JPS59225537A - Wedge wire bonding method - Google Patents

Wedge wire bonding method

Info

Publication number
JPS59225537A
JPS59225537A JP58101083A JP10108383A JPS59225537A JP S59225537 A JPS59225537 A JP S59225537A JP 58101083 A JP58101083 A JP 58101083A JP 10108383 A JP10108383 A JP 10108383A JP S59225537 A JPS59225537 A JP S59225537A
Authority
JP
Japan
Prior art keywords
wire
bonding
wedge
clamper
free end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58101083A
Other languages
Japanese (ja)
Inventor
Eiji Miyajima
宮嶋　栄志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58101083A priority Critical patent/JPS59225537A/en
Publication of JPS59225537A publication Critical patent/JPS59225537A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To contrive to improve the working efficiency by a method wherein the position of a wire free end led out to the end of a bonding wedge is corrected by the movement of a wire clamper. CONSTITUTION:As a means for correcting displacement rocking due to the winding habit of the free end of the wire 3 at the wedge pressure contact end 2 of a bonding device, the wire clamper 4 is finely moved right and left by operation of a lever and the like not illustrated. Thereby, the bonding wire 3 finely moves in reverse to the movement of the clamper 4 with a guide hole 5 for wire penetration of the wedge 1 as a supporting point, and accordingly the position of the fee end of the wire can be corrected. Bonding working after confirmation of the positional correction thereof within the field of sight of a microscope enables to connect the wire poperly within the dimension of the width of a chip electrode.

Description

【発明の詳細な説明】 （ａ）発明の技術分野 本発声は微細なボンディングバットを対象とするウェッ
ジワイヤボンディング方法に関す。DETAILED DESCRIPTION OF THE INVENTION (a) Technical Field of the Invention The present invention relates to a wedge wire bonding method for fine bonding butts.

（ｂ）技術、の背讐 本発明は、集積回路等の生産工程に於いて、チップ面形
轡になやボンディングパント（チップ電極）と組立基板
回路との接続手段に係り、特に細径リード線１例えば２
５μｍ金線等のボンディング接続手段に就いて提示する
ものである。(b) Technology The present invention relates to a means for connecting a bonding pant (chip electrode) to an assembled board circuit on a chip surface shape in the production process of integrated circuits, etc. line 1 for example 2
This paper presents bonding connection means such as 5 μm gold wire.

（Ｃ）従来技術と問題点 第１図は、ワイヤガイドホール付ボンディングウェッジ
を使用するボンディング装置の一部を示す斜視図である
。(C) Prior Art and Problems FIG. 1 is a perspective view showing a part of a bonding apparatus using a bonding wedge with a wire guide hole.

斜視図中、１はボンディングウェッジ、２はウェッジ１
下端のワイヤ圧接端、３はアルミニュムもしくは金等の
ボンディングワイヤ、４は図示しないボンディングワイ
ヤ巻回リールから繰り出しのワイヤクランパ、これはウ
ェッジ圧接端２ヘワイヤガイドをなす固定爪８と可動爪
９とよりなる。In the perspective view, 1 is the bonding wedge, 2 is the wedge 1
The wire pressure welding end at the lower end, 3 is a bonding wire made of aluminum or gold, and 4 is a wire clamper fed out from a bonding wire winding reel (not shown). It becomes more.

５はウェッジ圧接端２ヘボンディングワイヤをガイドす
るウェッジ下端の細孔（ワイヤガイドホール）、６は超
音波振動ホーン、及び７は前記ボンディングワイヤ３の
ホーン貫通孔である。Reference numeral 5 designates a small hole (wire guide hole) at the lower end of the wedge that guides the bonding wire to the press-connected end 2 of the wedge, 6 an ultrasonic vibration horn, and 7 a horn through hole of the bonding wire 3.

第２図は、前記のボンディング装置で、微細寸法のワイ
ヤ３を接続する前記ボンディングウェッジ１の圧接端正
面図である（第１図の太い矢印方向から見た図）。FIG. 2 is a front view of the press-contacting end of the bonding wedge 1 for connecting the fine-sized wire 3 in the bonding apparatus (viewed from the direction of the bold arrow in FIG. 1).

第２回正面図に於いて、１０は半導体チップ例えば、３
００μｍ方形の半導体チップ面、１１は半導体チップ面
１０に形成された幅（図示寸法１２）　３０μｍ程度の
バット電極である。尚又８図示ウェッジ１下端の点線で
図示するボンディングワイヤ３は該ワイヤ揺動による位
置ズレを示す。即ち５例示状態は、係る微細寸法のボン
ディング加工に於ては巻回リールから繰り出しのボンデ
ィングワイヤ３自出端には避は難いリールの巻きぐせが
問題となり、ウェッジ圧接端２の央部にワイヤ定置する
ことが困難となるを示す。In the second front view, 10 is a semiconductor chip, for example, 3
00 μm square semiconductor chip surface, 11 is a butt electrode formed on the semiconductor chip surface 10 and having a width (dimension 12 in the drawing) of about 30 μm. Furthermore, the bonding wire 3 shown by the dotted line at the lower end of the wedge 1 shown in FIG. 8 shows displacement due to the swinging of the wire. In other words, in the case of the fifth example, there is a problem in the unavoidable curling of the reel at the end of the bonding wire 3 that is unwound from the winding reel in such micro-dimensional bonding processing, and the wire is placed in the center of the wedge pressure welding end 2. Indicates that it is difficult to immobilize.

これを避ける為、前記ガイドホール付ボンディングウェ
ッジ１の使用を避け、ワイヤ及びウェッジ夫々が個々に
操作可能なボンディング装置で行うが、該装置は作業能
率が著るしく低下することが問題である。In order to avoid this, the use of the bonding wedge 1 with guide holes is avoided, and a bonding device is used in which the wire and the wedge can be operated individually, but the problem with this device is that the working efficiency is significantly reduced.

（ｄ）発明の目的 本発明は前記問題点を解決することである。前記の如く
ウェッジ先端あるいはワイヤ自由端のズレを矯正する一
具体策を提示することである。(d) Object of the invention The present invention is to solve the above-mentioned problems. The object of the present invention is to present a concrete measure for correcting the misalignment of the wedge tip or the free end of the wire as described above.

（ｅ）発明の構成 前記の目的は、ワイヤクランパを介してリール巻回のボ
ンディングワイヤをワイヤガイドホール付ボンディング
ウェッジ端へ導出し、半導体チップ電極と接続するボン
ディング方法に於いて、前記ボンディングウェッジ端に
導出されたワイヤ自由端の位置矯正をワイヤクランパに
よりなすことにより達成される。(e) Structure of the Invention The above object is to provide a bonding method in which a bonding wire wound on a reel is guided to an end of a bonding wedge with a wire guide hole through a wire clamper and connected to a semiconductor chip electrode. This is achieved by correcting the position of the free end of the wire led out using a wire clamper.

（ｆ　’）発明の実施例 以下１本発明の実施例を示す第３図と第４図とに従かい
本発明の詳細な説明する。(f') Embodiments of the Invention The present invention will be described in detail below with reference to FIGS. 3 and 4 showing an embodiment of the present invention.

第３図は本発明のウェッジワイヤボンディング方法実施
例を説明する斜視図である。FIG. 3 is a perspective view illustrating an embodiment of the wedge wire bonding method of the present invention.

第３図斜視図に於いて、前記従来ボンディング装置ウェ
ッジ圧接端２に於けるワイヤ３自出端の巻きぐせによる
変位揺動を自在に修正する手段として９図示しないレバ
ー等を操作してワイヤクランパ４を左右に微動させる。In the perspective view of FIG. 3, as a means for freely correcting the displacement and swing caused by the curling of the protruding end of the wire 3 at the pressure welding end 2 of the wedge of the conventional bonding apparatus, a wire clamper is operated by operating a lever or the like (9) not shown. Move 4 slightly to the left and right.

第３図の両方向矢印１３は前記クランパ４の動作方向で
ある。A double-headed arrow 13 in FIG. 3 indicates the direction of movement of the clamper 4.

斯くして、ボンディングワイヤ３は、ウェッジ１のワイ
ヤ貫通のガイドホール５を支点として。In this way, the bonding wire 3 uses the guide hole 5 of the wedge 1 through which the wire passes as a fulcrum.

クランパ４の動きとは逆方向に微動し、ワイヤ自由端の
位置矯正が出来る。作業者は、顕微鏡視野内に係る位置
矯正を確認、即ち、第２図に於けるワイヤ３とボンディ
ングウェッジ１との相対的位置が中央位置にあるを確認
した後、ボンディング作業をなせば意図するチップ電極
幅寸法内にワイヤ接続ゲにきる。It moves slightly in the opposite direction to the movement of the clamper 4, allowing the position of the free end of the wire to be corrected. After confirming the position correction within the field of view of the microscope, that is, confirming that the relative positions of the wire 3 and the bonding wedge 1 in FIG. Wire connection can be made within the width of the chip electrode.

第４図は、前記方法によりワイヤボンデイン？゛が終わ
ったＩＣ基板の側面図である。FIG. 4 shows wire bonding by the method described above. FIG. 3 is a side view of the IC board after the process.

図中、すは前記実施例に掲げた半導体チップ電極と接続
する第１のワイヤボンディング接続点。In the figure, the symbol indicates the first wire bonding connection point connected to the semiconductor chip electrode described in the above embodiment.

又：１５は半導体チップ搭載のＩＣ基板側の第２のワイ
ヤボくディング接続点である。後者第２の接続点のボン
ディングパソトは１寸法上問題はなく。Further, 15 is a second wire boarding connection point on the side of the IC board on which the semiconductor chip is mounted. There was no problem with the bonding process at the latter second connection point in terms of dimensions.

従来同様の、ボンディング加工がされる。Bonding processing is performed in the same way as before.

（ｇ）発明の効果 、以上、詳細、、に説明した本発明のウェッジワイヤボ
ンディング方法によれば、ワイヤガイドボール（第３図
の５参照）のないボンディングウェッジを使用した場合
に比べ作業能率の向上が図られると共に、常にウェッジ
の中心部でボンディングが施行されることになり金線等
の圧痕幅が十分取り得られボンディング強度のバラツキ
も小さくなる等の利点がある。(g) Effects of the Invention According to the wedge wire bonding method of the present invention described above in detail, work efficiency is improved compared to the case of using a bonding wedge without a wire guide ball (see 5 in Fig. 3). In addition to this, since bonding is always performed at the center of the wedge, there are advantages such as a sufficient width of the indentation of the gold wire, etc., and less variation in bonding strength.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はワイヤガイドホール付ボンディングウェッジを
使用するボンディング装置の一部を示す斜視図、第２図
は第１図のボンディングウェッジの圧接端２の矢視方向
正面図、第３図は本発明のウェッジワイヤボンディング
方法実施例を説明する斜視図、及び第４図は第３図によ
り接続したボンディング完成の基板側面図である。 図中、１はボンディングウェッジ、２はｌの圧接端、３
はボンディングワイヤ、４はワイヤクランパ、５はウェ
ッジ１端のワイヤガイドホール。FIG. 1 is a perspective view showing a part of a bonding apparatus using a bonding wedge with a wire guide hole, FIG. 2 is a front view in the direction of arrows of the pressure welding end 2 of the bonding wedge shown in FIG. 1, and FIG. 3 is a view of the present invention. FIG. 4 is a perspective view illustrating an embodiment of the wedge wire bonding method, and FIG. 4 is a side view of the board after bonding is completed according to FIG. 3. In the figure, 1 is the bonding wedge, 2 is the pressure welding end of l, 3
is a bonding wire, 4 is a wire clamper, and 5 is a wire guide hole at one end of the wedge.

Claims (1)

【特許請求の範囲】[Claims] ワイヤクランパを介してリール巻回のボンディング装置
ｉをワイヤガイドホール付ボンデイングウエッピ端へ導
出し、半導体チップ電極と接続するボンディング方法に
於いて、前記ボンディングウェッジ端、蝉導出されたワ
イヤ自由端の位置矯正をワイヤクライバ←よりなすこと
を特徴とするウエンジワイ雪ポンディング方法。In a bonding method in which a reel-wound bonding device i is led out to the end of a bonding wedge with a wire guide hole through a wire clamper and connected to a semiconductor chip electrode, the end of the bonding wedge and the free end of the led out wire are A wenge-wai snow pounding method characterized by correcting the position using a wire climber.
JP58101083A 1983-06-07 1983-06-07 Wedge wire bonding method Pending JPS59225537A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58101083A JPS59225537A (en) 1983-06-07 1983-06-07 Wedge wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58101083A JPS59225537A (en) 1983-06-07 1983-06-07 Wedge wire bonding method

Publications (1)

Publication Number Publication Date
JPS59225537A true JPS59225537A (en) 1984-12-18

Family

ID=14291200

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58101083A Pending JPS59225537A (en) 1983-06-07 1983-06-07 Wedge wire bonding method

Country Status (1)

Country Link
JP (1) JPS59225537A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102844A (en) * 1989-08-11 1991-04-30 Orthodyne Electron Corp Ultrasonic wire bonder

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102844A (en) * 1989-08-11 1991-04-30 Orthodyne Electron Corp Ultrasonic wire bonder

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