JPS59181025A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS59181025A
JPS59181025A JP58053525A JP5352583A JPS59181025A JP S59181025 A JPS59181025 A JP S59181025A JP 58053525 A JP58053525 A JP 58053525A JP 5352583 A JP5352583 A JP 5352583A JP S59181025 A JPS59181025 A JP S59181025A
Authority
JP
Japan
Prior art keywords
pellet
semiconductor
island
engaged
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58053525A
Other languages
Japanese (ja)
Inventor
Kazuhide Sato
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58053525A priority Critical patent/JPS59181025A/en
Publication of JPS59181025A publication Critical patent/JPS59181025A/en
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495Lead-frames or other flat leads
    • H01L23/49503Lead-frames or other flat leads characterised by the die pad
    • H01L23/49506Lead-frames or other flat leads characterised by the die pad an insulative substrate being used as a diepad, e.g. ceramic, plastic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321Disposition
    • H01L2224/32151Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92Specific sequence of method steps
    • H01L2224/922Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
    • H01L2224/9222Sequential connecting processes
    • H01L2224/92242Sequential connecting processes the first connecting process involving a layer connector
    • H01L2224/92247Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

PURPOSE:To perform the reduction in size of an element, the simplification of manufacturing steps and the suppression of a crack of a pellet by securing a semiconductor pellet without using an island of a leadframe. CONSTITUTION:A semiconductor pellet 3 is positioned and placed on a hole 11 of a bonding stage 10, a hole 11 side is set to the back surface, and the pellet 3 is secured. Entirely the same leadframe 1 except the presence of an island is conveyed and positioned, and placed on the stage 10. A thermosetting resin piece molded in a frame to be engaged between the end side 1c of the inner lead 16 of the frame 1 and the side face 3a of the pellet 3 is engaged between the lead 1b and the pellet 3. The resin piece is thermally set at 200-250 deg.C for several secconds, thereby forming a support 6. The pellet wire bonded is associated with a suitable enclosure.
JP58053525A 1983-03-31 1983-03-31 Semiconductor device Granted JPS59181025A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58053525A JPS59181025A (en) 1983-03-31 1983-03-31 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58053525A JPS59181025A (en) 1983-03-31 1983-03-31 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS59181025A true JPS59181025A (en) 1984-10-15

Family

ID=12945228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58053525A Granted JPS59181025A (en) 1983-03-31 1983-03-31 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS59181025A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179351A (en) * 1987-12-30 1989-07-17 Fujitsu Ltd Plastic-molded semiconductor device and its manufacture
JPH02130865A (en) * 1988-10-24 1990-05-18 Motorola Inc Molded semiconductor package
JPH02197151A (en) * 1989-01-26 1990-08-03 Oki Electric Ind Co Ltd Resin-sealed semiconductor device and manufacture thereof
JPH03129871A (en) * 1989-10-16 1991-06-03 Oki Electric Ind Co Ltd Resin sealed type semiconductor device
JPH0855952A (en) * 1994-08-16 1996-02-27 Nec Kyushu Ltd Semiconductor device and manufacture thereof
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
JP2006108409A (en) * 2004-10-06 2006-04-20 Fujitsu Ltd Semiconductor device and manufacturing method therefor
JP4837092B2 (en) * 2006-05-18 2011-12-14 グラフィック パッケージング インターナショナル インコーポレイテッド Carton with liquid tight receptacle
US10737824B2 (en) 2016-11-14 2020-08-11 Graphic Packaging International, Llc Reconfigurable carton and package

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01179351A (en) * 1987-12-30 1989-07-17 Fujitsu Ltd Plastic-molded semiconductor device and its manufacture
JPH02130865A (en) * 1988-10-24 1990-05-18 Motorola Inc Molded semiconductor package
JPH02197151A (en) * 1989-01-26 1990-08-03 Oki Electric Ind Co Ltd Resin-sealed semiconductor device and manufacture thereof
JPH03129871A (en) * 1989-10-16 1991-06-03 Oki Electric Ind Co Ltd Resin sealed type semiconductor device
US5605863A (en) * 1990-08-31 1997-02-25 Texas Instruments Incorporated Device packaging using heat spreaders and assisted deposition of wire bonds
JPH0855952A (en) * 1994-08-16 1996-02-27 Nec Kyushu Ltd Semiconductor device and manufacture thereof
JP2006108409A (en) * 2004-10-06 2006-04-20 Fujitsu Ltd Semiconductor device and manufacturing method therefor
JP4837092B2 (en) * 2006-05-18 2011-12-14 グラフィック パッケージング インターナショナル インコーポレイテッド Carton with liquid tight receptacle
US10737824B2 (en) 2016-11-14 2020-08-11 Graphic Packaging International, Llc Reconfigurable carton and package

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