JPS5927061Y2 - Hybrid integrated circuit device - Google Patents

Description

[Detailed description of the invention] The present invention relates to the assembly structure of a hybrid integrated circuit, which facilitates assembly while ensuring high-density packaging, and by converting each functional circuit block into a hybrid integrated circuit. The purpose is to conduct inspections, facilitate quality control, and improve yield.

FIG. 1 shows an assembly diagram of a conventional hybrid integrated circuit.
Passive elements such as electrodes, resistors, and capacitors are printed and wired on B, C, and D, and then parts such as chip capacitors and volumes are soldered, stacked in multiple layers, and the node terminals are used to measure continuity between the terminals of each board. , and is mechanically fixed at the same time.

When a circuit consisting of multiple blocks is fabricated into a hybrid integrated circuit using this method, it is difficult to arrange an independent circuit block on each board due to pattern design. Alternatively, since one component is placed on board B or another board, circuit blocks having one function are not independent, making it extremely difficult to inspect each board.

Also, assembly using this method is difficult and time consuming.

This is because the lead terminals are not inserted into all the terminal holes, but are limited to each location, making the work and management difficult.

An embodiment of the present invention, which has been developed in view of the various drawbacks of the prior art described above, will be described with reference to FIGS. 2 to 4.

FIG. 2 shows a front view of the hybrid integrated circuits 1 and 2, which are assembled by electromechanically connecting substrates 3 and 4 above and below with node terminals, FIG. 3 is a side view of FIG. 2, and FIG. 2 shows the plan view of FIG. 2, respectively.

The hybrid integrated circuits 1 and 2 are single-in-line package (SIP) type ICs, each of which is formed from one circuit block into a hybrid integrated circuit, and is packaged with these resins.

Terminals 5 are electromechanically attached to the lower board 4 on which the printed wiring is installed.
(not shown), and the upper board, on which electric components such as a semi-fixed resistor 6.7 and diodes 8 and 9 are attached on the printed wiring, is inserted into the assembly jig (not shown). The upper and lower substrates 3 and 4 are electromechanically connected and fixed by soldering lead terminals around the hybrid integrated circuit.

Next, a diode 10, a capacitor 11. A resistor 12 is mounted and connected between the upper and lower boards 3 and 4.

If such an assembly method is applied to, for example, a high frequency circuit and a metal shield plate is interposed between the hybrid integrated circuits 1 and 2, there is an advantage that shielding between circuit blocks (interstages) can be achieved.

According to the configuration of the present invention as described above, since each circuit block is assembled after inspecting its quality, the yield after assembly is completed can be dramatically improved.

In addition, when attaching lead terminals, as in the past, there were limitations on where to attach them and the lengths of the lead terminals also varied, making assembly work difficult and time-consuming. These problems can be eliminated and work efficiency can be improved while maintaining high density packaging.

[Brief explanation of the drawing]

1 is a conventional hybrid integrated circuit device, FIG. 2 is a front view of a hybrid integrated circuit device according to an embodiment of the present invention, FIG. 3 is a side view of FIG. 2, and FIG. 4 is a side view of FIG. 2. A plan view is shown. 1.2...Hybrid integrated circuit, 3...Upper board, 4...Lower board.

Claims (1)

[Scope of utility model registration request] A hybrid integrated circuit device in which substrates are disposed oppositely above and below a hybrid integrated circuit, the hybrid integrated circuit is attached to the lower substrate, and the upper and lower substrates are electromechanically connected around the hybrid integrated circuit by lead terminals. .