JPS59181088A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59181088A
JPS59181088A JP58054223A JP5422383A JPS59181088A JP S59181088 A JPS59181088 A JP S59181088A JP 58054223 A JP58054223 A JP 58054223A JP 5422383 A JP5422383 A JP 5422383A JP S59181088 A JPS59181088 A JP S59181088A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
lead
semiconductor device
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58054223A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0373996B2 (enExample
Inventor
純一 矢野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58054223A priority Critical patent/JPS59181088A/ja
Publication of JPS59181088A publication Critical patent/JPS59181088A/ja
Publication of JPH0373996B2 publication Critical patent/JPH0373996B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP58054223A 1983-03-30 1983-03-30 半導体装置 Granted JPS59181088A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58054223A JPS59181088A (ja) 1983-03-30 1983-03-30 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58054223A JPS59181088A (ja) 1983-03-30 1983-03-30 半導体装置

Publications (2)

Publication Number Publication Date
JPS59181088A true JPS59181088A (ja) 1984-10-15
JPH0373996B2 JPH0373996B2 (enExample) 1991-11-25

Family

ID=12964532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58054223A Granted JPS59181088A (ja) 1983-03-30 1983-03-30 半導体装置

Country Status (1)

Country Link
JP (1) JPS59181088A (enExample)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51113147U (enExample) * 1975-03-11 1976-09-13
JPS5730872U (enExample) * 1972-09-21 1982-02-18
JPS5823188U (ja) * 1981-08-08 1983-02-14 松下電器産業株式会社 櫛形端子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5730872U (enExample) * 1972-09-21 1982-02-18
JPS51113147U (enExample) * 1975-03-11 1976-09-13
JPS5823188U (ja) * 1981-08-08 1983-02-14 松下電器産業株式会社 櫛形端子

Also Published As

Publication number Publication date
JPH0373996B2 (enExample) 1991-11-25

Similar Documents

Publication Publication Date Title
US5789811A (en) Surface mount peripheral leaded and ball grid array package
JP3502776B2 (ja) バンプ付き金属箔及び回路基板及びこれを用いた半導体装置
EP0653789A2 (en) Electronic package structure and method of making same
US5061990A (en) Semiconductor device and the manufacture thereof
US5387814A (en) Integrated circuit with supports for mounting an electrical component
JPH02239651A (ja) 半導体装置およびその実装方法
JPH01217993A (ja) 半導体装置
JPH01261849A (ja) 半導体装置の製造方法
JPH02260450A (ja) 半導体装置およびその実装方法
JP3656861B2 (ja) 半導体集積回路装置及び半導体集積回路装置の製造方法
JPH0230169A (ja) 半導体装置
JP2798108B2 (ja) 混成集積回路装置
JPH05102621A (ja) 導電パターン
US4860443A (en) Method for connecting leadless chip package
JPS59181088A (ja) 半導体装置
JPH04196253A (ja) 半導体装置用パッケージ
JPH05343602A (ja) 高集積半導体装置及びそれを用いた半導体モジュール
JPH0129802Y2 (enExample)
JPH0517709B2 (enExample)
JP2001156416A (ja) フレキシブル配線基板の接続構造
JPS60200559A (ja) メモリモジュール
JPH038366A (ja) 半導体装置用パッケージ
JPH0473298B2 (enExample)
JPH01304795A (ja) プリント板の配線方法
JPS61189695A (ja) 多層プリント板の配線パタ−ン構造