JPS6219508B2 - - Google Patents
Info
- Publication number
- JPS6219508B2 JPS6219508B2 JP58130396A JP13039683A JPS6219508B2 JP S6219508 B2 JPS6219508 B2 JP S6219508B2 JP 58130396 A JP58130396 A JP 58130396A JP 13039683 A JP13039683 A JP 13039683A JP S6219508 B2 JPS6219508 B2 JP S6219508B2
- Authority
- JP
- Japan
- Prior art keywords
- acid
- hydrogen peroxide
- etching
- thiosulfate
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims description 83
- 238000005530 etching Methods 0.000 claims description 45
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 36
- 239000000203 mixture Substances 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 8
- -1 thiosulfate ions Chemical class 0.000 claims description 8
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 7
- YDONNITUKPKTIG-UHFFFAOYSA-N [Nitrilotris(methylene)]trisphosphonic acid Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CP(O)(O)=O YDONNITUKPKTIG-UHFFFAOYSA-N 0.000 claims description 7
- NFDRPXJGHKJRLJ-UHFFFAOYSA-N edtmp Chemical compound OP(O)(=O)CN(CP(O)(O)=O)CCN(CP(O)(O)=O)CP(O)(O)=O NFDRPXJGHKJRLJ-UHFFFAOYSA-N 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 6
- 150000002440 hydroxy compounds Chemical class 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- DHCDFWKWKRSZHF-UHFFFAOYSA-L thiosulfate(2-) Chemical compound [O-]S([S-])(=O)=O DHCDFWKWKRSZHF-UHFFFAOYSA-L 0.000 claims description 5
- XYXNTHIYBIDHGM-UHFFFAOYSA-N ammonium thiosulfate Chemical class [NH4+].[NH4+].[O-]S([O-])(=O)=S XYXNTHIYBIDHGM-UHFFFAOYSA-N 0.000 claims description 4
- 239000007800 oxidant agent Substances 0.000 claims description 3
- 229910052783 alkali metal Inorganic materials 0.000 claims 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 claims 1
- 229940006280 thiosulfate ion Drugs 0.000 claims 1
- 239000000243 solution Substances 0.000 description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 18
- 229910052802 copper Inorganic materials 0.000 description 18
- 239000010949 copper Substances 0.000 description 18
- 239000003381 stabilizer Substances 0.000 description 11
- 238000000354 decomposition reaction Methods 0.000 description 6
- AKHNMLFCWUSKQB-UHFFFAOYSA-L sodium thiosulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=S AKHNMLFCWUSKQB-UHFFFAOYSA-L 0.000 description 6
- 235000019345 sodium thiosulphate Nutrition 0.000 description 6
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 5
- 239000011734 sodium Substances 0.000 description 5
- 239000003054 catalyst Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- JZCCFEFSEZPSOG-UHFFFAOYSA-L copper(II) sulfate pentahydrate Chemical compound O.O.O.O.O.[Cu+2].[O-]S([O-])(=O)=O JZCCFEFSEZPSOG-UHFFFAOYSA-L 0.000 description 4
- FGRVOLIFQGXPCT-UHFFFAOYSA-L dipotassium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [K+].[K+].[O-]S([O-])(=O)=S FGRVOLIFQGXPCT-UHFFFAOYSA-L 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 239000008399 tap water Substances 0.000 description 3
- 235000020679 tap water Nutrition 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- HQKMJHAJHXVSDF-UHFFFAOYSA-L magnesium stearate Chemical compound [Mg+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O HQKMJHAJHXVSDF-UHFFFAOYSA-L 0.000 description 2
- 229940062135 magnesium thiosulfate Drugs 0.000 description 2
- TZKHCTCLSRVZEY-UHFFFAOYSA-L magnesium;dioxido-oxo-sulfanylidene-$l^{6}-sulfane Chemical compound [Mg+2].[O-]S([O-])(=O)=S TZKHCTCLSRVZEY-UHFFFAOYSA-L 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 241000711295 Aeria Species 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 238000003421 catalytic decomposition reaction Methods 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001844 chromium Chemical class 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002079 cooperative effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000002638 heterogeneous catalyst Substances 0.000 description 1
- 239000002815 homogeneous catalyst Substances 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000004680 hydrogen peroxides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- GVALZJMUIHGIMD-UHFFFAOYSA-H magnesium phosphate Chemical compound [Mg+2].[Mg+2].[Mg+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O GVALZJMUIHGIMD-UHFFFAOYSA-H 0.000 description 1
- 235000019359 magnesium stearate Nutrition 0.000 description 1
- BJZBHTNKDCBDNQ-UHFFFAOYSA-L magnesium;dodecanoate Chemical compound [Mg+2].CCCCCCCCCCCC([O-])=O.CCCCCCCCCCCC([O-])=O BJZBHTNKDCBDNQ-UHFFFAOYSA-L 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 229940087596 sodium phenolsulfonate Drugs 0.000 description 1
- BLXAGSNYHSQSRC-UHFFFAOYSA-M sodium;2-hydroxybenzenesulfonate Chemical compound [Na+].OC1=CC=CC=C1S([O-])(=O)=O BLXAGSNYHSQSRC-UHFFFAOYSA-M 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L sulfate group Chemical group S(=O)(=O)([O-])[O-] QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/067—Etchants
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/415,002 US4401509A (en) | 1982-09-07 | 1982-09-07 | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
| US415002 | 1982-09-07 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5943879A JPS5943879A (ja) | 1984-03-12 |
| JPS6219508B2 true JPS6219508B2 (enExample) | 1987-04-28 |
Family
ID=23643942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58130396A Granted JPS5943879A (ja) | 1982-09-07 | 1983-07-19 | 過酸化水素含有硫酸溶液を用いるプリント回路エツチングのための組成物及びその方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US4401509A (enExample) |
| JP (1) | JPS5943879A (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4544439A (en) * | 1984-07-26 | 1985-10-01 | International Business Machines Corporation | System for repairing electrical short circuits between parallel printed circuits |
| US4754803A (en) * | 1987-02-02 | 1988-07-05 | Phelps Dodge Industries, Inc. | Manufacturing copper rod by casting, hot rolling and chemically shaving and pickling |
| US4946520A (en) * | 1987-02-02 | 1990-08-07 | Phelps Dodge Industries, Inc. | Copper rod manufactured by casting, hot rolling and chemically shaving and pickling |
| US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
| JPH01215199A (ja) * | 1988-02-23 | 1989-08-29 | Meisei Sangyo:Kk | ボイスコイル用ボビンの製造方法 |
| GB8813889D0 (en) * | 1988-06-11 | 1988-07-13 | Micro Image Technology Ltd | Solutions of permonosulphuric acid |
| US4904340A (en) * | 1988-10-31 | 1990-02-27 | Microelectronics And Computer Technology Corporation | Laser-assisted liquid-phase etching of copper conductors |
| US4952275A (en) * | 1989-12-15 | 1990-08-28 | Microelectronics And Computer Technology Corporation | Copper etching solution and method |
| FR2707896B1 (fr) * | 1993-07-22 | 1995-09-01 | Chemoxal Sa | Procédé de traitement d'un article et nouvelle solution aqueuse de peroxyde d'hydrogène. |
| JP3481379B2 (ja) * | 1995-08-23 | 2003-12-22 | メック株式会社 | 電気めっき法 |
| KR100379824B1 (ko) * | 2000-12-20 | 2003-04-11 | 엘지.필립스 엘시디 주식회사 | 식각용액 및 식각용액으로 패턴된 구리배선을 가지는전자기기용 어레이기판 |
| GB2386865B (en) * | 2000-12-20 | 2004-09-15 | Lg Philips Lcd Co Ltd | Etchant and array substrate having copper lines etched by the etchant |
| US7459005B2 (en) * | 2002-11-22 | 2008-12-02 | Akzo Nobel N.V. | Chemical composition and method |
| US7063800B2 (en) * | 2003-11-10 | 2006-06-20 | Ying Ding | Methods of cleaning copper surfaces in the manufacture of printed circuit boards |
| JP6101421B2 (ja) | 2010-08-16 | 2017-03-22 | インテグリス・インコーポレーテッド | 銅または銅合金用エッチング液 |
| US8858755B2 (en) | 2011-08-26 | 2014-10-14 | Tel Nexx, Inc. | Edge bevel removal apparatus and method |
| CN104170532B (zh) * | 2012-03-16 | 2017-02-22 | 住友电木株式会社 | 层压板及印刷电路板的制造方法 |
| US9301399B2 (en) * | 2013-04-23 | 2016-03-29 | Mitsubishi Gas Chemical Company, Inc. | Method of treating wiring substrate and wiring substrate manufactured by the same |
| CN114807943B (zh) * | 2022-06-27 | 2022-09-16 | 深圳市板明科技股份有限公司 | 一种5g高频线路生产工艺用微蚀刻液和微蚀方法及其应用 |
| CN115094421B (zh) * | 2022-08-24 | 2022-11-08 | 深圳市板明科技股份有限公司 | 一种高频印制线路板用铜面粗化溶液及其制备方法 |
| CN115637456B (zh) * | 2022-09-30 | 2024-06-21 | 重庆师范大学 | 一种核壳结构Cu2O@(Co,Cu)(OH)2纳米立方体电催化剂及其制备和应用 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL252116A (enExample) * | 1959-06-03 | |||
| BE657708A (enExample) * | 1963-12-30 | |||
| US3314811A (en) * | 1964-01-02 | 1967-04-18 | Mitchell Bradford Chemical Co | Metal treating compositions and processes |
| BE663291A (enExample) * | 1964-05-04 | |||
| US3234140A (en) * | 1964-06-05 | 1966-02-08 | Monsanto Co | Stabilization of peroxy solutions |
| DE1253008B (de) * | 1964-08-22 | 1967-10-26 | Degussa | Verfahren zum AEtzen von Kupferfolien fuer die Herstellung von gedruckten Schaltungen |
| DE1255443B (de) * | 1964-08-22 | 1967-11-30 | Degussa | Verfahren zum chemischen AEtzen von gedruckten Schaltungen |
| US3383174A (en) * | 1965-04-07 | 1968-05-14 | Fmc Corp | Stabilization of hydrogen peroxide |
| NL154561B (nl) * | 1965-04-27 | 1977-09-15 | Lancy Lab | Werkwijze voor het verwijderen van koper(i)oxyde en koper(ii)oxyde van een voorwerp met een oppervlak van koper of een koperlegering, werkwijze voor het bereiden van een hiervoor toe te passen beitsvloeistof en de door toepassing van deze beitswerkwijze verkregen voorwerpen. |
| US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| US3597290A (en) * | 1968-03-25 | 1971-08-03 | Mitsubishi Edogawa Kagaku Kk | Method for chemically dissolving metal |
| US3668131A (en) * | 1968-08-09 | 1972-06-06 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| US3839534A (en) * | 1969-09-18 | 1974-10-01 | Tokai Electro Chem Co Ltd | Process for the treatment of consumed etching solution |
| BE758162A (fr) * | 1969-10-28 | 1971-04-01 | Fmc Corp | Stabilisation de solutions acidifiees d'eau |
| US3681022A (en) * | 1970-05-01 | 1972-08-01 | Fmc Corp | Manufacture of stable hydrogen peroxide solutions |
| US3701825A (en) * | 1970-10-23 | 1972-10-31 | Fmc Corp | Stabilization of hydrogen peroxide with ethylenediamine tetra (methylenephosphonic acid) |
| JPS5120972B1 (enExample) * | 1971-05-13 | 1976-06-29 | ||
| BE791457A (fr) * | 1971-11-18 | 1973-05-16 | Du Pont | Solutions acides stabilisees d'eau oxygenee |
| US3781409A (en) * | 1972-02-28 | 1973-12-25 | Fmc Corp | Stabilization of hydrogen peroxide |
| US3903244A (en) * | 1973-02-02 | 1975-09-02 | Fmc Corp | Stabilized hydrogen peroxide |
| JPS5037159B2 (enExample) * | 1973-02-21 | 1975-12-01 | ||
| JPS5332341B2 (enExample) * | 1973-03-27 | 1978-09-07 | ||
| US3902896A (en) * | 1974-05-22 | 1975-09-02 | Int Nickel Co | Cementation of metals from acid solutions |
| US3945865A (en) * | 1974-07-22 | 1976-03-23 | Dart Environment And Services Company | Metal dissolution process |
| US3959436A (en) * | 1974-09-26 | 1976-05-25 | E. I. Du Pont De Nemours And Company | Process for leaching sulfide minerals |
| JPS5286933A (en) * | 1976-01-14 | 1977-07-20 | Tokai Electro Chemical Co | Method of treating surface of copper and copper alloy |
| US4130455A (en) * | 1977-11-08 | 1978-12-19 | Dart Industries Inc. | Dissolution of metals-utilizing H2 O2 -H2 SO4 -thiosulfate etchant |
-
1982
- 1982-09-07 US US06/415,002 patent/US4401509A/en not_active Expired - Lifetime
-
1983
- 1983-07-19 JP JP58130396A patent/JPS5943879A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| US4401509A (en) | 1983-08-30 |
| JPS5943879A (ja) | 1984-03-12 |
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