JPS5927945A - 半導体封止用液状エポキシ樹脂組成物 - Google Patents

半導体封止用液状エポキシ樹脂組成物

Info

Publication number
JPS5927945A
JPS5927945A JP13765882A JP13765882A JPS5927945A JP S5927945 A JPS5927945 A JP S5927945A JP 13765882 A JP13765882 A JP 13765882A JP 13765882 A JP13765882 A JP 13765882A JP S5927945 A JPS5927945 A JP S5927945A
Authority
JP
Japan
Prior art keywords
epoxy resin
resin composition
liquid epoxy
semiconductor encapsulation
coupling agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13765882A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6240368B2 (enrdf_load_stackoverflow
Inventor
Takamitsu Fujimoto
隆光 藤本
Yuzo Kanegae
鐘ケ江　裕三
Torahiko Ando
虎彦 安藤
Norimoto Moriwaki
森脇　紀元
Shohei Eto
江藤　昌平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13765882A priority Critical patent/JPS5927945A/ja
Publication of JPS5927945A publication Critical patent/JPS5927945A/ja
Publication of JPS6240368B2 publication Critical patent/JPS6240368B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Organic Insulating Materials (AREA)
JP13765882A 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物 Granted JPS5927945A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13765882A JPS5927945A (ja) 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13765882A JPS5927945A (ja) 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物

Publications (2)

Publication Number Publication Date
JPS5927945A true JPS5927945A (ja) 1984-02-14
JPS6240368B2 JPS6240368B2 (enrdf_load_stackoverflow) 1987-08-27

Family

ID=15203782

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13765882A Granted JPS5927945A (ja) 1982-08-05 1982-08-05 半導体封止用液状エポキシ樹脂組成物

Country Status (1)

Country Link
JP (1) JPS5927945A (enrdf_load_stackoverflow)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149743A (ja) * 1985-12-25 1987-07-03 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPS63202621A (ja) * 1987-02-18 1988-08-22 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPS63225657A (ja) * 1986-10-28 1988-09-20 Calp Corp 複合樹脂組成物
JPS6475517A (en) * 1987-09-15 1989-03-22 Ibm Sealing composition and electronic device
US5040224A (en) * 1988-04-23 1991-08-13 Nec Corporation Fingerprint processing system capable of detecting a core of a fingerprint image by statistically processing parameters
EP0736836A2 (en) 1995-04-04 1996-10-09 Nec Corporation Fingerprint fingertip orientation detection method and device
WO2001074798A1 (en) * 2000-03-31 2001-10-11 Loctite Corporation Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent
JP2005336329A (ja) * 2004-05-27 2005-12-08 Shin Etsu Chem Co Ltd 表面処理無機充填材、半導体封止用エポキシ樹脂組成物及び半導体装置
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US7166361B2 (en) 2000-03-31 2007-01-23 Hitachi Chemical Co., Ltd. Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board
JP2007217683A (ja) * 2006-01-19 2007-08-30 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2007320998A (ja) * 2006-05-30 2007-12-13 Yokohama Rubber Co Ltd:The 注型用硬化性樹脂組成物およびタイヤ空気圧センサー
US8053587B2 (en) 2000-03-31 2011-11-08 Henkel Corporation Reworkable thermosetting resin composition
JP2012077172A (ja) * 2010-09-30 2012-04-19 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート及び積層構造体

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149743A (ja) * 1985-12-25 1987-07-03 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂成形材料
JPS63225657A (ja) * 1986-10-28 1988-09-20 Calp Corp 複合樹脂組成物
JPS63202621A (ja) * 1987-02-18 1988-08-22 Matsushita Electric Works Ltd エポキシ樹脂成形材料
JPS6475517A (en) * 1987-09-15 1989-03-22 Ibm Sealing composition and electronic device
US5040224A (en) * 1988-04-23 1991-08-13 Nec Corporation Fingerprint processing system capable of detecting a core of a fingerprint image by statistically processing parameters
EP0736836A2 (en) 1995-04-04 1996-10-09 Nec Corporation Fingerprint fingertip orientation detection method and device
US5848176A (en) * 1995-04-04 1998-12-08 Nec Corporation Fingerprint fingertip orientation detection method and device
US7736749B2 (en) 2000-03-31 2010-06-15 Hitachi Chemichal Co., Ltd. Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate, and multi-layered printed wiring board
WO2001074798A1 (en) * 2000-03-31 2001-10-11 Loctite Corporation Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent
US7012120B2 (en) 2000-03-31 2006-03-14 Henkel Corporation Reworkable compositions of oxirane(s) or thirane(s)-containing resin and curing agent
US7166361B2 (en) 2000-03-31 2007-01-23 Hitachi Chemical Co., Ltd. Thermosetting resin composition, resin film, metallic foil provided with an insulation material, insulation film provided with a metallic foil on each side, metal-clad laminate, multi-layered metal-clad laminate and multi-layered printed wiring board
US8053587B2 (en) 2000-03-31 2011-11-08 Henkel Corporation Reworkable thermosetting resin composition
JP2005336329A (ja) * 2004-05-27 2005-12-08 Shin Etsu Chem Co Ltd 表面処理無機充填材、半導体封止用エポキシ樹脂組成物及び半導体装置
JP2007217683A (ja) * 2006-01-19 2007-08-30 Hitachi Chem Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2007320998A (ja) * 2006-05-30 2007-12-13 Yokohama Rubber Co Ltd:The 注型用硬化性樹脂組成物およびタイヤ空気圧センサー
JP2012077172A (ja) * 2010-09-30 2012-04-19 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート及び積層構造体

Also Published As

Publication number Publication date
JPS6240368B2 (enrdf_load_stackoverflow) 1987-08-27

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