JPS59213196A - 接着剤付き銅箔 - Google Patents

接着剤付き銅箔

Info

Publication number
JPS59213196A
JPS59213196A JP58085947A JP8594783A JPS59213196A JP S59213196 A JPS59213196 A JP S59213196A JP 58085947 A JP58085947 A JP 58085947A JP 8594783 A JP8594783 A JP 8594783A JP S59213196 A JPS59213196 A JP S59213196A
Authority
JP
Japan
Prior art keywords
adhesive
copper foil
strength
adhesive layer
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58085947A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0412638B2 (enExample
Inventor
健治 大沢
正美 石井
安田　誠之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP58085947A priority Critical patent/JPS59213196A/ja
Publication of JPS59213196A publication Critical patent/JPS59213196A/ja
Publication of JPH0412638B2 publication Critical patent/JPH0412638B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Adhesive Tapes (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
JP58085947A 1983-05-18 1983-05-18 接着剤付き銅箔 Granted JPS59213196A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58085947A JPS59213196A (ja) 1983-05-18 1983-05-18 接着剤付き銅箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58085947A JPS59213196A (ja) 1983-05-18 1983-05-18 接着剤付き銅箔

Publications (2)

Publication Number Publication Date
JPS59213196A true JPS59213196A (ja) 1984-12-03
JPH0412638B2 JPH0412638B2 (enExample) 1992-03-05

Family

ID=13872953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58085947A Granted JPS59213196A (ja) 1983-05-18 1983-05-18 接着剤付き銅箔

Country Status (1)

Country Link
JP (1) JPS59213196A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07122851A (ja) * 1993-10-25 1995-05-12 Hitachi Chem Co Ltd 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法
US5544773A (en) * 1991-09-06 1996-08-13 Haruta; Youichi Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103182A (en) * 1975-03-10 1976-09-11 Nippon Catalytic Chem Ind Dobarisekisobanno seizoho

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51103182A (en) * 1975-03-10 1976-09-11 Nippon Catalytic Chem Ind Dobarisekisobanno seizoho

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5544773A (en) * 1991-09-06 1996-08-13 Haruta; Youichi Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
JPH07122851A (ja) * 1993-10-25 1995-05-12 Hitachi Chem Co Ltd 接着剤付き銅はく及びこの接着剤付き銅はくを用いた多層プリント配線板用銅張り積層板の製造方法

Also Published As

Publication number Publication date
JPH0412638B2 (enExample) 1992-03-05

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