JPS59190717A - 近接スイツチ - Google Patents

近接スイツチ

Info

Publication number
JPS59190717A
JPS59190717A JP58065921A JP6592183A JPS59190717A JP S59190717 A JPS59190717 A JP S59190717A JP 58065921 A JP58065921 A JP 58065921A JP 6592183 A JP6592183 A JP 6592183A JP S59190717 A JPS59190717 A JP S59190717A
Authority
JP
Japan
Prior art keywords
proximity switch
lead frame
proximity
switch
detection coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58065921A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0435859B2 (cg-RX-API-DMAC10.html
Inventor
Takahiro Sakakino
榊野　隆弘
Hiroyuki Yamazaki
博行 山崎
Kenji Ueda
建治 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Tateisi Electronics Co
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tateisi Electronics Co, Omron Tateisi Electronics Co filed Critical Tateisi Electronics Co
Priority to JP58065921A priority Critical patent/JPS59190717A/ja
Publication of JPS59190717A publication Critical patent/JPS59190717A/ja
Publication of JPH0435859B2 publication Critical patent/JPH0435859B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/421—
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/94—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the way in which the control signals are generated
    • H03K17/945—Proximity switches
    • H03K17/95—Proximity switches using a magnetic detector
    • H03K17/9505—Constructional details
    • H10W72/07551—
    • H10W72/50—
    • H10W72/5449—
    • H10W90/756—

Landscapes

  • Coils Or Transformers For Communication (AREA)
  • Switches That Are Operated By Magnetic Or Electric Fields (AREA)
  • Electronic Switches (AREA)
JP58065921A 1983-04-13 1983-04-13 近接スイツチ Granted JPS59190717A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58065921A JPS59190717A (ja) 1983-04-13 1983-04-13 近接スイツチ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58065921A JPS59190717A (ja) 1983-04-13 1983-04-13 近接スイツチ

Publications (2)

Publication Number Publication Date
JPS59190717A true JPS59190717A (ja) 1984-10-29
JPH0435859B2 JPH0435859B2 (cg-RX-API-DMAC10.html) 1992-06-12

Family

ID=13300913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58065921A Granted JPS59190717A (ja) 1983-04-13 1983-04-13 近接スイツチ

Country Status (1)

Country Link
JP (1) JPS59190717A (cg-RX-API-DMAC10.html)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710919A3 (de) * 1994-10-21 1997-03-26 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
WO1998013869A1 (de) * 1996-09-26 1998-04-02 Sican Gesellschaft Für Silizium-Anwendungen Und Cad/Cat Niedersachsen Mbh Integrierte schaltung mit einem induktiven bauelement
EP0902472A3 (en) * 1997-09-15 2000-10-18 Microchip Technology Inc. Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
EP1091404A1 (en) * 1999-10-06 2001-04-11 Lucent Technologies Inc. Multifunction lead frame and integrated circuit package incorporating the same
WO2006085363A1 (ja) * 2005-02-09 2006-08-17 Renesas Technology Corp. 半導体装置及び電子回路
JP2008543092A (ja) * 2005-06-03 2008-11-27 インターナショナル・ビジネス・マシーンズ・コーポレーション ミリメートル波アプリケーションのためのアンテナを集積回路チップと共にパッケージングするための装置及び方法
JP2012234986A (ja) * 2011-05-02 2012-11-29 Shindengen Electric Mfg Co Ltd インダクタ一体型リードフレーム、並びに、電子回路モジュール及びその製造方法
WO2016026476A1 (de) * 2014-08-22 2016-02-25 Balluff Gmbh Induktiver näherungssensor in integrierter bauweise

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710919A3 (de) * 1994-10-21 1997-03-26 Giesecke & Devrient Gmbh Kontaktloses elektronisches Modul
US5946198A (en) * 1994-10-21 1999-08-31 Giesecke & Devrient Gmbh Contactless electronic module with self-supporting metal coil
WO1998013869A1 (de) * 1996-09-26 1998-04-02 Sican Gesellschaft Für Silizium-Anwendungen Und Cad/Cat Niedersachsen Mbh Integrierte schaltung mit einem induktiven bauelement
EP0902472A3 (en) * 1997-09-15 2000-10-18 Microchip Technology Inc. Combination inductive coil and integrated circuit semiconductor chip in a single lead frame package and method therefor
EP1091404A1 (en) * 1999-10-06 2001-04-11 Lucent Technologies Inc. Multifunction lead frame and integrated circuit package incorporating the same
WO2006085363A1 (ja) * 2005-02-09 2006-08-17 Renesas Technology Corp. 半導体装置及び電子回路
JP2008543092A (ja) * 2005-06-03 2008-11-27 インターナショナル・ビジネス・マシーンズ・コーポレーション ミリメートル波アプリケーションのためのアンテナを集積回路チップと共にパッケージングするための装置及び方法
JP2012234986A (ja) * 2011-05-02 2012-11-29 Shindengen Electric Mfg Co Ltd インダクタ一体型リードフレーム、並びに、電子回路モジュール及びその製造方法
WO2016026476A1 (de) * 2014-08-22 2016-02-25 Balluff Gmbh Induktiver näherungssensor in integrierter bauweise
US10298230B2 (en) 2014-08-22 2019-05-21 Balluff Gmbh Inductive proximity sensor of integrated design

Also Published As

Publication number Publication date
JPH0435859B2 (cg-RX-API-DMAC10.html) 1992-06-12

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