advanced Technology Materials Inc 銅または銅合金用エッチング液
KR20170140420A (ko) * 2010-08-16 2017-12-20 엔테그리스, 아이엔씨. 구리 또는 구리 합금용 에칭 용액
US10570522B2 (en) 2010-08-16 2020-02-25 Entegris, Inc. Etching solution for copper or copper alloy

Also Published As

Publication number Publication date
JPS6219508B2 (enExample) 1987-04-28
US4401509A (en) 1983-08-30

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