JPS5936367Y2 - 両面研摩装置 - Google Patents

両面研摩装置

Info

Publication number
JPS5936367Y2
JPS5936367Y2 JP1981044623U JP4462381U JPS5936367Y2 JP S5936367 Y2 JPS5936367 Y2 JP S5936367Y2 JP 1981044623 U JP1981044623 U JP 1981044623U JP 4462381 U JP4462381 U JP 4462381U JP S5936367 Y2 JPS5936367 Y2 JP S5936367Y2
Authority
JP
Japan
Prior art keywords
carrier
wafer
holding hole
sun gear
surface plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981044623U
Other languages
English (en)
Japanese (ja)
Other versions
JPS57157453U (OSRAM
Inventor
智一 村山
成和 鈴木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP1981044623U priority Critical patent/JPS5936367Y2/ja
Publication of JPS57157453U publication Critical patent/JPS57157453U/ja
Application granted granted Critical
Publication of JPS5936367Y2 publication Critical patent/JPS5936367Y2/ja
Expired legal-status Critical Current

Links

JP1981044623U 1981-03-31 1981-03-31 両面研摩装置 Expired JPS5936367Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981044623U JPS5936367Y2 (ja) 1981-03-31 1981-03-31 両面研摩装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981044623U JPS5936367Y2 (ja) 1981-03-31 1981-03-31 両面研摩装置

Publications (2)

Publication Number Publication Date
JPS57157453U JPS57157453U (OSRAM) 1982-10-02
JPS5936367Y2 true JPS5936367Y2 (ja) 1984-10-06

Family

ID=29841545

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981044623U Expired JPS5936367Y2 (ja) 1981-03-31 1981-03-31 両面研摩装置

Country Status (1)

Country Link
JP (1) JPS5936367Y2 (OSRAM)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5151800B2 (ja) * 2008-08-20 2013-02-27 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法
JP5212041B2 (ja) * 2008-11-19 2013-06-19 信越半導体株式会社 両面研磨装置用キャリア及びこれを用いた両面研磨装置並びに両面研磨方法

Also Published As

Publication number Publication date
JPS57157453U (OSRAM) 1982-10-02

Similar Documents

Publication Publication Date Title
JP3561538B2 (ja) 半導体の研磨機、研磨台及び研磨方法
KR100457718B1 (ko) 실리콘웨이퍼의제조방법과그장치
US5997385A (en) Method and apparatus for polishing semiconductor substrate
JP2674730B2 (ja) 半導体ウエハを平面化する装置及び方法、及び研磨パッド
JP3925580B2 (ja) ウェーハ加工装置および加工方法
JP3595011B2 (ja) 研磨制御を改善した化学的機械的研磨装置
JPH10180624A (ja) ラッピング装置及び方法
JPS5936367Y2 (ja) 両面研摩装置
JP2002217149A (ja) ウエーハの研磨装置及び研磨方法
JP3821947B2 (ja) ウェーハ研磨装置及びウェーハ研磨方法
JPS6365473B2 (OSRAM)
JP3779104B2 (ja) ウェーハ研磨装置
JPH07156062A (ja) ラッピングキャリア
JP3587505B2 (ja) 研磨用キャリア
JP2001030161A (ja) 研磨加工装置のキャリア
JPS60259372A (ja) 両面ポリツシング方法
JP2558864Y2 (ja) ラッピング砥石定盤
JPS6251226A (ja) 研磨方法
JPH10256201A (ja) 半導体の製造方法
JP3874233B2 (ja) 片面鏡面ウェーハ
JP2593474B2 (ja) ウエハ研摩装置
JP4103106B2 (ja) 研磨布
JPH03196965A (ja) 半導体ウェーハの研磨方法
JPH07112360A (ja) 半導体ウェーハの研磨方法
JP2004034285A (ja) 薄片状の工作物の加工法