JPS59186399A - Electronic part mounting method - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for transporting a printed circuit board vertically and slidably to a vertical table movable horizontally and vertically, and transmitting an electronic signal from at least one side of the vertical table. The present invention relates to an electronic component mounting method for mounting components.

In the conventional electronic component mounting method, the printed circuit board is transferred horizontally, and a slot for mounting the electronic component is provided above the board transfer path, and the electronic component is mounted from one side. For this reason, a large space is required in the horizontal direction, and if it is necessary to mount electronic components on the bottom surface of the printed circuit board, the printed circuit board must be reversed.

For this reason, mounting electronic components on both sides of the printed circuit board at once is impossible in principle, and also complicates the structure of reversing the printed circuit board.

In view of the above points, the present invention has been devised to provide a plurality of vertical tiles that are movable in the water direction and the vertical direction by slidably supporting the printed circuit board in a vertically erected state. By inserting electronic components with leads, mounting chimp-shaped electronic EfIII products, or inserting odd-shaped electronic components in the vertical chiffle, the horizontal space can be reduced and electronic components can be mounted on both sides of the printed circuit board. The present invention aims to provide a method for mounting electronic components that makes it possible to mount electronic components.

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the electronic component mounting force method according to the present invention will be described below with reference to the drawings.

1 to 3, in order to support the printed circuit board 1 vertically (sliding 1), an input 11111 board transfer path 2 and an output (till) board transfer path 3 are installed. Three vertical chiffles 4 A, 4 B, and 4 C, which are movable in the horizontal and vertical directions, are arranged.

As shown in FIGS. 2 and 3, the carry-in board transfer path 2 has a two-sided idle rail 12 and a lower guide rail 13 at a distance of 4 fA, and the upper guide rail 12 has an upper frame.
The bottom guide rail 1; (is the base surface 1G).
The top one is fixed. A leaf spring 19 is provided on the two-sided guide rail 12 to prevent the printed circuit board 1 from wobbling. In addition, the lower force-idid rail 13 is provided with an endless band, such as a chain 7, that runs along the printed circuit board 1, and the chain 17 has engaging portions that engage the rear end of the circuit board at regular intervals. Shrine 18 has been taken away.

Note that the structure is similar to that of the substrate transfer path 3 on the unloading side.

As shown in Figures 2 and 4, a vertical chifur (hereinafter referred to as XZ kechiru) that can be moved in the horizontal and vertical directions
4A is a support frame 23 fixed to a base, a ball screw 24 rotatably provided on the support frame 23, a Z slider 2S screwed onto the ball screw 24, and a moon on the Z slider 25. In the horizontal direction, the X slider 27, which is slidably provided and is screwed into the ball screw 26, and the main body 29, which has the upper force idle rail 12A and the lower force idle rail 13A fixed to the support plate 28, are It is growing.

The ball screws 2 and 1 are driven by a DC motor 30, and the ball screw 26 is driven by another motor (not shown), and as the X slider 25 and the X slider 27 move thereby, they are fixed to the X slider 27. table body 29
supports the printed circuit board 1 at an arbitrary position. In order to position the printed circuit board 1 on the XZ table 4A, the board positioning pin 1 is attached to the lower guide rail so as to fit into the positioning hole 1 () of the printed circuit board 1 held by the chiffle main body 29. It is arranged along A.

Further, a pencil cylinder 31 is provided on the back surface of the support plate 28, and is configured to rotate the engaging portion 18 so as not to get caught on the support plate 28.

Note that the table main body 29 is also provided with a sleeping mechanism for setting the printed circuit board 1 at a reference position and ejecting the printed circuit board 1 after mounting the components. Also, the printed circuit board 1 is attached to the top 1m guy 18 rule 12A.
A leaf spring of 1.9 A is provided for stopping.

XZ Kechiru 4A table book (on the left side 1 of the two books,
[Printed circuit board held by XZ table 4A] As shown in Fig. 1 and @11, the insertion head 35 has an insertion head 35 for inserting a 1-inch lead electronic component such as a capacitor, as shown in Fig. 1 and @ Fig. 11. Also, on the right side of the two table bodies facing this, there is a clinch mechanism 37 that bends (clinches) the electronic component glue wires.
is installed.

As shown in FIGS. 1 and 5, on the right side of the chifur main body 29 of the XZketir 4B, there is a dispenser 3 for applying adhesive to the chip-shaped electronic component mounting position of the printed circuit board 1.
8 is provided so as to be freely movable back and forth. Further, in parallel thereto, a mounting mechanism 4.1 having a mounting throat 40 for mounting a chimp-shaped electronic component is provided. Note that the configuration itself of the XZ table 1B may be the same as that of the XZ table 4A.

As shown in Fig. 1 and Fig. 6, the left side of the table body 29 of the XZ table 4C is held by the X'/- table 4C, and the printed circuit board 11 is opposed to the variable resistor. An insertion slot 46 is provided with an insertion head 4.5 for inserting oddly shaped electronic components such as trimmer capacitors. Also, the table body 2 facing this
On the right side of 9, there is a clinching mechanism (↓7) that bends (clinches) the leads of oddly shaped electronic components. Note that the configuration itself of the ×Z table 4C may be the same as that of the ×Z table in the nij book.

FIG. 7 shows an example of the insertion head 35, which includes a clamping member 51 for clamping the lead wire of the electronic component 50, and a push rod 52 for pushing the main body of the electronic component 50.

FIG. 8 shows an example of the mounting throat 40, which includes a mounting pin 56 for vacuum-chucking the chip-shaped electronic component 55;
A spring 57 that biases the pin 56 in the protruding direction and a vacuum suction path 58 are provided.

In this configuration, in the board transfer path 2 on the carry-in side, the rear end of the printed circuit board 1 is pushed by the engaging portions 4'j,' 18 by the intermittent running of the chain 17, and moves forward a certain distance,
- The substrate 1 is fed into the XZ table in a vertical position.

The printed circuit boards 1 of the XZ table 4 A and J are set at the predetermined positions on the table body 25], and the board positioning pins 1] are fitted into the positioning holes on the board side]0) to position the printed circuit boards 1. . Next, the insertion head 35, which has received the electronic components 50 with leads sequentially from the component supply section 34, performs a predetermined insertion operation from the left side of the printed circuit board 1, and inserts the electronic components 50 as shown in FIG. Insert the lead wire into the hole on board 1. Along with this jt, the wire of the electronic component 50 is bent by the clinch bar structure 37 on the right side. Is this kind of operation necessary for the printed circuit board 1 [
executed repeatedly at the specified location.

Printed circuit board 1 after insertion of leaded electronic component 50
is then sent to the ×Z table 11F3.

The print base 1 on the XZ table 4B is the table body 2
The printed circuit board 1 is positioned at a predetermined position, and the board positioning pin [1] fits into the positioning hole [0] on the board side, thereby positioning the printed circuit board 1. Then, the adhesive is applied to the board surface by applying a adhesive to the mounting position of the chip-shaped electronic component 55. After that, the chip-shaped electronic component 55 is sequentially supplied by the component supply section 42. r-mounted head' 4.0
11) Repeat the predetermined mounting φ operation as shown in FIG.

The printed circuit board 1 on which the chip molding part 55 has been installed is further fed into the
Table 4C1 2 printed circuit board] is Chiful body 2!
□2 set at the specified position of 3, and the board positioning pin 11
is fitted into the positioning hole 101 on the board side and the printed board 1 is inserted.
position. Next, the insertion head 45, which has been sequentially supplied with odd-shaped electronic components from the component supply section 44, performs a predetermined insertion operation from the left side of the printed circuit board 1, and inserts the leads of the odd-shaped electronic components into the holes of the printed circuit board 1. Along with this, the right clinch mechanism 47 bends the leads of the irregularly shaped electronic component. Such operations are repeatedly performed at necessary locations on the printed circuit board 1.

The printed circuit boards 1 that have been inserted into the XZ table 4C are sequentially extracted to the unloading board transfer path 3.

According to the above embodiment, since the printed circuit board 1 is transported vertically, there is an advantage that it does not take up much space in the horizontal direction. Also, place the printed circuit board j on the XZ table, 'JA, 4B, 4
Hold vertically at C and insert head 35 to the left of them.
, 45, the dispenser 38 and the mounting head 40 on the good side.
By arranging them respectively, electronic components can be mounted on both sides of the board without turning the board, and work efficiency can be improved.

In addition, as shown in FIG.
The printed circuit board 1 may be supported by using a structure in which a pulley 62 is provided at and the pulley 62 is urged downward (in the direction of pressing the printed circuit board 1) by a spring 63.

Furthermore, a device 70 for inspecting whether components have been reliably mounted on the printed circuit board 1 can be provided in the middle of the board transfer path 3 on the unloading side, as shown by the one-dot chain line in FIG.

As explained above, according to the electronic component mounting method of the present invention, when a printed circuit board is vertically erected - [a plurality of vertical tips that are slidably supported and movable in horizontal and vertical directions] By sequentially transporting electronic components, chip-shaped electronic components, or electronic components of various shapes on each vertical table, the horizontal space can be reduced and printing It is possible to attach electronic components to both sides of the board,
In turn, it is possible to improve the mounting efficiency.

[Brief explanation of drawings]

FIG. 1 is a schematic plan view of an embodiment of the electronic component mounting method according to the present invention, FIG. 2 is a front view showing the board transfer path on the carry-in side and the XZ table, and FIG.゛Side sectional view of a substrate transfer path equipped with a rail, No. 4
The figure is a sectional view of the XZ table at the 5/IA position (lt11), Figure 5 is a side sectional view of the XZ table at the XIB position, Figure 6 is a side sectional view of the XZ table at the 4C position, and Figure m7 is the insertion 8 is a side sectional view showing an example of the mounting head, and FIG. 5 is a front view showing an example of the configuration of the pond in the two-sided force idle rail portion. 1 substrate, 2... Input 11111 Substrate transfer path: 3... Output side substrate transfer path, 4 A, 413.
4 C...X7. table, 'J 2 , I 2 A
...”-plane guide rail,] :? , :13A・
・Bottom kite rail, 17...Chain, 35°45
...Insertion head, 38...Dispenser, '40.
... Mounting head, 5 t', 1... Lead doi τ1 electronic component, 55... S/P-shaped electronic component. Representing patent applicant TDC Co., Ltd.! (Patent Attorney Takashi Iki Figure 3 14 12A ＼ Figure 6 5 Figure 9

Claims (1)

[Claims] (1) There are multiple openings between the carry-in 1tttll transfer path that supports the printed circuit board vertically and slidably, and the unload-side transfer path that similarly supports the printed circuit board vertically and slidably. A vertical table movable in the horizontal and vertical directions is arranged, and an insertion slot for inserting an electronic component with a lead into at least one side of each vertical chiffle, a mounting slot for mounting a chip-shaped electronic component, and an odd-shaped electronic component in the pond. A gutter or a depressor for adhesive application is installed in the insertion area where the parts are inserted, and the print is sequentially placed on each vertical table from the transport path on the carry-in side.
・Transferring the board, inserting a printed electronic component, mounting a chip-shaped electronic component, or inserting a strangely shaped electronic component in the board on each of the vertical tables, and then sending it to the unloading side transfer path. An electronic component mounting method characterized by: