JPS5921086A - Method of producing printed circuit boared - Google Patents
Method of producing printed circuit boaredInfo
- Publication number
- JPS5921086A JPS5921086A JP13140882A JP13140882A JPS5921086A JP S5921086 A JPS5921086 A JP S5921086A JP 13140882 A JP13140882 A JP 13140882A JP 13140882 A JP13140882 A JP 13140882A JP S5921086 A JPS5921086 A JP S5921086A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- pattern
- boared
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
（ａ）発明の技術分野
本発明は印刷配線板の製作方法、特に印刷配線板の端部
に金鍍金を行うための印刷配線板の製作方法の改良に関
するものである。Detailed Description of the Invention (a) Technical Field of the Invention The present invention relates to a method for manufacturing a printed wiring board, and particularly to an improvement in a method for manufacturing a printed wiring board for applying gold plating to the edges of the printed wiring board. .
（ｂ）従来技術と問題点
従来印刷配線板の端子に金鍍金を行うのには、第１図に
示すように、所要とするプリント板１の外側に端子群２
の供電用パターン３を設け、このパターンの端部に給電
用電極４を設けて、この給電用電極４より金鍍金を行う
電流を供給し、金鍍金完了後プリント板１を外形に沿っ
て切取って作製していた。しかしながらこの従来の方法
にては外形を切取るのに時間を要するといった欠点があ
り、又第２図に示すようなプリント板１の外周部に接し
ない島状の端子２−１にはこの方法は好ましくなく、こ
れに対処するために各端子２と２−１とにパターン３−
１を設けこのパターン３−１に給電用電極として導電性
ゴムを圧接してこのゴムを介して給電するといった方法
が採用されている。しかしながらこの方法は印刷配線板
上にこのゴムを収容する面積を要し、印刷配線板の高密
度化を阻害するのみならず、圧接により接触抵抗に変化
をもたらしこれまた取扱い工数が増大するといった欠点
があった。(b) Prior art and problems In order to gold plate the terminals of a conventional printed wiring board, as shown in FIG.
A power supply pattern 3 is provided, a power supply electrode 4 is provided at the end of this pattern, a current for gold plating is supplied from this power supply electrode 4, and after gold plating is completed, the printed board 1 is cut along the outer shape. I was taking it and making it. However, this conventional method has the disadvantage that it takes time to cut out the outer shape, and this method is not suitable for island-shaped terminals 2-1 that do not touch the outer periphery of the printed board 1 as shown in FIG. is not preferable, and in order to deal with this, pattern 3- is applied to each terminal 2 and 2-1.
1 is provided, a conductive rubber is pressed into contact with this pattern 3-1 as a power supply electrode, and power is supplied through this rubber. However, this method requires an area on the printed wiring board to accommodate this rubber, which not only impedes the high density of the printed wiring board, but also has the disadvantage that contact resistance changes due to pressure bonding, which also increases the number of handling steps. was there.
（ｃ）発明の目的
本発明は上記従来の欠点に鑑み、能率よくかつ品質のよ
い鍍金の行える印刷配線板の製作方法を提供することを
目的とするものである。(c) Purpose of the Invention In view of the above-mentioned conventional drawbacks, the object of the present invention is to provide a method for producing a printed wiring board that can be plated efficiently and with good quality.
（ｄ）発明の構成
簡単に述べると、本発明は被鍍金箇所に給電用短絡パタ
ーンを付設しこの短絡用パターンを介し給電し鍍金を行
い、鍍金完了後この短絡用パターンを切断することを特
徴とするものであり、品質のよい印刷配線板が得られる
。(d) Structure of the Invention Briefly stated, the present invention is characterized in that a power supply short circuit pattern is attached to the part to be plated, power is supplied through this short circuit pattern to perform plating, and the short circuit pattern is cut after plating is completed. Therefore, a printed wiring board of good quality can be obtained.
（ｅ）発明の実施例 以下本発明の実施例を図によって詳細に説明する。(e) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.
第３図は本発明の印刷配線板の製作方法を説明する一実
施例の平面図、第４図は本発明の他の実施例を示す平面
図であり、従来例と同一筒所は同符号を用い、その説明
を省略する。FIG. 3 is a plan view of one embodiment for explaining the method of manufacturing a printed wiring board of the present invention, and FIG. 4 is a plan view of another embodiment of the present invention. will be used, and its explanation will be omitted.
図において、５と６は短絡用パターンを示す。In the figure, 5 and 6 indicate short circuit patterns.
第３図は第１図に示すように給電用パターン３が印刷配
線板１の端子２側の外部に設けられた場合であり、この
印刷配線板１に島状端子２−１がある場合に、端子２と
島状端子２−１を短絡する短絡用パターン５を付設する
。いうまでもなく供給用電極４よりの給電が給電用パタ
ーン３と端子２と短絡用パターン５を介して島状端子２
−１に行われ、鍍金される。鍍金完了後図に示すように
Ａ点にて短絡用パターン３を切断する。FIG. 3 shows a case where the power feeding pattern 3 is provided outside the terminal 2 side of the printed wiring board 1 as shown in FIG. 1, and when this printed wiring board 1 has an island terminal 2-1, , a short-circuiting pattern 5 is attached to short-circuit the terminal 2 and the island-shaped terminal 2-1. Needless to say, power is supplied from the supply electrode 4 to the island-shaped terminal 2 via the power supply pattern 3, the terminal 2, and the short circuit pattern 5.
-1 and plated. After plating is completed, the short circuit pattern 3 is cut at point A as shown in the figure.
第４図は第３図と同一であり異なる部分は島状の端子が
数多い場合であり、印刷配線板１内に短絡用パターン６
を設けた点であり、前図と同一効果を得る。FIG. 4 is the same as FIG. 3, and the difference is that there are many island-shaped terminals, and there are short circuit patterns 6 in the printed wiring board 1.
, and the same effect as in the previous figure is obtained.
（ｆ）発明の効果
以上、詳細に説明したように、本発明の印刷配線板の製
作方法は能率がよく、かつ島状の端子の鍍金に接触部を
用いず結果として鍍金品質のよいものとなり、印刷配線
板を制作する上で利点の多いものとなる。(f) Effects of the Invention As explained in detail above, the method for manufacturing a printed wiring board of the present invention is efficient and does not use contact parts for plating island-shaped terminals, resulting in good plating quality. , which has many advantages in producing printed wiring boards.
第１図と第２図は従来の製作方法を示す平面図、第３図
は本発明の印刷配線板の製作方法を説明する一実施例の
平面図、第４図は本発明の他の実施例を示す平面図であ
る。
図において、１は印刷配線板、４は供給用電極、５と６
は短絡用パターンをそれぞれ示す。
第１図
第２図
−１
第３図
第４図1 and 2 are plan views showing a conventional manufacturing method, FIG. 3 is a plan view of an embodiment illustrating the method of manufacturing a printed wiring board of the present invention, and FIG. 4 is a plan view of another embodiment of the present invention. FIG. 3 is a plan view showing an example. In the figure, 1 is a printed wiring board, 4 is a supply electrode, 5 and 6
indicate short-circuit patterns. Figure 1 Figure 2-1 Figure 3 Figure 4
Claims (1)
電用短絡パターンを付設し該短絡用パターンを介し給電
し前記被鍍金箇所に鍍金を行い、前記短絡用パターンを
切断して所要の鍍金を行うことを特徴とする印刷配線板
の製作方法。This is a method of plating a printed wiring board, in which a short-circuit pattern for power supply is attached to the part to be plated, power is supplied through the short-circuit pattern, the part to be plated is plated, and the short-circuit pattern is cut to form the required pattern. A method for manufacturing a printed wiring board, characterized by performing plating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13140882A JPS5921086A (en) | 1982-07-27 | 1982-07-27 | Method of producing printed circuit boared |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13140882A JPS5921086A (en) | 1982-07-27 | 1982-07-27 | Method of producing printed circuit boared |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5921086A true JPS5921086A (en) | 1984-02-02 |
Family
ID=15057268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13140882A Pending JPS5921086A (en) | 1982-07-27 | 1982-07-27 | Method of producing printed circuit boared |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5921086A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0550766U (en) * | 1991-12-11 | 1993-07-02 | 日本航空電子工業株式会社 | Flexible flat electrical components |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423971A (en) * | 1977-07-26 | 1979-02-22 | Oki Electric Ind Co Ltd | Method of plating connector for print wire board |
-
1982
- 1982-07-27 JP JP13140882A patent/JPS5921086A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5423971A (en) * | 1977-07-26 | 1979-02-22 | Oki Electric Ind Co Ltd | Method of plating connector for print wire board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0550766U (en) * | 1991-12-11 | 1993-07-02 | 日本航空電子工業株式会社 | Flexible flat electrical components |
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