JPH0864980A - Semiconductor device and manufacture thereof - Google Patents

Abstract

PURPOSE: To make easy manufacturing of a semiconductor available and lessen the damage on a circuit board by including a process wherein the circuit board and a radiating fin are adhered to each other tightly with conductive adhesive. CONSTITUTION: A conductive adhesive 11 is applied onto a flat-surface radiating fin 2 by screen printing or other methods. After that, a circuit board 1 is mounted on the applied conductive adhesive 11 and then the circuit board 1 is pressed in order to have good adhesion between the circuit board 1 and the conductive adhesive 11. Then, these are heated to, for example, 150 deg.C by a heating means such as an oven to harden the conductive adhesive 11 and then adhere the circuit board 1 to the radiating fin 2 tightly. By adhering the circuit board 1 to the radiating fin 2 using the conductive adhesive 11, the conductive adhesive 11 serves to connect the radiating fin 2 and the circuit board 1 electrically and it also serves as a cushion between the radiating fin 2 and the circuit board 1. Therefore, when the radiating fin 2 deforms at the time of assembling the circuit board, the distortion of the radiating fin 2 is hardly be transmitted to the circuit board 1 and therefore the crack of the circuit board 1 is prevented.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a radiation fin on the back surface of a circuit board and a method for manufacturing the semiconductor device, and in particular omits a cleaning step in the process of adhering the circuit board and the radiation fin. The present invention relates to a semiconductor device capable of preventing a circuit board from cracking during a process of incorporating the product into a product, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, there have been devices of this type shown in FIGS. 10 and 11 show a conventional semiconductor device for high frequency power amplification used in a radio device or the like. In FIG. 10, reference numeral 1 denotes a circuit board having an electric circuit mounted on its surface, which is made of, for example, ceramic or the like. A thick film circuit is formed on the substrate. Further, 2 is a metal radiation fin for radiating the heat generated in the circuit board 1, 3 is solder for fixing the circuit board 1 on the radiation fin 2, and 4 is easy for fixing by the solder 3. Therefore, it is a flux for removing the contamination attached to the surface of the radiation fin 2.

In FIG. 11, reference numeral 21 is a cap for covering the surface of the radiation fin 2 on the side where the circuit board 1 is fixed as described above, and 22 is an input / output lead attached to the circuit board 1.

In this conventional semiconductor device, a circuit board 1 on which an electric circuit is mounted is fixed onto a heat radiation fin 2 with solder 3 and flux 4.

This is because the semiconductor device emits high heat during operation and requires a radiation fin. Then, after the input / output leads 22 are attached to the electrode lead-out pads of the circuit board 1 fixed on the heat radiation fins 2, a cap 21 is attached to cover the surface of the heat radiation fins 2 on the side where the circuit board 1 is fixed. Complete the semiconductor device.

When the semiconductor device is incorporated in a radio device, the heat radiation fin is fixed to the chassis or the like with screws in consideration of heat radiation.

[0007]

Conventionally, in a circuit board that emits a high amount of heat during operation, the method of fixing the circuit board and the radiation fin with solder and flux has been used as a means for releasing the heat. Has been. However, since this method uses solder and flux as a fixing means, there is a problem that the flux must be washed after fixing the circuit board and the heat radiation fin.

Further, in the process of incorporating the semiconductor device, which is manufactured as described above, in which the circuit board and the heat radiation fins are fixed to each other, into the product, when the heat radiation fins are fixed to the chassis or the like with the screws, unevenness of the mounting chassis surface or There is a problem that the circuit board is easily cracked due to strain stress due to foreign matter on the mounting surface.

The present invention has been made in order to solve the above-mentioned problems of the conventional one, and is easy to manufacture, and the damage of the circuit board can be reduced, and the manufacturing method thereof. Is to provide.

[0010]

A method of manufacturing a semiconductor device according to the present invention is a method of manufacturing a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated in the circuit substrate. The method further comprises a step of fixing the circuit board to the heat radiation fin with a conductive adhesive.

Further, a semiconductor device according to the present invention is a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein the circuit substrate is conductively bonded to the heat radiation fin. It is fixed by the agent.

Further, according to the present invention, in the method of manufacturing a semiconductor device, the circuit board on the heat radiation fin is bonded before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. It includes a step of forming a concave portion in the portion and a step of applying a conductive adhesive to the concave portion.

Further, according to the present invention, in the method of manufacturing a semiconductor device, a frame-shaped sheet-like insulating property is provided on the heat radiation fin before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. A step of adhering an adhesive,
And a step of applying the conductive adhesive to the inside of the frame-shaped sheet-shaped insulating adhesive.

Further, a semiconductor device according to the present invention is a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein a frame-shaped sheet-shaped insulation is provided on the heat radiation fin. Adhesive is adhered, a conductive adhesive is applied to the inside of the frame-shaped sheet-shaped insulating adhesive, and the circuit board is fixed to the heat radiation fin by the conductive adhesive.

Further, according to the present invention, in the method of manufacturing a semiconductor device, the circuit board and the heat dissipation fin on the heat dissipation fin are provided before the step of fixing the circuit board to the heat dissipation fin with the conductive adhesive. Is provided on the circuit board in the step of applying and forming an insulating adhesive in the area except the area necessary for electrically connecting the circuit board and the area necessary for electrically connecting the circuit board and the heat radiation fin. A step of injecting the conductive adhesive onto the heat dissipation fin through a hole, and the heat dissipation fin and the circuit board so as to electrically connect the circuit board and the heat dissipation fin with the conductive adhesive. And a step of adhering to each other.

A semiconductor device according to the present invention is a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein the circuit substrate and the heat radiation on the heat radiation fin are provided. An insulating adhesive is applied to a region other than a region necessary for electrically connecting the fins, and a hole provided in the circuit substrate is formed in a region required for electrical connection between the circuit board and the heat dissipation fin. Via the above, the conductive adhesive is injected onto the heat dissipation fin, and the heat dissipation fin and the circuit board are bonded so that the circuit board and the heat dissipation fin are electrically connected by the conductive adhesive. The circuit board is fixed to the heat radiation fins.

Further, according to the present invention, in the method for manufacturing a semiconductor device described above, the insulating adhesive is a sheet-like insulating adhesive in which a region necessary for electrical connection between the circuit board and the radiation fin is removed in advance as the insulating adhesive. The agent is used.

Further, according to the present invention, in the method for manufacturing a semiconductor device, as the insulating adhesive, a sheet-shaped insulating adhesive is formed by removing a region where the circuit board and the radiation fin need to be electrically connected in advance. Before the step of fixing the circuit board to the heat radiation fins using an agent, the step of temporarily fixing the sheet-shaped insulating adhesive on the heat radiation fins and the sheet-shaped insulating adhesive are removed. And a step of applying the conductive adhesive to the region.

Further, according to the present invention, in the method for manufacturing a semiconductor device described above, as the conductive adhesive, a sheet-like insulating adhesive having openings necessary for electrical connection between the circuit board and the heat radiation fins. The sheet-shaped conductive adhesive embedded in the opening is used.

Further, according to the present invention, in the method for manufacturing a semiconductor device described above, as the conductive adhesive, a sheet-shaped adhesive is formed by applying the conductive adhesive so as to wrap the outer periphery of a sheet-shaped insulating adhesive. The agent is used.

Further, the semiconductor device according to the present invention is a semiconductor device having a substrate on which a circuit is mounted and a radiation fin for radiating heat generated by the circuit substrate. The sheet-like adhesive is formed by applying a conductive adhesive so as to cover the outer periphery of the insulating adhesive, and is fixed.

Further, according to the present invention, in the above method for manufacturing a semiconductor device, the sheet-shaped insulating adhesive is
A sheet-shaped adhesive is used which has a hole at an arbitrary position, wraps the outer periphery of the insulating adhesive, and is coated with the conductive adhesive so as to fill the hole.

[0023]

According to the present invention, a circuit-constituting substrate,
A method of manufacturing a semiconductor device having a heat dissipation fin that dissipates heat generated in the circuit board includes a step of fixing the circuit board to the heat dissipation fin with a conductive adhesive. A semiconductor device manufacturing method capable of absorbing strain stress during mounting while ensuring electrical connection with fins.

Further, according to the present invention, in a semiconductor device having a circuit board and a heat radiation fin for radiating heat generated by the circuit board, the circuit board is fixed to the heat radiation fin with a conductive adhesive. Therefore, it is possible to absorb the stress of the strain at the time of mounting while ensuring the electrical connection between the circuit board and the radiation fin.

Further, according to the present invention, in the method of manufacturing a semiconductor device, the circuit board on the heat radiation fin is bonded before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. Since it includes a step of providing a concave portion in a portion where the conductive adhesive is applied and a step of applying a conductive adhesive to the concave portion, it is possible to prevent the conductive adhesive from protruding to the surroundings,
A method of manufacturing a semiconductor device in which the thickness of the adhesive can be made uniform.

Further, according to the present invention, in the method of manufacturing a semiconductor device, a frame-shaped sheet-shaped insulation is provided on the heat radiation fin before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. Of a conductive adhesive and a step of applying the conductive adhesive to the inside of the frame-shaped sheet-shaped insulating adhesive prevent the conductive adhesive from sticking out to the surroundings, A method of manufacturing a semiconductor device in which the thickness of the semiconductor device can be made uniform.

Further, according to the present invention, in a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, a frame-shaped sheet-like insulating adhesive is provided on the heat radiation fin. Is adhered, a conductive adhesive is applied to the inside of the frame-shaped sheet-shaped insulating adhesive, and the circuit board is fixed to the heat dissipation fin by the conductive adhesive. The adhesive can be prevented from sticking out to the surroundings, and the thickness of the adhesive can be made uniform.

According to the present invention, in the method of manufacturing a semiconductor device, the circuit board and the heat radiation on the heat radiation fin are heat-treated before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. The step of applying an insulating adhesive to a region other than the region necessary for electrically connecting the fin and the region required for electrical connection between the circuit substrate and the heat dissipation fin are provided on the circuit substrate. A step of injecting the conductive adhesive on the heat radiation fins through the holes formed, and the heat radiation fins and the circuit so as to electrically connect the circuit board and the heat radiation fins by the conductive adhesive. Since the method includes the step of adhering to the substrate, the method of manufacturing a semiconductor device can reduce the amount of expensive conductive adhesive used.

Further, according to the present invention, in a semiconductor device having a substrate on which a circuit is mounted and a radiation fin for radiating heat generated by the circuit substrate, the circuit substrate and the radiation fin on the radiation fin are An insulating adhesive is applied to a region other than a region necessary for electrical connection, and a hole provided in the circuit board is inserted into the region necessary for electrical connection between the circuit board and the heat dissipation fin. Then, the conductive adhesive is injected onto the heat dissipation fin, and the heat dissipation fin and the circuit board are bonded so that the circuit board and the heat dissipation fin are electrically connected by the conductive adhesive,
Since the heat radiation fin is fixed to the circuit board, the amount of expensive conductive adhesive used can be reduced.

Further, in the present invention, in the method for manufacturing a semiconductor device, the insulating adhesive is a sheet-like insulating material in which a region necessary for electrical connection between the circuit board and the radiation fin is removed in advance. Since the adhesive is used, the amount of expensive conductive adhesive used can be reduced, and the thickness of the adhesive can be kept constant.

According to the present invention, in the method of manufacturing a semiconductor device, the insulating adhesive is a sheet-like insulating material from which a region requiring electrical connection between the circuit board and the radiation fin is removed in advance. Before the step of fixing the circuit board to the radiation fin by using an adhesive, the step of temporarily fixing the sheet-shaped insulating adhesive on the radiation fin and the step of removing the sheet-shaped insulating adhesive Since the method includes the step of applying a conductive adhesive to the above-described region, the amount of expensive conductive adhesive used can be reduced and the thickness of the semiconductor device can be made uniform.

Further, according to the present invention, in the method for manufacturing a semiconductor device described above, as the conductive adhesive, a sheet-like insulation having an opening in a region necessary for electrical connection between the circuit board and the heat radiation fin is used. Since it is a sheet-shaped conductive adhesive embedded in the opening of the conductive adhesive,
This is a method for manufacturing a semiconductor device in which the amount of expensive conductive adhesive used can be reduced and the thickness of the adhesive can be made uniform.

Further, according to the present invention, in the method for manufacturing a semiconductor device described above, a sheet-shaped insulating adhesive is applied as the conductive adhesive so that the conductive adhesive is applied so as to wrap the periphery of the sheet. Since the adhesive is used, the amount of expensive conductive adhesive used can be reduced, and the thickness of the adhesive can be made uniform.

Further, according to the present invention, in a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated in the circuit substrate, the circuit substrate is used as the heat radiation fin, and a sheet-shaped insulating property is provided. Since it is fixed by using a sheet-shaped adhesive that is coated with a conductive adhesive so as to wrap the outer periphery of the adhesive, the amount of expensive conductive adhesive used is reduced and the thickness of the adhesive is reduced. Can be uniform.

Further, according to the present invention, in the above-mentioned method for manufacturing a semiconductor device, the sheet-like insulating adhesive has holes at predetermined positions and wraps the outer periphery of the sheet-like insulating adhesive. Since the sheet-shaped adhesive obtained by applying the conductive adhesive so as to fill the hole is used, the amount of expensive conductive adhesive used can be reduced, and the semiconductor device can be manufactured with a uniform thickness of the adhesive. Be the way.

[0036]

Embodiments of the present invention will be described below with reference to the drawings. Example 1. First Embodiment FIG. 1 shows a semiconductor device according to a first embodiment of the present invention.
And the manufacturing method thereof. In the figure, reference numeral 1 denotes a circuit board having an electric circuit mounted on one main surface thereof, which is made of, for example, ceramic or the like and has a thick film circuit formed on its surface. Further, 2 is a heat radiation fin that dissipates heat generated from the circuit board 1, and 11 is a conductive adhesive agent such as a silicon-based material that fixes the circuit board 1 and the heat radiation fin 2 together.

In the first embodiment, a conductive adhesive 11 is formed on the radiating fin 2 having a flat surface by means of screen printing or the like.
Is applied, and the circuit board 1 is applied on the applied conductive adhesive 11.
Is mounted and pressed in order to improve the adhesion between the circuit board 1 and the conductive adhesive 11. After that, the conductive adhesive 11 is heated to 150 ° C. by a heating means such as an oven.
Is cured to fix the circuit board 1 to the heat radiation fins 2.

As described above, according to the first embodiment, since the circuit board 1 is fixed to the heat radiation fins 2 by using the conductive adhesive 11, the conductive adhesive 11 is formed between the heat radiation fins 2 and the circuit board 1. Is electrically connected and acts as a cushion between the radiating fin 2 and the circuit board 1, so that the distortion force when the radiating fin 2 is deformed even during a process of assembling into a product It becomes difficult to convey to the board 1, and cracking of the circuit board 1 in the assembly process can be suppressed. Further, since solder is not used, there is an effect that a semiconductor device and a manufacturing method thereof that can omit a cleaning step after assembly can be obtained.

Embodiment 2 FIG. 2 (a) and 2 (b) are a perspective view (FIG. 2 (a)) and a sectional view (FIG. 2 (b)) showing a semiconductor device and its manufacturing method according to a second embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions. Reference numeral 2a is a concave portion formed on the main surface of the radiation fin on the side where the circuit board 1 is fixed.

In the first embodiment, the conductive adhesive 11 is applied on the radiating fin 2 having a flat surface. However, in the second embodiment, as shown in FIGS. 2 (a) and 2 (b), the radiating fin 2 is formed. A concave portion 2a of, for example, 0.1 to 0.5 mm is provided on the upper surface of 2, and a conductive adhesive 11 is applied using a means such as a screen printing method so as to almost fill the inside of the concave portion 2a. The circuit board 1 is fixed to the radiating fins 2 in the same process as in 1.

In the second embodiment, since the circuit board 1 is fixed to the heat radiation fins 2 by using the conductive adhesive 11, the circuit board 1 can be prevented from cracking in the assembling process and can be assembled. It is possible to obtain the same effect as that of the first embodiment that the subsequent cleaning step can be omitted. In addition to this effect, a recess 2a is provided on the upper surface of the radiation fin 2,
Since the conductive adhesive 11 is applied so as to almost fill the inside of the recess 2a, the recess 2a prevents the conductive adhesive 11 from flowing out when the circuit board 1 is mounted and pressed. Therefore, there is an effect that a semiconductor device in which the thickness of the conductive adhesive 11 can be kept uniform and a manufacturing method thereof can be obtained.

Example 3. Third Embodiment FIG. 3 is a perspective view showing a semiconductor device and a manufacturing method thereof according to a third embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions. Reference numeral 12a is a frame-shaped sheet-shaped insulating adhesive, which is, for example, a silicon-based or epoxy-based adhesive. When a silicon-based adhesive is used as the conductive adhesive, the sheet-shaped insulating adhesive 12a is used. Again, it is desirable to use a silicon type.

In the second embodiment, in order to obtain the effect of keeping the thickness of the conductive adhesive 11 constant, the concave portion 2a is provided on the upper surface of the radiation fin 2, but in the third embodiment, as shown in FIG. A sheet-shaped insulating adhesive is framed to prepare a frame-shaped sheet-shaped insulating adhesive 12a, which is adhered onto the radiation fins 2 and heated to, for example, 80 ° C. to be temporarily fixed. Then, using a means such as a screen printing method, the conductive adhesive 11 is applied so as to fill the inside of the recess formed by the frame-shaped insulating adhesive 12a, and the same steps as in Example 1 are performed below. The circuit board 1 is fixed to the heat radiation fin 2.

In the third embodiment, a frame-shaped sheet-shaped insulating adhesive 12a is preliminarily adhered onto the radiation fins 2 so that the inside of the recess formed by the frame-shaped insulating adhesive 12a is filled. Since the conductive adhesive 11 is applied to fix the circuit board 1 and the heat radiation fins 2 to each other, cracking of the circuit board 1 in the assembly process can be suppressed, and the cleaning process after the assembly can be omitted. According to the second embodiment, the conductive adhesive 11 can be kept uniform in thickness.
The same effect as can be obtained. Further, in addition to this effect, in the third embodiment, it is not necessary to provide the recess 2a on the upper surface of the heat dissipation fin 2 provided in the second embodiment, so that the processing step necessary for forming the recess of the heat dissipation fin 2 is omitted. Further, it is possible to obtain a semiconductor device and a method for manufacturing the semiconductor device, which can be manufactured at low cost and can be manufactured at low cost.

Example 4. 4 (a) and 4 (b) are a perspective view (FIG. 4 (a)) and a sectional view (FIG. 4 (b)) showing a semiconductor device and its manufacturing method according to a fourth embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions. 1a is an injection hole provided in the circuit board 1 for injecting a conductive adhesive, and the injection hole 1a is located at the center of a region R described later. Further, 12 is an insulating adhesive, 13 is a dispenser for injecting a conductive adhesive, R
Is an area located in a portion where the circuit board 1 and the heat radiation fin 2 should be electrically connected, and the insulating adhesive 12 is not applied to this area R.

In the first embodiment, the conductive adhesive 11 is applied to the entire bonding surface, but in the fourth embodiment, the area other than the area R is insulated by means of the screen printing method or the like as shown in FIG. The adhesive 12 is applied. After the circuit board 1 is mounted and pressed on the applied insulating adhesive 12, the circuit board 1
A conductive adhesive 11 is injected from a hole 1a provided in the substrate 1 by a dispenser 13 or the like, and both adhesives are cured by a heating means such as an oven to fix the radiation fin 2 to the circuit board 1.

In the fourth embodiment, the circuit board and the radiation fin are fixed to each other with the insulating adhesive, and the conductive adhesive is used only for the portions where conduction is required. Therefore, the insulating adhesive and the conductive adhesive are used. Both of them serve as cushions to prevent the circuit board 1 from cracking during the assembly process, and the cleaning process after assembly can be omitted, which is the same effect as that of the first embodiment. In addition to this effect, an insulating adhesive is applied to a region other than the region R where the electrical connection between the circuit board 1 and the heat dissipation fin 2 is required, and the conductive adhesive is used only in the region R. There is an effect that a semiconductor device in which the amount of expensive conductive adhesive 11 used can be reduced and a manufacturing method thereof can be obtained.

Example 5. 5 (a) and 5 (b) are a perspective view (FIG. 5 (a)) and a sectional view (FIG. 5 (b)) showing a semiconductor device and its manufacturing method according to a fifth embodiment of the present invention.
In the figure, the same reference numerals as those in FIGS. 1 and 4 indicate the same or corresponding portions. Reference numeral 12b is a sheet-like insulating adhesive having an opening in a portion corresponding to the region R.

In the fourth embodiment, the insulating adhesive 12 was applied by the screen printing method or the like, but in the fifth embodiment, as shown in FIG.
As described above, the heat radiation fin 2 is formed into a circuit by using the sheet-shaped insulating adhesive 12b in which the opening is provided in the region R located at the portion where the circuit board 1 and the heat radiation fin 2 must be electrically connected in advance. After adhering to the substrate 1, a conductive adhesive 11 is injected from a pouring hole 1a provided in the circuit board 1 by a dispenser 13 or the like, and both adhesives are cured by a heating means such as an oven to fix the circuit board to the radiation fin. To do.

In the fifth embodiment, by using the insulating adhesive in the area other than the area R, the cracking of the circuit board 1 in the assembling process can be suppressed as in the fourth embodiment.
The cleaning step after assembly can be omitted, and the amount of expensive conductive adhesive used can be reduced.
In addition to the effects of the fourth embodiment, a semiconductor device in which the thickness of the adhesive can be made uniform by using a sheet-shaped insulating adhesive having an opening in the region R, and a method for manufacturing the semiconductor device are obtained. There is an effect that is.

Example 6. 6 is a perspective view (FIG. 6 (a)) and a sectional view (FIGS. 6 (b) and 6 (c)) showing a semiconductor device and its manufacturing method according to a sixth embodiment of the present invention. In the figure, the same reference numerals as those in FIGS. 1 and 5 indicate the same or corresponding portions. 14 is an electric iron used as a spot-like heating means, 15 is a screen mask used for screen printing,
Reference numeral 16 is a squeegee used for screen printing.

In the fifth embodiment, after the circuit board 1 is mounted, the conductive adhesive 11 is introduced through the injection hole 1a provided in the circuit board.
Was injected using a dispenser 13 or the like, but in the present embodiment, as shown in FIG. 6, a sheet-like insulating adhesive 12b having an opening in the region R is placed on the heat radiation fin 2 as a spot heating means. Is temporarily fixed by using an electric iron 14 as a sheet, and then a screen mask 15 having an opening is provided only in a region R provided in the sheet-shaped insulating adhesive 12b, and a conductive adhesive is provided by a squeegee 16. After screen-printing 11 and mounting the circuit board 1, the adhesive is cured by heating means such as an oven to fix the circuit board 1 to the radiation fins 2.

In the sixth embodiment, since the sheet-shaped insulating adhesive having the opening portion in the region R is used, cracking of the circuit board 1 in the assembly process can be suppressed and the cleaning process after the assembly can be performed. The same effect as in Example 5 can be obtained, which can be omitted, and the amount of expensive conductive adhesive used can be reduced and the thickness of the adhesive can be made uniform. Further, in addition to the effects of the fifth embodiment, by screen-printing a conductive adhesive, the injection hole 1a becomes unnecessary, and the process for providing the injection hole 1a in the circuit board 1 can be omitted, and the manufacturing thereof. There is an effect that a method can be obtained.

Example 7. 7 is a perspective view showing a semiconductor device and a manufacturing method thereof according to a seventh embodiment of the present invention. In the figure, the same reference numerals as those in FIGS. 1 and 5 indicate the same or corresponding portions, and 11a is a sheet-shaped conductive adhesive.

In the sixth embodiment, the conductive adhesive 11 is applied to the opening region R provided in the sheet-shaped insulating adhesive 12b. However, in the seventh embodiment, as shown in FIG. A sheet-shaped conductive adhesive 11a is embedded in the opening R of the conductive adhesive 12b, and a sheet-shaped adhesive in which both are integrated is adhered onto the radiation fin 2, and the circuit board 1 is mounted on this sheet-shaped adhesive. After pressing, both adhesives are hardened by heating means such as an oven to fix the circuit board 1 to the heat radiation fins 2.

In the seventh embodiment, since the sheet-shaped insulating adhesive having the opening portion in the region R is used, cracking of the circuit board 1 in the assembly process can be suppressed, and the cleaning process after the assembly can be performed. In addition to being omitted, the amount of expensive conductive adhesive used can be reduced, and the thickness of the adhesive can be made uniform, which is the same effect as in Example 6. In addition to this effect, since the sheet-shaped insulating adhesive and the sheet-shaped conductive adhesive are integrated, a semiconductor device capable of simplifying the assembly work of the product, and the manufacturing thereof. There is an effect that a method can be obtained.

Example 8. Embodiment 8 FIG. 8 is a sectional view showing a semiconductor device and a method for manufacturing the same according to Embodiment 8 of the present invention. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions, and 12c is a sheet-shaped insulating adhesive.

In the seventh embodiment, the sheet-shaped insulating adhesive 12b is formed by embedding the sheet-shaped conductive adhesive 11a in the region R, but in the eighth embodiment, as shown in FIG.
A sheet-shaped insulating adhesive 12c having no opening, that is, an adhesive sheet coated with a conductive adhesive 11 so as to cover the entire surface thereof, is used, and the sheet is adhered onto the heat radiation fins 2. After mounting the circuit board 1 on the sheet-like adhesive and pressing it, both adhesives are cured by a heating means such as an oven, and the circuit board 1 is fixed to the heat radiation fin 2.

In the eighth embodiment, since the insulating adhesive and the conductive adhesive are integrated, the circuit board 1 can be prevented from cracking in the assembly process, and the cleaning process after the assembly can be performed. In addition to being omitted, the amount of expensive conductive adhesive used can be reduced, and the thickness of the adhesive can be made uniform, which is the same effect as in Example 6. The same effect as that of the seventh embodiment can be obtained. In addition to this effect, since a sheet-shaped insulating adhesive coated with a conductive adhesive on the outer periphery is used, a semiconductor device fixed using a sheet-shaped adhesive having a wider range of use, And, there is an effect that the manufacturing method thereof can be obtained.

Example 9. 9A and 9B are sectional views showing a semiconductor device and a method for manufacturing the same according to a ninth embodiment of the present invention. In the figure, the same reference numerals as those in FIG. 1 indicate the same or corresponding portions, and 12d is an insulating adhesive having an opening r provided at an arbitrary position.

In Example 8 described above, the adhesive sheet coated with the conductive adhesive 11 so as to wrap the outer periphery of the sheet-shaped insulating adhesive 12c was used.
Then, instead of the sheet-shaped insulating adhesive 12c, a sheet-shaped insulating adhesive 12d having an opening r provided at an arbitrary position is used. As shown in FIG. 9, a sheet-like insulating adhesive 12d having an opening r is wrapped around the outer periphery of the sheet, and an adhesive sheet coated with a conductive adhesive 11 so as to fill the opening r is used as a radiation fin. 2 is adhered onto the sheet-like adhesive, and the circuit board 1 is mounted and pressed on the sheet-like adhesive, and then both adhesives are cured by a heating means such as an oven to fix the circuit board 1 to the radiation fin 2.

In Example 9, a sheet-shaped insulating adhesive was coated with a conductive adhesive, and the insulating adhesive and the conductive adhesive were integrated into one adhesive. It is possible to suppress cracking of the circuit board 1 in the assembly process, omit the cleaning process after assembly, reduce the amount of expensive conductive adhesive used, and reduce the thickness of the adhesive. It is possible to obtain the same effect as that of the above-described Embodiment 8 that the semiconductor device can be made uniform and can be fixed using a sheet-shaped adhesive having a wider use range. In addition to this effect, the sheet-shaped insulating adhesive has an opening r at an arbitrary position and is coated with a conductive adhesive so as to fill the opening r. There is an effect that a semiconductor device and its manufacturing method can be obtained in which the electrical resistance between the semiconductor device and the semiconductor device can be reduced as compared with the eighth embodiment.

In the first to ninth embodiments,
Although the case where the circuit board is a ceramic thick film circuit board has been described as an example, this may be a normal semiconductor substrate, and the same effect as that of the above-described embodiment can be obtained.

[0064]

As described above, according to the method of manufacturing a semiconductor device of the present invention, a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated in the circuit substrate is manufactured. The method is provided with a step of fixing the circuit board to the heat radiation fins with a conductive adhesive, so that the stress of strain during installation is absorbed while ensuring the electrical connection between the circuit board and the heat radiation fins. It is possible to prevent the crack of the circuit board from occurring until the size (thickness) of the foreign matter between the circuit board and the heat radiation fin is increased to 2 to 3 times as large as the conventional size. Further, since the step of requiring high technology by soldering and the step of cleaning the flux can be omitted, there is an effect that a semiconductor device manufacturing method capable of obtaining a highly reliable product can be obtained.

Further, according to the semiconductor device of the present invention, in a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, the circuit substrate is electrically conductive to the heat radiation fin. Since it is fixed with a conductive adhesive, it is possible to absorb the stress of strain at the time of mounting while ensuring the electrical connection between the circuit board and the heat radiation fin, and the circuit board is not cracked. It is possible to prevent the size (thickness) of the foreign matter between the heat radiation fin and the heat radiation fin from becoming 2 to 3 times as large as the conventional size. Further, since it is possible to omit a process requiring advanced technology by soldering and a flux cleaning process, it is possible to obtain a highly reliable product.

Further, according to the present invention, in the method for manufacturing a semiconductor device, the circuit board on the heat radiation fin is bonded before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. Since the step of forming a recess in the portion to be formed and the step of applying a conductive adhesive to the recess are included, it is necessary to prevent the conductive adhesive from protruding to the surroundings and to make the thickness of the adhesive uniform. Therefore, there is an effect that a method of manufacturing a semiconductor device can be obtained which can obtain a more reliable product.

Further, according to the present invention, in the method of manufacturing a semiconductor device, a frame-shaped sheet-like member is formed on the heat radiation fin before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. Since the step of adhering the insulating adhesive and the step of applying the conductive adhesive inside the frame-shaped sheet-shaped insulating adhesive are included, it is possible to prevent the conductive adhesive from sticking out from the surroundings. There is an effect that a method for manufacturing a semiconductor device can be obtained which can be carried out in easier steps to prevent the above, to make the thickness of the adhesive uniform, and to obtain the above effect.

Further, according to the semiconductor device of the present invention, in a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, a frame-shaped sheet is provided on the heat radiation fin. -Shaped insulating adhesive is adhered, a conductive adhesive is applied to the inside of the frame-shaped sheet-shaped insulating adhesive, and the circuit board is fixed to the heat dissipation fin by the conductive adhesive. Therefore, the circuit board can be prevented from cracking so that the size (thickness) of the foreign matter between the circuit board and the heat radiation fin does not become up to two to three times as large as the conventional size, and the conductive adhesive can be applied to the circuit board. There is an effect that it can be prevented from protruding from the surroundings, the thickness of the adhesive can be made uniform, and a more reliable product can be obtained.

According to the present invention, in the method of manufacturing a semiconductor device, the circuit board on the heat dissipation fin and the circuit board on the heat dissipation fin are fixed before the step of fixing the circuit board to the heat dissipation fin with the conductive adhesive. A step of applying an insulating adhesive to a region other than a region necessary for electrically connecting the heat radiation fin, and a region necessary for electrically connecting the circuit board and the heat radiation fin to the circuit substrate. The step of injecting the conductive adhesive on the heat radiation fins through the holes provided, and the heat radiation fins and the above so as to electrically connect the circuit board and the heat radiation fins by the conductive adhesive. Since the step of adhering to the circuit board is included, the circuit board does not crack, and the size (thickness) of the foreign matter between the circuit board and the heat radiation fin does not occur up to 2 to 3 times the size of the conventional one. , Glue Thickness can a uniform, can reduce the amount of expensive conductive adhesive, the effect of the manufacturing method is obtained a semiconductor device obtained by the inexpensive production costs more reliable product.

Further, according to the semiconductor device of the present invention, in a semiconductor device having a substrate forming a circuit and a heat radiation fin for radiating heat generated in the circuit substrate, the circuit substrate on the heat radiation fin is provided. An insulating adhesive is applied to a region other than a region necessary for electrically connecting the heat radiation fins, and the circuit substrate is provided in the region required for electrical connection between the circuit substrate and the heat radiation fins. The conductive adhesive is injected onto the heat dissipation fins through the formed holes, and the heat dissipation fins and the circuit board are connected so that the circuit board and the heat dissipation fins are electrically connected by the conductive adhesive. Since the circuit board is adhered to the heat radiation fin, the circuit board is cracked, and the size (thickness) of the foreign matter between the circuit board and the heat radiation fin is 2 to 3 times larger than that of the conventional one. Double size The adhesive thickness can be made uniform, the amount of expensive conductive adhesive used can be reduced, and the manufacturing cost of a more reliable product can be obtained at a low manufacturing cost. is there.

Further, according to the present invention, in the method of manufacturing a semiconductor device, the insulating adhesive is a sheet-shaped insulating material in which a region necessary for electrical connection between the circuit board and the radiation fin is removed in advance. Since a conductive adhesive is used, the amount of expensive conductive adhesive used can be reduced, the thickness of the adhesive can be made constant, the manufacturing cost can be reduced, and a highly reliable product can be obtained. There is an effect that a method for manufacturing a semiconductor device can be obtained.

Further, according to the present invention, in the method for manufacturing a semiconductor device, the insulating adhesive is a sheet-shaped insulating material in which a region requiring electrical connection between the circuit board and the radiation fin is removed in advance. Using a transparent adhesive,
Before the step of fixing the circuit board to the radiation fin,
Since the step of temporarily fixing the sheet-shaped insulating adhesive on the heat dissipation fin and the step of applying the conductive adhesive to the region where the sheet-shaped insulating adhesive has been removed are included. Reduce the use of expensive conductive adhesives,
There is an effect that a method for manufacturing a semiconductor device can be obtained in which the thickness of the adhesive can be made uniform, the manufacturing cost can be reduced, and a highly reliable product can be obtained.

Further, according to the present invention, in the method for manufacturing a semiconductor device, a sheet-like sheet having an opening in a region necessary for electrical connection between the circuit board and the radiation fin is used as the conductive adhesive. Since the sheet-shaped conductive adhesive embedded in the opening of the insulating adhesive is used, the amount of expensive conductive adhesive used can be reduced, and the thickness of the adhesive can be made uniform. Can be made cheaper,
There is an effect that a semiconductor device manufacturing method that can simplify the assembly process is obtained.

Further, according to the present invention, in the method for manufacturing a semiconductor device described above, the conductive adhesive is applied in a sheet shape by coating the conductive adhesive so as to surround the outer periphery of a sheet insulating adhesive. Since it uses the adhesive of, the amount of expensive conductive adhesive used can be reduced, the thickness of the adhesive can be made uniform, and the manufacturing cost can be further reduced.
There is an effect that a method of manufacturing a semiconductor device in which a sheet-shaped adhesive having a wider range of use is used for fixing is obtained.

Further, according to the semiconductor device of the present invention, in a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, the circuit substrate is placed on the heat radiation fin as a sheet. Since the sheet-like adhesive formed by applying the conductive adhesive so as to wrap the outer periphery of the insulating adhesive in the form of a sheet is fixed, the crack of the circuit board is There is an effect that the size (thickness) of foreign matter in between does not occur to a size that is 2 to 3 times as large as that of the conventional one, the thickness of the adhesive can be made uniform, and a more reliable product can be obtained at low cost.

Further, according to the present invention, in the above-mentioned method for manufacturing a semiconductor device, the sheet-shaped insulating adhesive has holes at arbitrary positions, and the outer periphery of the sheet-shaped insulating adhesive. Since the sheet-shaped adhesive formed by coating the above-mentioned conductive adhesive so as to fill the hole is used, the amount of expensive conductive adhesive used is reduced and the thickness of the adhesive is made uniform. Therefore, there is an effect that the manufacturing cost can be further reduced, and the manufacturing method of the semiconductor device in which the fixing is performed using the sheet-shaped adhesive having a wider use range can be obtained.

[Brief description of drawings]

FIG. 1 is a perspective view showing a semiconductor device and a manufacturing method thereof according to a first embodiment of the present invention.

FIG. 2 is a perspective view (FIG. 2 (a)) and a sectional view (FIG. 2 (b)) showing a semiconductor device and a method for manufacturing the same according to a second embodiment of the present invention.

FIG. 3 is a perspective view showing a semiconductor device and a manufacturing method thereof according to a third embodiment of the present invention.

FIG. 4 is a perspective view (FIG. 4 (a)) and a sectional view (FIG. 4 (b)) showing a semiconductor device and a method for manufacturing the same according to a fourth embodiment of the present invention.

FIG. 5 is a perspective view (FIG. 5 (a)) and a cross-sectional view (FIG. 5 (b)) showing a semiconductor device and a method for manufacturing the same according to a fifth embodiment of the present invention.

FIG. 6 is a perspective view (FIG. 6 (a)) and a sectional view (FIG. 6 (b), FIG. 6 (c)) showing a semiconductor device and a method for manufacturing the same according to a sixth embodiment of the present invention.

FIG. 7 is a perspective view showing a semiconductor device and a manufacturing method thereof according to a seventh embodiment of the present invention.

FIG. 8 is a sectional view showing a semiconductor device and a manufacturing method thereof according to an eighth embodiment of the present invention.

FIG. 9 is a cross-sectional view showing a semiconductor device and a manufacturing method thereof according to a ninth embodiment of the present invention.

FIG. 10 is a perspective view showing a conventional semiconductor device.

FIG. 11 is a perspective view showing the appearance of a conventional semiconductor device.

[Explanation of symbols]

1 circuit board, 1a injection hole provided in the circuit board, 2
Radiating fin, 2a concave part on the upper surface of radiating fin, 3 solder,
4 flux, 11 conductive adhesive, 11a sheet-shaped conductive adhesive, 12 insulating adhesive, 12a sheet-shaped insulating adhesive, 12b sheet-shaped insulating adhesive, 12c sheet-shaped insulating adhesive , 12d sheet-like insulating adhesive, 13 dispenser, 14 spot heating means, 15 screen mask, 16
Squeegee, 21 cap, 22 input / output leads.

Claims (13)

[Claims] 1. A method of manufacturing a semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein the circuit substrate is fixed to the heat radiation fin with a conductive adhesive. A method of manufacturing a semiconductor device, comprising the steps of: 2. A semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein the circuit substrate is fixed to the heat radiation fin with a conductive adhesive. Characteristic semiconductor device. 3. The method of manufacturing a semiconductor device according to claim 1, wherein the circuit board on the heat radiation fin is bonded before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive. A method of manufacturing a semiconductor device, comprising: a step of providing a concave portion in a concave portion; and a step of applying the conductive adhesive to the concave portion. 4. The method of manufacturing a semiconductor device according to claim 1, wherein, before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive, a frame-shaped sheet-shaped insulation is provided on the heat radiation fin. A method of manufacturing a semiconductor device, comprising: a step of adhering a conductive adhesive; and a step of applying the conductive adhesive inside the frame-shaped sheet-shaped insulating adhesive. 5. A semiconductor device having a substrate on which a circuit is mounted and a radiation fin for radiating heat generated by the circuit substrate, wherein a frame-shaped sheet-like insulating adhesive is bonded onto the radiation fin, A semiconductor device, characterized in that a conductive adhesive is applied to the inside of a frame-shaped sheet-shaped insulating adhesive, and the circuit board is fixed to the heat radiation fin by the conductive adhesive. 6. The method of manufacturing a semiconductor device according to claim 1, wherein before the step of fixing the circuit board to the heat radiation fin with the conductive adhesive, the circuit board and the heat radiation on the heat radiation fin are attached. A step of applying an insulating adhesive to a region other than a region necessary to electrically connect the fins, and providing the circuit substrate in a region necessary to electrically connect the circuit substrate and the heat radiation fin. A step of injecting the conductive adhesive on the heat radiation fins through the holes formed, and the heat radiation fins and the circuit so as to electrically connect the circuit board and the heat radiation fins by the conductive adhesive. And a step of adhering to a substrate. 7. A semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein the circuit substrate on the heat radiation fin and the heat radiation fin are electrically connected. Insulating adhesive is applied to a region other than the region required for the heat radiation fin, and the heat radiation fin is provided in the region required for electrical connection between the circuit board and the heat radiation fin through a hole provided in the circuit board. Injecting the conductive adhesive on the above, the heat radiation fin and the circuit board are adhered so that the circuit board and the heat radiation fin are electrically connected by the conductive adhesive, and the circuit board is radiated by the heat radiation. A semiconductor device characterized by being fixed to a fin. 8. The method of manufacturing a semiconductor device according to claim 4, wherein the insulating adhesive has a sheet shape in which a region necessary for electrical connection between the circuit board and the heat radiation fin is removed in advance. A method for manufacturing a semiconductor device, which uses an insulating adhesive. 9. The method of manufacturing a semiconductor device according to claim 4, wherein the insulating adhesive has a sheet shape in which a region necessary for electrical connection between the circuit board and the heat radiation fin is removed in advance. Prior to the step of fixing the circuit board to the heat radiation fin using an insulating adhesive, the step of temporarily fixing the sheet-shaped insulation adhesive on the heat radiation fin, and the sheet-shaped insulating adhesive And a step of applying the conductive adhesive to the region from which the above has been removed. 10. The method for manufacturing a semiconductor device according to claim 1, wherein the electrically conductive adhesive has a sheet-like insulation having an opening in a region required for electrical connection between the circuit board and the heat radiation fin. A method for manufacturing a semiconductor device, characterized in that a sheet-shaped conductive adhesive embedded in the opening of the conductive adhesive is used. 11. The method of manufacturing a semiconductor device according to claim 1, wherein the conductive adhesive is a sheet-shaped insulating adhesive that is coated with the conductive adhesive so as to wrap the outer periphery of the sheet-shaped insulating adhesive. A method of manufacturing a semiconductor device, characterized by using an adhesive. 12. A semiconductor device having a substrate on which a circuit is mounted and a heat radiation fin for radiating heat generated by the circuit substrate, wherein the heat radiation fin is wrapped around a sheet-shaped insulating adhesive on the circuit substrate. A semiconductor device that is fixed by using a sheet-like adhesive formed by applying a conductive adhesive so as to avoid the above problem. 13. The method of manufacturing a semiconductor device according to claim 11, wherein the sheet-like insulating adhesive has holes at predetermined positions, and the holes surround the outer periphery of the insulating adhesive to form the holes. A method of manufacturing a semiconductor device, characterized in that a sheet-shaped adhesive obtained by applying the above-mentioned conductive adhesive so as to fill in the above is used.