JPS5931045A - 樹脂封止形半導体装置およびその製造方法 - Google Patents

樹脂封止形半導体装置およびその製造方法

Info

Publication number
JPS5931045A
JPS5931045A JP57065132A JP6513282A JPS5931045A JP S5931045 A JPS5931045 A JP S5931045A JP 57065132 A JP57065132 A JP 57065132A JP 6513282 A JP6513282 A JP 6513282A JP S5931045 A JPS5931045 A JP S5931045A
Authority
JP
Japan
Prior art keywords
semiconductor chip
resin
semiconductor
semiconductor device
epoxy resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57065132A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6219064B2 (enExample
Inventor
Ikuo Sasaki
佐々木　育夫
Kazunari Michii
一成 道井
Osamu Nakagawa
治 中川
Toshinobu Banjo
番條　敏信
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57065132A priority Critical patent/JPS5931045A/ja
Publication of JPS5931045A publication Critical patent/JPS5931045A/ja
Publication of JPS6219064B2 publication Critical patent/JPS6219064B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W42/25—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H10W72/01515—
    • H10W72/075—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/536—
    • H10W72/884—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP57065132A 1982-04-16 1982-04-16 樹脂封止形半導体装置およびその製造方法 Granted JPS5931045A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57065132A JPS5931045A (ja) 1982-04-16 1982-04-16 樹脂封止形半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57065132A JPS5931045A (ja) 1982-04-16 1982-04-16 樹脂封止形半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPS5931045A true JPS5931045A (ja) 1984-02-18
JPS6219064B2 JPS6219064B2 (enExample) 1987-04-25

Family

ID=13278036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57065132A Granted JPS5931045A (ja) 1982-04-16 1982-04-16 樹脂封止形半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JPS5931045A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132448A (ja) * 1984-07-24 1986-02-15 Mitsubishi Electric Corp 樹脂封止型半導体装置
FR2650121A1 (fr) * 1989-07-21 1991-01-25 Nec Corp Support de puce electronique
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6132448A (ja) * 1984-07-24 1986-02-15 Mitsubishi Electric Corp 樹脂封止型半導体装置
FR2650121A1 (fr) * 1989-07-21 1991-01-25 Nec Corp Support de puce electronique
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier

Also Published As

Publication number Publication date
JPS6219064B2 (enExample) 1987-04-25

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