JP2682006B2 - Bump forming method - Google Patents
Bump forming methodInfo
- Publication number
- JP2682006B2 JP2682006B2 JP63117205A JP11720588A JP2682006B2 JP 2682006 B2 JP2682006 B2 JP 2682006B2 JP 63117205 A JP63117205 A JP 63117205A JP 11720588 A JP11720588 A JP 11720588A JP 2682006 B2 JP2682006 B2 JP 2682006B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- tool
- circuit board
- bump
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 この発明は回路基板上に形成された電極に突起（以下
バンプと記す）を形成する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming protrusions (hereinafter referred to as bumps) on electrodes formed on a circuit board.
従来の技術 近年、ICの基板への実装方法としてICの電極にバンプ
を形成し、このバンプと基板パターンやフィルム状のキ
ャリアとを一括ボンディングする方法が多く用いられて
きた。2. Description of the Related Art In recent years, as a method of mounting an IC on a substrate, a method of forming a bump on an electrode of the IC and collectively bonding the bump and a substrate pattern or a film-like carrier has been widely used.
ICにバンプをつける方法として、従来の技術について
説明する。第２図はIC11に蒸着，メッキによりバンプを
形成する工程を示したもので、まずIC11の電極12にCr膜
13,Cu膜14,Au膜15を順次蒸着により形成し、その後Auメ
ッキを行ない、IC電極上に13〜25μｍのバンプ16の形成
を行なう（日本マイクロエレクトロニクス協会「IC化実
装技術」1984.2.20P109）。A conventional technique will be described as a method of bumping an IC. Figure 2 shows the process of forming bumps on IC11 by vapor deposition and plating. First, Cr film is formed on electrode 12 of IC11.
13, Cu film 14 and Au film 15 are sequentially formed by vapor deposition, and then Au plating is performed to form bumps 16 of 13 to 25 μm on the IC electrodes (Japan Microelectronics Association “IC Packaging Technology” 1984.2.20P109 ).
発明が解決しようとする課題 しかしながら、上記のようにIC側にバンプを形成する
際、蒸着，メッキ等の複雑な処理があり、これにかかる
設備が高価であり工程費が高くなるという課題を有して
いた。SUMMARY OF THE INVENTION However, when forming bumps on the IC side as described above, there are complicated processes such as vapor deposition and plating, and the equipment related thereto is expensive and the process cost is high. Was.
本発明は、上記問題点に鑑み、IC側にバンプを形成せ
ず、回路基板上に形成された電極にバンプを形成するこ
とにより、蒸着，メッキ等の処理工程のないバンプの形
成方法を提供するものである。In view of the above problems, the present invention provides a bump forming method that does not require a processing step such as vapor deposition and plating by forming bumps on electrodes formed on a circuit board without forming bumps on the IC side. To do.
課題を解決するための手段 上記問題を解決するために、本発明のバンプ形成方法
は、ワイヤ接合面に向かってワイヤを案内するガイド穴
を形成された第１ツールと、この第１ツールと絶縁体を
介して対向し、かつワイヤ接合面と同一平面上に先端の
ある第２ツールと、これら第１ツール及び第２ツールに
接続された溶接電源とを備えたワイヤ接合ツールをバン
プ形成方法であって、バンプ形成用のワイヤを繰り出す
工程と、回路基板の電極とワイヤとの相対位置決めを行
い両者をワイヤ接合ツールにて接合する工程と、前記ワ
イヤを回路基板の電極との接合部にその一部を残して切
断する工程とからなるものである。Means for Solving the Problems In order to solve the above-mentioned problems, a bump forming method of the present invention is a first tool having a guide hole for guiding a wire toward a wire bonding surface, and the first tool is insulated from the first tool. A bump forming method for a wire joining tool including a second tool facing the body and having a tip on the same plane as the wire joining surface, and a welding power source connected to the first tool and the second tool. Therefore, the step of feeding out the wire for forming bumps, the step of performing relative positioning between the electrode and the wire of the circuit board and joining them with a wire joining tool, and the step of connecting the wire to the electrode of the circuit board And a step of cutting with a part left.
作用 本発明は上記構成により、ワイヤを回路基板上に形成
された電極に接合しバンプを形成するとともに、ワイヤ
を切断することによってバンプを必要な場所にのみ形成
するものである。Action The present invention has the above-described structure, in which the wire is bonded to the electrode formed on the circuit board to form a bump, and the wire is cut to form the bump only in a necessary place.
実施例 以下本発明の一実施例のバンプ形成及び装置につい
て、図面を参照しながら説明する。Embodiments A bump formation and apparatus according to an embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の一実施例におけるバンプ形成装置を
示すものである。第１図において、１はワイヤ接合面に
向かってワイヤを案内するガイド穴を形成されたツー
ル、２はこのツール１と対向しかつワイヤ接合面と同一
平面上に先端のあるツール、11は両ツール1,2間にはさ
まれた絶縁体、３はバンプ形成用のワイヤ（主にAu
線）、４はワイヤクランパ、５は接合ツール1,2に接続
された溶接電源であり、ワイヤ３をワイヤ接合ツール１
に繰り出す工程とワイヤを切断する手段とを構成する。
６は回転機能を有するヘッド、７は回路基板、８は回路
基板７上に形成された電極、９は基板ホルダー、10は基
板移動用X,Yテーブルであり、ワイヤクランプ４は図中
矢印方向に移動可能に構成されている。FIG. 1 shows a bump forming apparatus according to an embodiment of the present invention. In FIG. 1, 1 is a tool in which a guide hole is formed for guiding a wire toward a wire joining surface, 2 is a tool facing the tool 1 and having a tip on the same plane as the wire joining surface, and 11 is both Insulator sandwiched between tools 1 and 2, 3 is a wire for bump formation (mainly Au
Wire), 4 is a wire clamper, 5 is a welding power source connected to the welding tools 1 and 2, and the wire 3 is a wire welding tool 1
And a means for cutting the wire.
6 is a head having a rotating function, 7 is a circuit board, 8 is an electrode formed on the circuit board 7, 9 is a board holder, 10 is a board moving X, Y table, and the wire clamp 4 is in the direction of the arrow in the drawing. It is configured to be movable.
以上のように構成されたバンプ形成装置について、以
下第１図及び第３図を用いてその動作を説明する。The operation of the bump forming apparatus configured as described above will be described below with reference to FIGS. 1 and 3.
まず、第３図（ｉ）〜（ｖ）は本発明によるバンプ形
成方法の一サイクルを示すものであって、（ａ）の原点
において、接合ツール１および２の下にワイヤクランパ
ー４により繰り出され、接合ツール１および２は第１図
のX,Yテーブル10により回路基板上に形成された電極８
上に位置決めされている。次に（ｂ）のように接合ツー
ル１および２がヘッド部６の下降動作によりワイヤ３を
介して回路基板７上の電極８上に圧接し、溶接電源５に
より両ツール1,2間に通電することにより、ツール1,2と
ワイヤ３の接触抵抗及びツール1,2の抵抗によりジュー
ル熱を発生させ、ワイヤ３を回路基板７上の電極８上に
ボンディング接合する。ボンディング接合後、ツール１
および２がワイヤ３を押えた状態で（ｃ）のようにクラ
ンパ４がワイヤを保持したまま、第３図（iii）の図示
矢印方向へ移動しワイヤ３を切断し回路基板７の電極８
上へのバンプ21の形成が完了する。その後（ｄ）のよう
に接合ツール１および２、ヘッド部６が上昇し、クラン
パ４はここでワイヤ３を解放し、矢印方向へバンプ21を
形成するのに使用したワイヤ長さ分だけ移動しワイヤ３
を再び保持し、（ｅ）のように再びクランパ４は矢印方
向へ移動し（ａ）の原点位置へ復帰し、ワイヤ３をツー
ル１および２の下へ繰り出す。一方、回路基板７はX,Y
テーブル10,回転機能を有するヘッド部６により次の電
極８を、接合ツール１および２の下方に移動させ、この
サイクルを繰り返すことにより、回路基板７上の電極８
上にバンプ21を連続的にしかも任意の方向に形成する。
また、第３図（ｃ）のワイヤ切断工程では、接合ツール
１にワイヤ３に切欠を入れ切断部分の安定を図るため、
突起が設けられている。First, FIGS. 3 (i) to 3 (v) show one cycle of the bump forming method according to the present invention. At the origin of FIG. 3 (a), the wire clamper 4 extends below the welding tools 1 and 2. , The bonding tools 1 and 2 are electrodes 8 formed on the circuit board by the X, Y table 10 of FIG.
It is positioned on top. Next, as shown in (b), the welding tools 1 and 2 are brought into pressure contact with the electrodes 8 on the circuit board 7 via the wires 3 by the descending operation of the head portion 6, and the welding power source 5 supplies electricity between the tools 1 and 2. By doing so, Joule heat is generated by the contact resistance between the tools 1 and 2 and the wires 3 and the resistance of the tools 1 and 2, and the wires 3 are bonded to the electrodes 8 on the circuit board 7 by bonding. After bonding, tool 1
While 2 and 2 hold the wire 3 while the clamper 4 holds the wire as shown in (c), the clamper 4 moves in the direction of the arrow in FIG. 3 (iii) to cut the wire 3 and cut the electrode 8 of the circuit board 7.
The formation of the bumps 21 on the top is completed. Thereafter, as shown in (d), the welding tools 1 and 2 and the head portion 6 are lifted, and the clamper 4 releases the wire 3 and moves in the arrow direction by the length of the wire used to form the bump 21. Wire 3
Is held again, the clamper 4 again moves in the direction of the arrow as shown in (e), returns to the origin position in (a), and the wire 3 is fed below the tools 1 and 2. On the other hand, the circuit board 7 is X, Y
The electrode 8 on the circuit board 7 is moved by moving the next electrode 8 below the welding tools 1 and 2 by the table 10 and the head portion 6 having a rotating function and repeating this cycle.
The bumps 21 are continuously formed on the upper surface in arbitrary directions.
Further, in the wire cutting step of FIG. 3 (c), in order to make a cut in the wire 3 in the welding tool 1 and to stabilize the cut portion,
Protrusions are provided.
発明の効果 以上のように本発明は、ワイヤ接合面に向かってワイ
ヤを案内するガイド穴を形成されたツールと、このツー
ルと対向しかつワイヤ接合面に向かってワイヤ接合面と
同一平面上に先端のあるツールと、これらツールに接続
された溶接電源とを備えたワイヤ接合ツールを用いたバ
ンプ形成方法であって、バンプ形成用のワイヤを繰り出
す工程と、回路基板上に形成された電極とワイヤとの相
対位置決めを行ない、両者をワイヤ接合ツールにて接合
する工程と、前記ワイヤを回路基板上の電極との接合部
にその一部を残して切断する工程とからなるバンプ形成
方法であるため、IC側の電極でのバンプ形成の際の蒸
着，メッキおよびこれらに付随する廃液処理工程や装置
が不要となり、工程費が低減される。また回路基板の電
極にバンプ形成ができるため、IC実装の際、良品のICの
みの実装を行なうことにより、材料歩留りの著しい向上
が図れる。EFFECTS OF THE INVENTION As described above, the present invention provides a tool having a guide hole for guiding a wire toward a wire joining surface, and a tool facing the tool and facing the wire joining surface on the same plane as the wire joining surface. A bump forming method using a wire bonding tool equipped with a tool having a tip and a welding power source connected to these tools, the step of feeding out a wire for bump formation, and an electrode formed on a circuit board. A bump forming method comprising: a step of performing relative positioning with respect to a wire and joining them with a wire joining tool; and a step of cutting the wire while leaving a part of the wire at a joining portion with an electrode on a circuit board. Therefore, the vapor deposition and plating for forming bumps on the electrodes on the IC side and the waste liquid treatment process and equipment accompanying them are unnecessary, and the process cost is reduced. Further, since bumps can be formed on the electrodes of the circuit board, the material yield can be significantly improved by mounting only good ICs when mounting the ICs.
なおワイヤ接合ツールにワイヤと回路基板上の電極の
接合時にワイヤに切欠をつける突起を設けるようにすれ
ばワイヤの切断部分が安定し、又ヘッド部を水平面上で
回転可能に構成すれば、任意の方向にバンプを形成する
ことができる効果が得られる。If the wire joining tool is provided with a protrusion that cuts the wire when joining the wire and the electrode on the circuit board, the cut portion of the wire will be stable, and if the head part is configured to be rotatable on a horizontal plane, it is optional. The effect that a bump can be formed in the direction of is obtained.
第１図は本発明の第１の実施例におけるバンプ形成装置
の構成図、第２図は従来のバンプ形成方法の工程図、第
３図は本発明の一実施例のバンプ形成方法の工程図であ
る。 1,2……接合ツール、３……ワイヤ、４……ワイヤクラ
ンパ、５……溶接電源、７……回路基板、21……バン
プ。FIG. 1 is a configuration diagram of a bump forming apparatus in a first embodiment of the present invention, FIG. 2 is a process diagram of a conventional bump forming method, and FIG. 3 is a process diagram of a bump forming method of an embodiment of the present invention. Is. 1, 2 ...... Joining tool, 3 ...... Wire, 4 ...... Wire clamper, 5 ...... Welding power source, 7 ...... Circuit board, 21 ...... Bump.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平１−280339（ＪＰ，Ａ) 特開 昭59−208751（ＪＰ，Ａ) 特開 昭61−242045（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP-A-1-280339 (JP, A) JP-A-59-208751 (JP, A) JP-A-61-242045 (JP, A)
Claims (1)
ガイド穴を形成された第１ツールと、この第１ツールと
絶縁体を介して対向し、かつワイヤ接合面と同一平面上
に先端のある第２ツールと、これら第１ツール及び第２
ツールに接続された溶接電源とを備えたワイヤ接合ツー
ルをバンプ形成方法であって、 バンプ形成用のワイヤを繰り出す工程と、回路基板の電
極とワイヤとの相対位置決めを行い両者をワイヤ接合ツ
ールにて接合する工程と、前記ワイヤを回路基板の電極
との接合部にその一部を残して切断する工程とからなる
バンプ形成方法。1. A first tool having a guide hole for guiding a wire toward a wire joining surface, and a first tool facing the first tool via an insulator and coplanar with the wire joining surface. A second tool, and these first and second tools
A method of forming a wire bonding tool equipped with a welding power source connected to the tool, which is a method of forming a wire for forming a bump, and performing relative positioning of an electrode and a wire on a circuit board to form a wire bonding tool. And a step of cutting the wire while leaving a part of the wire at a bonding portion with the electrode of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63117205A JP2682006B2 (en) | 1988-05-13 | 1988-05-13 | Bump forming method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63117205A JP2682006B2 (en) | 1988-05-13 | 1988-05-13 | Bump forming method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01286450A JPH01286450A (en) | 1989-11-17 |
| JP2682006B2 true JP2682006B2 (en) | 1997-11-26 |
Family
ID=14705989
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63117205A Expired - Lifetime JP2682006B2 (en) | 1988-05-13 | 1988-05-13 | Bump forming method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2682006B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03208354A (en) * | 1990-01-10 | 1991-09-11 | Mitsubishi Electric Corp | Semiconductor device and manufacture thereof |
| JP2852134B2 (en) * | 1991-02-20 | 1999-01-27 | 日本電気株式会社 | Bump forming method |
-
1988
- 1988-05-13 JP JP63117205A patent/JP2682006B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01286450A (en) | 1989-11-17 |
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