JPS59189636A - トランスフアモ−ルド半導体部品製造方法およびその装置 - Google Patents

トランスフアモ−ルド半導体部品製造方法およびその装置

Info

Publication number
JPS59189636A
JPS59189636A JP6362183A JP6362183A JPS59189636A JP S59189636 A JPS59189636 A JP S59189636A JP 6362183 A JP6362183 A JP 6362183A JP 6362183 A JP6362183 A JP 6362183A JP S59189636 A JPS59189636 A JP S59189636A
Authority
JP
Japan
Prior art keywords
tablet
resin
pot
plunger
shaped resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6362183A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6359534B2 (enrdf_load_stackoverflow
Inventor
Koji Tsuchiya
孝司 土屋
Junichi Saeki
準一 佐伯
Aizo Kaneda
金田　愛三
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical Hitachi Ltd
Priority to JP6362183A priority Critical patent/JPS59189636A/ja
Publication of JPS59189636A publication Critical patent/JPS59189636A/ja
Publication of JPS6359534B2 publication Critical patent/JPS6359534B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP6362183A 1983-04-13 1983-04-13 トランスフアモ−ルド半導体部品製造方法およびその装置 Granted JPS59189636A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6362183A JPS59189636A (ja) 1983-04-13 1983-04-13 トランスフアモ−ルド半導体部品製造方法およびその装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6362183A JPS59189636A (ja) 1983-04-13 1983-04-13 トランスフアモ−ルド半導体部品製造方法およびその装置

Publications (2)

Publication Number Publication Date
JPS59189636A true JPS59189636A (ja) 1984-10-27
JPS6359534B2 JPS6359534B2 (enrdf_load_stackoverflow) 1988-11-21

Family

ID=13234575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6362183A Granted JPS59189636A (ja) 1983-04-13 1983-04-13 トランスフアモ−ルド半導体部品製造方法およびその装置

Country Status (1)

Country Link
JP (1) JPS59189636A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020082411A (ja) * 2018-11-19 2020-06-04 Ｔｏｙｏ Ｔｉｒｅ株式会社 ゴム配合物のブローポイントの測定方法および空気入りタイヤの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020082411A (ja) * 2018-11-19 2020-06-04 Ｔｏｙｏ Ｔｉｒｅ株式会社 ゴム配合物のブローポイントの測定方法および空気入りタイヤの製造方法

Also Published As

Publication number Publication date
JPS6359534B2 (enrdf_load_stackoverflow) 1988-11-21

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