JPS5918686Y2 - 混成厚膜集積回路装置 - Google Patents

混成厚膜集積回路装置

Info

Publication number
JPS5918686Y2
JPS5918686Y2 JP1977002687U JP268777U JPS5918686Y2 JP S5918686 Y2 JPS5918686 Y2 JP S5918686Y2 JP 1977002687 U JP1977002687 U JP 1977002687U JP 268777 U JP268777 U JP 268777U JP S5918686 Y2 JPS5918686 Y2 JP S5918686Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
ceramic substrate
film integrated
housing
thick film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1977002687U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5398361U (Direct
Inventor
光晴 森下
啓一 小紫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1977002687U priority Critical patent/JPS5918686Y2/ja
Publication of JPS5398361U publication Critical patent/JPS5398361U/ja
Application granted granted Critical
Publication of JPS5918686Y2 publication Critical patent/JPS5918686Y2/ja
Expired legal-status Critical Current

Links

JP1977002687U 1977-01-12 1977-01-12 混成厚膜集積回路装置 Expired JPS5918686Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1977002687U JPS5918686Y2 (ja) 1977-01-12 1977-01-12 混成厚膜集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1977002687U JPS5918686Y2 (ja) 1977-01-12 1977-01-12 混成厚膜集積回路装置

Publications (2)

Publication Number Publication Date
JPS5398361U JPS5398361U (Direct) 1978-08-09
JPS5918686Y2 true JPS5918686Y2 (ja) 1984-05-30

Family

ID=28689686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1977002687U Expired JPS5918686Y2 (ja) 1977-01-12 1977-01-12 混成厚膜集積回路装置

Country Status (1)

Country Link
JP (1) JPS5918686Y2 (Direct)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5245158Y2 (Direct) * 1973-10-31 1977-10-14

Also Published As

Publication number Publication date
JPS5398361U (Direct) 1978-08-09

Similar Documents

Publication Publication Date Title
CN105684147B (zh) 半导体模块及其制造方法
JP5071405B2 (ja) 電力用半導体装置
JP2015026820A (ja) 電子装置
JP4967701B2 (ja) 電力半導体装置
JPS5918686Y2 (ja) 混成厚膜集積回路装置
JP2005191147A (ja) 混成集積回路装置の製造方法
JP4526125B2 (ja) 大電力用半導体装置
JPH10242385A (ja) 電力用混合集積回路装置
JPS60154543A (ja) 合成樹脂基板を用いた半導体装置
JP2564771B2 (ja) 放熱板付き半導体装置及びその製造方法
JP2015012233A (ja) 電子装置およびその製造方法
JP2015002323A (ja) 電子装置
JPH10173085A (ja) 電子モジュール及び電子モジュールの製造方法
JP2005327791A (ja) 半導体装置およびその実装構造
CN111916409A (zh) 一种功率模块及其制作方法
JPH0518862Y2 (Direct)
JP2621722B2 (ja) 半導体装置
JP2502577Y2 (ja) 電力用半導体モジュ―ル
JP2024077876A (ja) 温度センサ
JP2603101B2 (ja) 電子部品搭載用基板
JP2513416B2 (ja) 半導体装置
JPS5918685Y2 (ja) 混成厚膜集積回路装置
JPS6011651Y2 (ja) 半導体装置
JPH04168753A (ja) 半導体装置
JPH04115540A (ja) 放熱板付き半導体装置の製造方法