JPS59186399A - 電子部品装着方法 - Google Patents
電子部品装着方法Info
- Publication number
- JPS59186399A JPS59186399A JP58059371A JP5937183A JPS59186399A JP S59186399 A JPS59186399 A JP S59186399A JP 58059371 A JP58059371 A JP 58059371A JP 5937183 A JP5937183 A JP 5937183A JP S59186399 A JPS59186399 A JP S59186399A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- printed circuit
- circuit board
- mounting
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 9
- 238000003780 insertion Methods 0.000 claims description 14
- 230000037431 insertion Effects 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 6
- 239000003990 capacitor Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58059371A JPS59186399A (ja) | 1983-04-06 | 1983-04-06 | 電子部品装着方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58059371A JPS59186399A (ja) | 1983-04-06 | 1983-04-06 | 電子部品装着方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59186399A true JPS59186399A (ja) | 1984-10-23 |
| JPH0216599B2 JPH0216599B2 (enrdf_load_stackoverflow) | 1990-04-17 |
Family
ID=13111342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58059371A Granted JPS59186399A (ja) | 1983-04-06 | 1983-04-06 | 電子部品装着方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59186399A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239500A (ja) * | 1988-07-28 | 1990-02-08 | Matsushita Electric Ind Co Ltd | 立体実装基板とその製造装置 |
-
1983
- 1983-04-06 JP JP58059371A patent/JPS59186399A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0239500A (ja) * | 1988-07-28 | 1990-02-08 | Matsushita Electric Ind Co Ltd | 立体実装基板とその製造装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0216599B2 (enrdf_load_stackoverflow) | 1990-04-17 |
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