JPS59210647A - ペレツトボンデイング装置 - Google Patents

ペレツトボンデイング装置

Info

Publication number
JPS59210647A
JPS59210647A JP8452583A JP8452583A JPS59210647A JP S59210647 A JPS59210647 A JP S59210647A JP 8452583 A JP8452583 A JP 8452583A JP 8452583 A JP8452583 A JP 8452583A JP S59210647 A JPS59210647 A JP S59210647A
Authority
JP
Japan
Prior art keywords
pellet
bonding
substrate
pellets
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8452583A
Other languages
English (en)
Japanese (ja)
Other versions
JPH04384B2 (enrdf_load_stackoverflow
Inventor
Kiyoshi Mayahara
馬屋原　潔
Yoshio Yamaguchi
山口　義夫
Takeichi Yoshida
吉田　竹一
Yutaka Makino
豊 牧野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP8452583A priority Critical patent/JPS59210647A/ja
Publication of JPS59210647A publication Critical patent/JPS59210647A/ja
Publication of JPH04384B2 publication Critical patent/JPH04384B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP8452583A 1983-05-14 1983-05-14 ペレツトボンデイング装置 Granted JPS59210647A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8452583A JPS59210647A (ja) 1983-05-14 1983-05-14 ペレツトボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8452583A JPS59210647A (ja) 1983-05-14 1983-05-14 ペレツトボンデイング装置

Publications (2)

Publication Number Publication Date
JPS59210647A true JPS59210647A (ja) 1984-11-29
JPH04384B2 JPH04384B2 (enrdf_load_stackoverflow) 1992-01-07

Family

ID=13833051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8452583A Granted JPS59210647A (ja) 1983-05-14 1983-05-14 ペレツトボンデイング装置

Country Status (1)

Country Link
JP (1) JPS59210647A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6081834A (ja) * 1983-10-12 1985-05-09 Sony Corp チツプ部品の装着装置
JPS61186235U (enrdf_load_stackoverflow) * 1985-05-10 1986-11-20

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494876A (en) * 1978-01-12 1979-07-26 Toshiba Corp Multicollet holder
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5494876A (en) * 1978-01-12 1979-07-26 Toshiba Corp Multicollet holder
JPS55165643A (en) * 1979-06-12 1980-12-24 Fujitsu Ltd Device for bonding pellet
JPS5763836A (en) * 1980-10-04 1982-04-17 Shinkawa Ltd Die bonding apparatus

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6081834A (ja) * 1983-10-12 1985-05-09 Sony Corp チツプ部品の装着装置
JPS61186235U (enrdf_load_stackoverflow) * 1985-05-10 1986-11-20

Also Published As

Publication number Publication date
JPH04384B2 (enrdf_load_stackoverflow) 1992-01-07

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