JPS5918697A - プリント配線基板の半田めつき装置における過剰半田除去装置 - Google Patents
プリント配線基板の半田めつき装置における過剰半田除去装置Info
- Publication number
- JPS5918697A JPS5918697A JP12726482A JP12726482A JPS5918697A JP S5918697 A JPS5918697 A JP S5918697A JP 12726482 A JP12726482 A JP 12726482A JP 12726482 A JP12726482 A JP 12726482A JP S5918697 A JPS5918697 A JP S5918697A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- hot air
- holding
- roller
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims description 25
- 238000007747 plating Methods 0.000 title claims description 5
- 238000010409 ironing Methods 0.000 claims description 4
- 230000007423 decrease Effects 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 3
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000002262 irrigation Effects 0.000 description 1
- 238000003973 irrigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
Landscapes
- Coating With Molten Metal (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12726482A JPS5918697A (ja) | 1982-07-21 | 1982-07-21 | プリント配線基板の半田めつき装置における過剰半田除去装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12726482A JPS5918697A (ja) | 1982-07-21 | 1982-07-21 | プリント配線基板の半田めつき装置における過剰半田除去装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5918697A true JPS5918697A (ja) | 1984-01-31 |
| JPH0115155B2 JPH0115155B2 (cs) | 1989-03-15 |
Family
ID=14955722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12726482A Granted JPS5918697A (ja) | 1982-07-21 | 1982-07-21 | プリント配線基板の半田めつき装置における過剰半田除去装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5918697A (cs) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171292A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Electric Ind Co Ltd | プリント基板の表面処理方法 |
| JPH03211788A (ja) * | 1990-01-16 | 1991-09-17 | Tokyo Print Kogyo Kk | プリント配線板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS544259A (en) * | 1977-06-13 | 1979-01-12 | Hope Seiki | Thick soldering device |
-
1982
- 1982-07-21 JP JP12726482A patent/JPS5918697A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS544259A (en) * | 1977-06-13 | 1979-01-12 | Hope Seiki | Thick soldering device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01171292A (ja) * | 1987-12-25 | 1989-07-06 | Matsushita Electric Ind Co Ltd | プリント基板の表面処理方法 |
| JPH03211788A (ja) * | 1990-01-16 | 1991-09-17 | Tokyo Print Kogyo Kk | プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0115155B2 (cs) | 1989-03-15 |
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