JPS6193697A - Mounting of chip component - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for mounting a chip component on a printed circuit board.

(Conventional technology and problems) The conventional method for mounting chip components is to apply adhesive in advance to the location where the chip component is to be mounted on the printed circuit board, and then mount the chip component at the location where the adhesive is applied. . For this reason, a place is required on the XY table to apply the adhesive, and the table becomes larger or another one is required.

Also, pallets are used to transport chip parts.1. This method uses S or vacuum suction, making the device complicated.

(Means for Solving the Problems) In view of the above points, the present invention adopts a configuration in which an adhesive is provided on a pin for transferring chip components and the adhesive force of the adhesive is used to transfer the chip components. This simplifies the transfer equipment, eliminates the process of applying adhesive to the printed circuit board before mounting chip components, reduces the number of man-hours required for mounting chip components, and improves efficiency. The purpose is to provide a method for installing parts.

(Example) Hereinafter, a cold example of the method for mounting a chip component according to the present invention will be described with reference to the drawings.

In FIGS. 1(A) and (B), a chain 1 (or an endless belt such as a timing belt) is stretched between subroket nodes 2A to 2D to form an S-end belt structure h1, and the chain 1 As shown in FIGS. 2 to 4, a large number of transfer pins 3 for transferring electronic components are attached at regular intervals.

A component supply section 4A is provided on both sides of the straight running path of the chain 1.
, 4B are arranged. Here, the component supply sections 4A and 4B are configured to be able to supply chip components 15 of a predetermined type one by one from a tape figure, a parts figure, a magazine, or the like. Here, the table figure is a paper tape etc. in which chip parts are arranged at regular intervals, the bar figure is used to separate and supply chip parts one by one using vibration, and the magazine is a state in which chip parts are stacked. It has a structure in which it is housed in a cartridge.

In any case, the component supply sections 4A and 4B may have any structure as long as they can receive and deliver chip components to the transfer pins 3.

An adhesive supply section 5 is arranged at a position upstream of the component supply section 4A. The adhesive supply section 5 applies adhesive 8 to the tip end surface of the transfer pin 3 as shown in FIG.

The mounting head section 6 picks up the chip component 5 on the 7tq length of the chain 1 by sucking the chip component 5 from the transfer pin 3 at the transfer position 1p as shown in FIGS. 1(B) and 4. This structure has suction pins 7 arranged at regular intervals on the index table 6A. In addition, the first
In figure (A), the mounting head 6° and the printed circuit board 10 are drawn in a plane, but in reality, as in fJS1 figure (B),
The chain 1 moves in a vertical plane, the printed circuit board 10 is also supported vertically, and the index table 6A rotates in a horizontal plane.

(Operation of the embodiment) In the above configuration, first, the adhesive 8 is applied to the tip end surface of the transfer pin 3 provided on the outer periphery of the chain 1 of the endless belt mechanism from the adhesive supply unit 5 as shown in FIG. Next, the adhesive 8 is pre-dried to exhibit a predetermined adhesive strength.
to the transfer pin 3 which now exhibits a predetermined adhesive force,
A predetermined type of chip component 15 is supplied from the component supply units 4A and 4B.
are supplied to the printed circuit board 10 according to the mounting order (however, the component supply posture is a reflection of the posture on the printed circuit board). By pressing against the chip component 15, the chip component 15 is taken out and conveyed using the adhesive force of the adhesive 8, as shown in FIG. In this case, chip part 1
The pin 3 which once held the chip 5 may be re-dedicated and changed its direction so as not to interfere with the operation of the other pins that do not yet hold the chip component to take out the chip component.

The transfer pin 3, which has received the chip component 15 in the mounting section, transfers the chip component 15 in a posture as shown in FIG.
Transfer to 1P. In other words, the adhesive surface of the chip component 15 is held on the tip end surface of the pin 3, and the receiver is placed at the transfer position P8: the tip of the chip component 15 facing the suction pin 7 of the VC spray 1216. The surface will be the one to which no adhesive has been applied. Then, as shown in FIG. 1(B) and fjS4, the suction pin 7 suctions the surface of the chip component 15 on which adhesive is not provided by vacuum suction, picks up the chip component from the transfer pin 3, and transfers it to the index table. Printed circuit board ion on XY table 11 by intermittent rotation of 6A
, : The chip component 15 is mounted by moving to the target position and further pressing the adhesive-applied surface of the chip component 15 onto the printed circuit board 10 with the suction pin 7 .

(Effects of the Invention) As explained above, according to the chip component mounting method of the present invention, an adhesive is provided at the tip of the transfer pin provided in the endless band mechanism, and the adhesive force of the adhesive is used to The structure is designed to transport components, and the adhesive provided on one side of the chip component can be used as is when mounting the chip component on a printed circuit board, which simplifies the transfer equipment and allows printing before mounting the chip component. The mechanism can be simplified by omitting the step of applying only adhesive to the substrate in advance.

[Brief explanation of the drawing]

FIG. 1(A) is a configuration diagram showing an embodiment of the chip component mounting method according to the present invention, FIG. 1(B) is a side view of the vicinity of the mounting head, and FIG. FIG. 3 is an explanatory diagram showing a state in which a chip component is held by a transfer pin, and FIG. 4 is an explanatory diagram showing a state in which a chip component is held by a suction pin on the mounting head side. 1... Chain, 2A to 2D... Sprocket,
3...Transfer pin, 4A, 4B...Component supply section, 5.
...Adhesive supply section, 6.. Mounting head section, 7.. Suction pin, 10.. Printed circuit board, 11.. XY table.

Claims (1)

[Claims] (1) Adhesive is provided at the tip of the transfer pin provided in the endless band mechanism, and the adhesive force of the adhesive holds the chip component at the tip of the transfer pin and transfers it to the mounting head, and the suction pin of the mounting head A method for mounting a chip component, characterized in that the surface of the chip component not provided with adhesive is held by suction, and the surface of the chip component provided with adhesive is pressed against a printed circuit board to mount the chip component.