JPS5936432B2 - 半導体装置の製造方法 - Google Patents

半導体装置の製造方法

Info

Publication number
JPS5936432B2
JPS5936432B2 JP55116562A JP11656280A JPS5936432B2 JP S5936432 B2 JPS5936432 B2 JP S5936432B2 JP 55116562 A JP55116562 A JP 55116562A JP 11656280 A JP11656280 A JP 11656280A JP S5936432 B2 JPS5936432 B2 JP S5936432B2
Authority
JP
Japan
Prior art keywords
polycrystalline silicon
region
layer
pattern
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55116562A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5740975A (en
Inventor
芳高 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP55116562A priority Critical patent/JPS5936432B2/ja
Priority to US06/294,749 priority patent/US4407059A/en
Priority to DE19813133548 priority patent/DE3133548A1/de
Publication of JPS5740975A publication Critical patent/JPS5740975A/ja
Publication of JPS5936432B2 publication Critical patent/JPS5936432B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/30—Devices controlled by electric currents or voltages
    • H10D48/32—Devices controlled by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H10D48/34—Bipolar devices
    • H10D48/345—Bipolar transistors having ohmic electrodes on emitter-like, base-like, and collector-like regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0112—Integrating together multiple components covered by H10D8/00, H10D10/00 or H10D18/00, e.g. integrating multiple BJTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H10P14/6308—
    • H10P32/1414—
    • H10P32/171—

Landscapes

  • Bipolar Transistors (AREA)
  • Engineering & Computer Science (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
JP55116562A 1980-08-25 1980-08-25 半導体装置の製造方法 Expired JPS5936432B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP55116562A JPS5936432B2 (ja) 1980-08-25 1980-08-25 半導体装置の製造方法
US06/294,749 US4407059A (en) 1980-08-25 1981-08-20 Method of producing semiconductor device
DE19813133548 DE3133548A1 (de) 1980-08-25 1981-08-25 Verfahren zur herstellung von halbleitervorrichtungen

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55116562A JPS5936432B2 (ja) 1980-08-25 1980-08-25 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5740975A JPS5740975A (en) 1982-03-06
JPS5936432B2 true JPS5936432B2 (ja) 1984-09-04

Family

ID=14690175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55116562A Expired JPS5936432B2 (ja) 1980-08-25 1980-08-25 半導体装置の製造方法

Country Status (3)

Country Link
US (1) US4407059A (cg-RX-API-DMAC10.html)
JP (1) JPS5936432B2 (cg-RX-API-DMAC10.html)
DE (1) DE3133548A1 (cg-RX-API-DMAC10.html)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4539742A (en) * 1981-06-22 1985-09-10 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and method for manufacturing the same
JPS5946065A (ja) * 1982-09-09 1984-03-15 Toshiba Corp 半導体装置の製造方法
JPS5989457A (ja) * 1982-11-15 1984-05-23 Hitachi Ltd 半導体装置の製造方法
US4555842A (en) * 1984-03-19 1985-12-03 At&T Bell Laboratories Method of fabricating VLSI CMOS devices having complementary threshold voltages
GB2172744B (en) * 1985-03-23 1989-07-19 Stc Plc Semiconductor devices
US4722830A (en) * 1986-05-05 1988-02-02 General Electric Company Automated multiple stream analysis system
US5169795A (en) * 1989-02-28 1992-12-08 Small Power Communication Systems Research Laboratories Co., Ltd. Method of manufacturing step cut type insulated gate SIT having low-resistance electrode
US5219779A (en) * 1989-05-11 1993-06-15 Sharp Kabushiki Kaisha Memory cell for dynamic random access memory
EP0600693A3 (en) * 1992-11-30 1994-11-30 Sgs Thomson Microelectronics Selective trench etching and self-aligning base-emitter structure.
JP3223895B2 (ja) * 1998-12-15 2001-10-29 日本電気株式会社 半導体装置の製造方法
JP2014241367A (ja) * 2013-06-12 2014-12-25 三菱電機株式会社 半導体素子、半導体素子の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583380B2 (ja) * 1977-03-04 1983-01-21 株式会社日立製作所 半導体装置とその製造方法
US4190466A (en) * 1977-12-22 1980-02-26 International Business Machines Corporation Method for making a bipolar transistor structure utilizing self-passivating diffusion sources
US4178674A (en) * 1978-03-27 1979-12-18 Intel Corporation Process for forming a contact region between layers of polysilicon with an integral polysilicon resistor
JPS54161894A (en) * 1978-06-13 1979-12-21 Toshiba Corp Manufacture of semiconductor device
DE2936724A1 (de) * 1978-09-11 1980-03-20 Tokyo Shibaura Electric Co Halbleitervorrichtung und verfahren zu ihrer herstellung
EP0029986B1 (en) * 1979-11-29 1986-03-12 Vlsi Technology Research Association Method of manufacturing a semiconductor device with a schottky junction
US4322882A (en) * 1980-02-04 1982-04-06 Fairchild Camera & Instrument Corp. Method for making an integrated injection logic structure including a self-aligned base contact
US4317276A (en) * 1980-06-12 1982-03-02 Teletype Corporation Method of manufacturing an insulated gate field-effect transistor therefore in a silicon wafer
US4322883A (en) * 1980-07-08 1982-04-06 International Business Machines Corporation Self-aligned metal process for integrated injection logic integrated circuits

Also Published As

Publication number Publication date
DE3133548A1 (de) 1982-04-15
DE3133548C2 (cg-RX-API-DMAC10.html) 1990-04-19
JPS5740975A (en) 1982-03-06
US4407059A (en) 1983-10-04

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