JPS59191755A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物Info
- Publication number
- JPS59191755A JPS59191755A JP6719683A JP6719683A JPS59191755A JP S59191755 A JPS59191755 A JP S59191755A JP 6719683 A JP6719683 A JP 6719683A JP 6719683 A JP6719683 A JP 6719683A JP S59191755 A JPS59191755 A JP S59191755A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- resin composition
- acid amide
- acid
- mold release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 26
- 239000000203 mixture Substances 0.000 title claims description 20
- 150000001408 amides Chemical class 0.000 claims abstract description 13
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims abstract description 10
- 150000004668 long chain fatty acids Chemical class 0.000 claims abstract description 8
- 229910021529 ammonia Inorganic materials 0.000 claims abstract description 5
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 claims abstract description 3
- 239000006082 mold release agent Substances 0.000 claims description 13
- -1 stearic acid ethylene bisamide Chemical compound 0.000 claims description 6
- 150000001412 amines Chemical class 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- ORAWFNKFUWGRJG-UHFFFAOYSA-N Docosanamide Chemical compound CCCCCCCCCCCCCCCCCCCCCC(N)=O ORAWFNKFUWGRJG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 235000021355 Stearic acid Nutrition 0.000 claims description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 2
- 239000008117 stearic acid Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 12
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000007789 sealing Methods 0.000 abstract description 3
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 9
- 239000001993 wax Substances 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 4
- 235000014113 dietary fatty acids Nutrition 0.000 description 4
- 239000000194 fatty acid Substances 0.000 description 4
- 229930195729 fatty acid Natural products 0.000 description 4
- 150000004665 fatty acids Chemical class 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 1
- 239000008116 calcium stearate Substances 0.000 description 1
- 235000013539 calcium stearate Nutrition 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6719683A JPS59191755A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6719683A JPS59191755A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59191755A true JPS59191755A (ja) | 1984-10-30 |
| JPS6257651B2 JPS6257651B2 (enrdf_load_stackoverflow) | 1987-12-02 |
Family
ID=13337905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6719683A Granted JPS59191755A (ja) | 1983-04-15 | 1983-04-15 | エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59191755A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06200127A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
| JPH06199996A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
| JPH11100487A (ja) * | 1997-09-25 | 1999-04-13 | Matsushita Electric Works Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002265571A (ja) * | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002275245A (ja) * | 2001-03-19 | 2002-09-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH035351U (enrdf_load_stackoverflow) * | 1989-05-31 | 1991-01-18 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS5652941A (en) * | 1979-10-08 | 1981-05-12 | Nissan Motor Co Ltd | Receiving device for vehicle |
| JPS5875853A (ja) * | 1981-10-30 | 1983-05-07 | Toshiba Corp | 樹脂封止型半導体装置 |
-
1983
- 1983-04-15 JP JP6719683A patent/JPS59191755A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55165655A (en) * | 1979-06-12 | 1980-12-24 | Toshiba Corp | Semiconductor device sealed up with resin |
| JPS5652941A (en) * | 1979-10-08 | 1981-05-12 | Nissan Motor Co Ltd | Receiving device for vehicle |
| JPS5875853A (ja) * | 1981-10-30 | 1983-05-07 | Toshiba Corp | 樹脂封止型半導体装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06200127A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
| JPH06199996A (ja) * | 1993-01-07 | 1994-07-19 | Matsushita Electric Works Ltd | 封止用エポキシ樹脂成形材料 |
| JPH11100487A (ja) * | 1997-09-25 | 1999-04-13 | Matsushita Electric Works Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002265571A (ja) * | 2001-03-14 | 2002-09-18 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
| JP2002275245A (ja) * | 2001-03-19 | 2002-09-25 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6257651B2 (enrdf_load_stackoverflow) | 1987-12-02 |
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