JP2022081373A - Circuit board - Google Patents

Circuit board Download PDF

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Publication number
JP2022081373A
JP2022081373A JP2021026179A JP2021026179A JP2022081373A JP 2022081373 A JP2022081373 A JP 2022081373A JP 2021026179 A JP2021026179 A JP 2021026179A JP 2021026179 A JP2021026179 A JP 2021026179A JP 2022081373 A JP2022081373 A JP 2022081373A
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layer
circuit board
hole
adhesive layer
heat dissipation
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JP7208280B2 (en
Inventor
東昇 李
Tosho Ri
規浩 ▲ほう▼
Kuei-Hao Pang
兆▲けい▼ 魏
Chao-Ching Wei
晉村 郭
Chin-Tsun Kuo
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Chipbond Technology Corp
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Chipbond Technology Corp
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09554—Via connected to metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

To provide a circuit board with flexibility which can be wound.SOLUTION: A circuit board comprises a substrate 110 having a front face 111 and a circuit layer, and a heat dissipation sheet 120. The heat dissipation sheet 120 is bonded to the substrate 110 by an adhesion layer 123, and the adhesion layer 123 is positioned between a heat dissipation layer 122 and the substrate 110. The heat dissipation layer 122 is projected to a front face 111 of the substrate 110. A first projection region A1 is formed on the front face 111. The first projection region A1 includes a first projection area. The adhesion layer 123 is projected to the front face 111 of the substrate 110. A second projection region A2 is formed on the front face 111. The second projection region A2 includes a second projection area. The second projection region A2 is positioned in the first projection region A1. The second projection area is less than the first projection area. An event that the adhesion layer 123 is leaked to or projected to the dissipation layer 122 to contaminate the substrate 110 is avoided. When taking up a plurality of circuit boards 100, an event that those circuit boards 100 are bonded to each other is avoided.SELECTED DRAWING: Figure 3

Description

本発明は、回路基板とそれに用いられる放熱シートに関し、可撓性があり巻き取り可能な回路基板に関するものである。 The present invention relates to a flexible and rewindable circuit board with respect to a circuit board and a heat dissipation sheet used therein.

従来のフレキシブル回路基板は薄膜フリップチップパッケージ（ＣＯＦ）に普遍的に運用されており、パッケージ構造の放熱効果を向上させるために、通常は放熱材を貼り付けてパッケージ構造のチップ及び薄膜基板を被覆させている。
薄膜フリップチップパッケージ構造として、例えば、特許文献１に記載されたものが知られている。薄膜フリップチップパッケージ構造は同じ構造の第一放熱部材及び第二放熱部材を薄膜基板の第一表面及び第二表面にそれぞれ貼り付けている。第一放熱部材は基材と、第一接着層と、熱伝導層と、第一金属層と、第二接着層と、第二金属層と、を備え、第一接着層及び第二接着層の端部は基材、熱伝導層、第一金属層、及び第二金属層の端部に揃えている。 Conventional flexible circuit boards are universally used in thin film flip-chip packages (COFs), and in order to improve the heat dissipation effect of the package structure, heat dissipation materials are usually attached to cover the chips and thin film substrates of the package structure. I'm letting you.
As a thin film flip chip package structure, for example, the one described in Patent Document 1 is known. In the thin film flip chip package structure, the first heat radiating member and the second heat radiating member having the same structure are attached to the first surface and the second surface of the thin film substrate, respectively. The first heat dissipation member includes a base material, a first adhesive layer, a heat conductive layer, a first metal layer, a second adhesive layer, and a second metal layer, and includes a first adhesive layer and a second adhesive layer. The ends of the base material, the heat conductive layer, the first metal layer, and the second metal layer are aligned with each other.

薄膜フリップチップパッケージ構造を圧搾した場合、第一接着層及び第二接着層が圧力により基材、熱伝導層、第一金属層、及び第二金属層の端部に溢れ出すか突出し、薄膜基板の第一表面または第二表面を汚染した。また、薄膜フリップチップパッケージ構造を巻き取った場合にも基材、熱伝導層、第一金属層、第二金属層の端部の第一接着層及び第二接着層に溢れ出すか突出し、薄膜フリップチップパッケージ構造が互いに粘着し、薄膜フリップチップパッケージ構造の品質及び歩留まりに影響を及ぼした。 When the thin film flip-chip package structure is squeezed, the first adhesive layer and the second adhesive layer overflow or protrude from the base material, the heat conductive layer, the first metal layer, and the end of the second metal layer due to the pressure, and the thin film substrate. Contaminated the first or second surface of the. In addition, even when the thin film flip-chip package structure is wound up, it overflows or protrudes into the first adhesive layer and the second adhesive layer at the ends of the base material, the heat conductive layer, the first metal layer, and the second metal layer, resulting in a thin film. The flip-chip package structures adhered to each other, affecting the quality and yield of the thin-film flip-chip package structure.

台湾登録実用新案第Ｍ６０２７２５号公報Taiwan Registered Utility Model No. M602725 Gazette

本発明は、上述に鑑みてなされたものであり、その目的は、接着層が放熱シートの放熱層に溢れ出すか突出する事象を回避する回路基板を提供することにある。 The present invention has been made in view of the above, and an object of the present invention is to provide a circuit board for avoiding an event in which an adhesive layer overflows or protrudes into the heat dissipation layer of a heat dissipation sheet.

本発明の回路基板は、表面及び回路層を有している基板と、放熱層及び接着層を有し、放熱シートは前記接着層により前記基板に貼り付け、前記接着層は前記放熱層と前記基板との間に位置し、前記放熱層は前記基板の前記表面に投影し、前記表面に第一投影領域を形成し、前記第一投影領域は第一投影面積を有し、前記接着層は前記基板の前記表面に投影し、前記表面に第二投影領域を形成し、前記第二投影領域は第二投影面積を有している前記放熱シートと、を備え、前記第二投影領域は前記第一投影領域中に位置し、前記第二投影面積は前記第一投影面積未満である。 The circuit board of the present invention has a substrate having a surface and a circuit layer, a heat radiating layer and an adhesive layer, the heat radiating sheet is attached to the substrate by the adhesive layer, and the adhesive layer is the heat radiating layer and the adhesive layer. Located between the substrate and the heat dissipation layer, it projects onto the surface of the substrate to form a first projection region on the surface, the first projection region has a first projection area, and the adhesive layer The second projection region comprises the heat dissipation sheet, which is projected onto the surface of the substrate to form a second projection region on the surface, the second projection region having a second projection area, and the second projection region is said. Located in the first projection area, the second projection area is less than the first projection area.

本発明の回路基板の放熱シートは、第一表面を有している放熱層と、貼り付け面を有し、前記貼り付け面により前記放熱層の前記第一表面に貼り付け、回路層を有している基板に放熱シートを貼り付けるために用い、前記第一表面は面積を有し、前記貼り付け面は貼り付け面積を有している接着層と、を備える前記放熱シートであって、前記接着層の前記貼り付け面積は前記第一表面の前記面積未満である。 The heat dissipation sheet of the circuit board of the present invention has a heat dissipation layer having a first surface and a sticking surface, and is stuck to the first surface of the heat dissipation layer by the sticking surface to have a circuit layer. The heat-dissipating sheet is used to attach a heat-dissipating sheet to a substrate, and the first surface has an area, and the pasting surface has an adhesive layer having a sticking area. The sticking area of the adhesive layer is less than the area of the first surface.

本発明は接着層が投影される第二投影領域が、放熱層が投影される第一投影領域中に位置し、第二投影面積は第一投影面積未満であるか、接着層の貼り付け面の貼り付け面積が放熱層の第一表面の面積未満であることにより、接着層が放熱層に溢れ出すか突出して基板を汚染する事象を回避し、複数の回路基板を巻き取る際にこれら回路基板が互いに粘着する事象も回避している。 In the present invention, the second projection area on which the adhesive layer is projected is located in the first projection area on which the heat dissipation layer is projected, and the second projection area is less than the first projection area, or the bonding surface of the adhesive layer is attached. Since the area to which the adhesive layer is attached is smaller than the area of the first surface of the heat radiating layer, the phenomenon that the adhesive layer overflows or protrudes into the heat radiating layer and contaminates the substrate is avoided, and these circuits are used when winding a plurality of circuit boards. It also avoids the phenomenon that the substrates stick to each other.

本発明の第一実施形態に係る回路基板を示す外観斜視図である。It is an external perspective view which shows the circuit board which concerns on 1st Embodiment of this invention. 本発明の第一実施形態に係る回路基板を示す平面図である。It is a top view which shows the circuit board which concerns on 1st Embodiment of this invention. 本発明の第一実施形態に係る回路基板を示す断面図である。It is sectional drawing which shows the circuit board which concerns on 1st Embodiment of this invention. 本発明の第一実施形態に係る放熱シートを示す底面図である。It is a bottom view which shows the heat dissipation sheet which concerns on 1st Embodiment of this invention. 本発明の第二実施形態に係る回路基板を示す断面図である。It is sectional drawing which shows the circuit board which concerns on 2nd Embodiment of this invention. 本発明の第三実施形態に係る回路基板を示す断面図である。It is sectional drawing which shows the circuit board which concerns on 3rd Embodiment of this invention. 本発明の第四実施形態に係る回路基板を示す断面図である。It is sectional drawing which shows the circuit board which concerns on 4th Embodiment of this invention.

以下、本発明による実施形態を図面に基づいて説明する。なお、複数の実施形態において実質的に同一の構成部位には同一の符号を付し、説明を省略する。 Hereinafter, embodiments according to the present invention will be described with reference to the drawings. In the plurality of embodiments, substantially the same constituent parts are designated by the same reference numerals, and the description thereof will be omitted.

（第一実施形態）
本発明の第一実施形態について図１から図４に基づいて説明する。 (First Embodiment)
The first embodiment of the present invention will be described with reference to FIGS. 1 to 4.

図１から図３に示すように、本発明に係る回路基板１００はチップの接合に用い（図示省略）、パッケージ構造（例えば、薄膜フリップチップパッケージ、ＣＯＦ）を構成している。回路基板１００は基板１１０及び放熱シート１２０を備え、基板１１０は表面１１１及び回路層を有している（図示省略）。回路層は表面１１１または他の表面の設置に限られず、回路層はチップの接合に用いている。 As shown in FIGS. 1 to 3, the circuit board 100 according to the present invention is used for chip bonding (not shown) and constitutes a package structure (for example, a thin film flip chip package, COF). The circuit board 100 includes a board 110 and a heat dissipation sheet 120, and the board 110 has a surface 111 and a circuit layer (not shown). The circuit layer is not limited to the installation of surface 111 or other surfaces, and the circuit layer is used for chip bonding.

図１、図３及び図４に示すように、放熱シート１２０は放熱層１２２及び接着層１２３を備え、放熱シート１２０は接着層１２３により基板１１０に貼り付けている。放熱層１２２の材質は金属及びグラファイト等の熱伝導及び放熱材料から選択し、接着層１２３は放熱層１２２と基板１１０との間に位置し、接着層１２３の厚さは１μｍ以上である。接着層１２３の材質は感圧接着剤及び熱硬化性樹脂等の粘着材料から選択している。放熱シート１２０は絶縁層１２１を備え、放熱層１２２は絶縁層１２１と接着層１２３との間に位置し、絶縁層１２１の材質はポリイミド（ＰＩ）等の絶縁材料から選択している。 As shown in FIGS. 1, 3 and 4, the heat radiating sheet 120 includes a heat radiating layer 122 and an adhesive layer 123, and the heat radiating sheet 120 is attached to the substrate 110 by the adhesive layer 123. The material of the heat radiating layer 122 is selected from heat conductive and heat radiating materials such as metal and graphite, the adhesive layer 123 is located between the heat radiating layer 122 and the substrate 110, and the thickness of the adhesive layer 123 is 1 μm or more. The material of the adhesive layer 123 is selected from adhesive materials such as pressure-sensitive adhesives and thermosetting resins. The heat radiating sheet 120 includes an insulating layer 121, the heat radiating layer 122 is located between the insulating layer 121 and the adhesive layer 123, and the material of the insulating layer 121 is selected from insulating materials such as polyimide (PI).

図１、図３及び図４に示すように、接着層１２３は貼り付け面１２３ａを有し、接着層１２３は貼り付け面１２３ａにより放熱層１２２の第一表面１２２ａに貼り付けている。第一表面１２２ａは面積を有し、貼り付け面１２３ａは貼り付け面積を有し、貼り付け面積は面積未満である。本実施形態では、貼り付け面１２３ａは貼り付け端部１２３ｂを有し、貼り付け端部１２３ｂと同側の放熱層１２２の第一端部１２２ｃとの間には第一距離Ｄ１を有している。第一距離Ｄ１は２０μｍ以上である。 As shown in FIGS. 1, 3 and 4, the adhesive layer 123 has a sticking surface 123a, and the adhesive layer 123 is stuck to the first surface 122a of the heat dissipation layer 122 by the sticking surface 123a. The first surface 122a has an area, the sticking surface 123a has a sticking area, and the sticking area is less than the area. In the present embodiment, the sticking surface 123a has a sticking end portion 123b, and has a first distance D1 between the sticking end portion 123b and the first end portion 122c of the heat dissipation layer 122 on the same side. There is. The first distance D1 is 20 μm or more.

図２に示すように、絶縁層１２１は放熱層１２２に接合している。
本実施形態では、絶縁層１２１は接合面１２１ａを有し、放熱層１２２は第二表面１２２ｂを有し、絶縁層１２１は接合面１２１ａが放熱層１２２の第二表面１２２ｂに向けられ、放熱層１２２と一体に接合している。放熱層１２２の第二表面１２２ｂには粗化することにより（黒化、機械粗化、エッチング等）表面粗化層１２２ｄを形成し、絶縁層１２１の接合部１２１ｂは表面粗化層１２２ｄに潜入し、表面粗化層１２２ｄ及び接合部１２１ｂが混合強化層Ｍを構成している。表面粗化層１２２ｄは放熱層１２２及び絶縁層１２１の接合面積を増加するために用い、混合強化層Ｍは絶縁層１２１及び放熱層１２２の接合強度を強化するために用い、絶縁層１２１が放熱層１２２から脱離する事象を回避している。 As shown in FIG. 2, the insulating layer 121 is bonded to the heat radiating layer 122.
In the present embodiment, the insulating layer 121 has a bonding surface 121a, the heat radiating layer 122 has a second surface 122b, and the insulating layer 121 has the bonding surface 121a directed toward the second surface 122b of the heat radiating layer 122. It is integrally joined with 122. A surface roughening layer 122d is formed by roughening (blackening, mechanical roughening, etching, etc.) on the second surface 122b of the heat radiation layer 122, and the joint portion 121b of the insulating layer 121 infiltrates into the surface roughening layer 122d. The surface roughening layer 122d and the joint portion 121b form the mixed reinforcing layer M. The surface roughened layer 122d is used to increase the bonding area of the heat radiating layer 122 and the insulating layer 121, the mixed reinforcing layer M is used to strengthen the bonding strength of the insulating layer 121 and the heat radiating layer 122, and the insulating layer 121 dissipates heat. The event of detaching from the layer 122 is avoided.

図１、図２及び図３に示すように、放熱シート１２０は接着層１２３により基板１１０に貼り付け、放熱層１２２は基板１１０の表面１１１に投影し、表面１１１には第一投影領域Ａ１を形成している。第一投影領域Ａ１は第一投影面積を有し、第一投影領域Ａ１の第一投影端部Ａ１１は放熱層１２２の第一端部１２２ｃが投影されることで形成されている。 As shown in FIGS. 1, 2 and 3, the heat radiating sheet 120 is attached to the substrate 110 by the adhesive layer 123, the heat radiating layer 122 is projected onto the surface 111 of the substrate 110, and the first projection region A1 is projected on the surface 111. Is forming. The first projection region A1 has a first projection area, and the first projection end portion A11 of the first projection region A1 is formed by projecting the first end portion 122c of the heat dissipation layer 122.

接着層１２３は表面１１１に投影し、表面１１１には第二投影領域Ａ２を形成し、第二投影領域Ａ２は第一投影領域Ａ１中に位置している。第二投影領域Ａ２は第二投影面積を有し、第二投影領域Ａ２の第二投影端部Ａ２１は接着層１２３の第二端部１２３ｃが投影されることにより形成されている。第二投影面積は第一投影面積未満であり、同側の第一投影端部Ａ１１と第二投影端部Ａ２１との間には第二距離Ｄ２を有している。第二距離Ｄ２は２０μｍ以上である。 The adhesive layer 123 projects onto the surface 111, forms a second projection region A2 on the surface 111, and the second projection region A2 is located in the first projection region A1. The second projection area A2 has a second projection area, and the second projection end portion A21 of the second projection area A2 is formed by projecting the second end portion 123c of the adhesive layer 123. The second projected area is less than the first projected area, and there is a second distance D2 between the first projected end portion A11 and the second projected end portion A21 on the same side. The second distance D2 is 20 μm or more.

第一投影端部Ａ１１、第二投影端部Ａ２１、及び放熱層１２２の第一端部１２２ｃにより空間Ｒを定義し、第二投影領域Ａ２が第一投影領域Ａ１中に位置し、第二投影領域Ａ２の第二投影面積は第一投影領域Ａ１の第一投影面積未満であり、第一距離Ｄ１及び第二距離Ｄ２により圧搾された接着層１２３を収容することにより、接着層１２３が放熱層１２２に溢れ出すか突出して基板１１０を汚染する事象を回避し、複数の回路基板１００を巻き取る際にこれら回路基板１００が互いに粘着する事象も回避している。 The space R is defined by the first projection end A11, the second projection end A21, and the first end 122c of the heat dissipation layer 122, the second projection area A2 is located in the first projection area A1, and the second projection. The second projected area of the region A2 is smaller than the first projected area of the first projected region A1, and by accommodating the adhesive layer 123 squeezed by the first distance D1 and the second distance D2, the adhesive layer 123 becomes a heat dissipation layer. The event of overflowing or protruding to 122 and contaminating the substrate 110 is avoided, and the event of the circuit boards 100 sticking to each other when the plurality of circuit boards 100 are wound is also avoided.

（第二実施形態）
図５に示すように、第二実施形態では、放熱層１２２は少なくとも１つの第一貫通孔１２２ｅを有し、第一貫通孔１２２ｅは接着層１２３に連通している。放熱シート１２０が圧迫されて接着層１２３を圧搾する場合、第一貫通孔１２２ｅは圧搾された接着層１２３を収容するために用い、接着層１２３が放熱層１２２に溢れ出すか突出して基板１１０を汚染する事象を回避し、複数の回路基板１００を巻き取る際にこれら回路基板１００が互いに粘着する事象も回避し、第一貫通孔１２２ｅが放熱層１２２の放熱効果を高めている。 (Second embodiment)
As shown in FIG. 5, in the second embodiment, the heat dissipation layer 122 has at least one first through hole 122e, and the first through hole 122e communicates with the adhesive layer 123. When the heat radiating sheet 120 is compressed to squeeze the adhesive layer 123, the first through hole 122e is used to accommodate the squeezed adhesive layer 123, and the adhesive layer 123 overflows or protrudes into the heat radiating layer 122 to cause the substrate 110. The event of contamination is avoided, the event that these circuit boards 100 adhere to each other when the plurality of circuit boards 100 are wound up is also avoided, and the first through hole 122e enhances the heat dissipation effect of the heat radiating layer 122.

この第二実施形態の他の基本的構成は、第一実施形態と同様である。 The other basic configuration of this second embodiment is the same as that of the first embodiment.

（第三実施形態）
図６に示すように、第三実施形態では、接着層１２３は少なくとも１つの第二貫通孔１２３ｄを有し、第二貫通孔１２３ｄは放熱層１２２及び基板１１０に連通している。放熱シート１２０が圧迫されて接着層１２３を圧搾する場合、第二貫通孔１２３ｄは圧搾された接着層１２３を収容するために用い、接着層１２３が放熱層１２２に溢れ出すか突出して基板１１０を汚染する事象を回避し、複数の回路基板１００を巻き取る際にこれら回路基板１００が互いに粘着する事象も回避している。本実施形態では、放熱層１２２は少なくとも１つの第一貫通孔１２２ｅを有し、接着層１２３は少なくとも１つの第二貫通孔１２３ｄを有し、第二貫通孔１２３ｄは第一貫通孔１２２ｅ及び基板１１０に連通し、第一貫通孔１２２ｅ及び第二貫通孔１２３ｄは圧搾された接着層１２３を収容するために用い、接着層１２３が放熱層１２２に溢れ出すか突出して基板１１０を汚染する事象を回避し、複数の回路基板１００を巻き取る際にこれら回路基板１００が互いに粘着する事象も回避している。 (Third embodiment)
As shown in FIG. 6, in the third embodiment, the adhesive layer 123 has at least one second through hole 123d, and the second through hole 123d communicates with the heat dissipation layer 122 and the substrate 110. When the heat radiating sheet 120 is compressed to squeeze the adhesive layer 123, the second through hole 123d is used to accommodate the squeezed adhesive layer 123, and the adhesive layer 123 overflows or protrudes into the heat radiating layer 122 to cause the substrate 110. The event of contamination is avoided, and the event that these circuit boards 100 adhere to each other when the plurality of circuit boards 100 are wound is also avoided. In the present embodiment, the heat dissipation layer 122 has at least one first through hole 122e, the adhesive layer 123 has at least one second through hole 123d, and the second through hole 123d has the first through hole 122e and the substrate. Communicating with 110, the first through hole 122e and the second through hole 123d are used to accommodate the squeezed adhesive layer 123, causing the adhesive layer 123 to overflow or protrude into the heat dissipation layer 122 and contaminate the substrate 110. This avoids the phenomenon that the circuit boards 100 adhere to each other when the plurality of circuit boards 100 are wound up.

この第三実施形態の他の基本的構成は、第一実施形態と同様である。 The other basic configuration of this third embodiment is the same as that of the first embodiment.

（第四実施形態）
図７に示すように、第四実施形態では、放熱層１２２は少なくとも１つの第一貫通孔１２２ｅを有し、接着層１２３は少なくとも１つの第二貫通孔１２３ｄを有し、絶縁層１２１は少なくとも１つの第三貫通孔１２１ｃを有し、第二貫通孔１２３ｄは第一貫通孔１２２ｅ及び第三貫通孔１２１ｃに連通している。第一貫通孔１２２ｅ、第二貫通孔１２３ｄ、及び第三貫通孔１２１ｃは圧搾された接着層１２３を収容するために用い、接着層１２３が放熱層１２２に溢れ出すか突出して基板１１０を汚染する事象を回避し、複数の回路基板１００を巻き取る際にこれら回路基板１００が互いに粘着する事象も回避している。 (Fourth Embodiment)
As shown in FIG. 7, in the fourth embodiment, the heat dissipation layer 122 has at least one first through hole 122e, the adhesive layer 123 has at least one second through hole 123d, and the insulating layer 121 has at least one second through hole 123d. It has one third through hole 121c, and the second through hole 123d communicates with the first through hole 122e and the third through hole 121c. The first through hole 122e, the second through hole 123d, and the third through hole 121c are used to accommodate the pressed adhesive layer 123, and the adhesive layer 123 overflows or protrudes into the heat dissipation layer 122 to contaminate the substrate 110. The event is avoided, and the event that the circuit boards 100 adhere to each other when the plurality of circuit boards 100 are wound up is also avoided.

本発明は接着層１２３を表面１１１の第二投影領域Ａ２に投影し、第二投影領域Ａ２は表面１１１に投影している放熱層１２２の第一投影領域Ａ１中に位置し、第二投影面積は第一投影面積未満であり、或いは、接着層１２３の貼り付け面１２３ａの貼り付け面積は放熱層１２２の第一表面１２２ａの面積未満であり、接着層１２３が放熱層１２２に溢れ出すか突出して基板１１０を汚染する事象を回避し、複数の回路基板１００を巻き取る際にこれら回路基板１００が互いに粘着する事象も回避している。 In the present invention, the adhesive layer 123 is projected onto the second projection region A2 of the surface 111, and the second projection region A2 is located in the first projection region A1 of the heat dissipation layer 122 projecting on the surface 111, and has a second projection area. Is less than the first projected area, or the sticking area of the sticking surface 123a of the adhesive layer 123 is less than the area of the first surface 122a of the heat radiating layer 122, and the adhesive layer 123 overflows or protrudes into the heat radiating layer 122. The event of contaminating the substrate 110 is avoided, and the event of the circuit boards 100 sticking to each other when the plurality of circuit boards 100 are wound is also avoided.

第四実施形態の他の基本的構成は、第一実施形態と同様である。 The other basic configurations of the fourth embodiment are the same as those of the first embodiment.

（その他の実施形態）
回路層は表面または他の表面に設置する。
回路基板は基板及び放熱シートを備え、基板は表面及び回路層を有している。 (Other embodiments)
The circuit layer is installed on one surface or another surface.
The circuit board comprises a substrate and a heat dissipation sheet, and the substrate has a surface and a circuit layer.

粗化は、黒化、機械粗化、エッチングに限られない。放熱層１２２の第二表面１２２ｂには粗化することにより表面粗化層１２２ｄを形成し、絶縁層１２１の接合部１２１ｂは表面粗化層１２２ｄに潜入し、表面粗化層１２２ｄ及び接合部１２１ｂが混合強化層Ｍを構成している。 The roughening is not limited to blackening, mechanical roughening, and etching. A surface roughening layer 122d is formed on the second surface 122b of the heat radiation layer 122 by roughening, and the joint portion 121b of the insulating layer 121 infiltrates into the surface roughening layer 122d, and the surface roughening layer 122d and the joint portion 121b. Consists of the mixed reinforcing layer M.

その実施形態の他の基本的構成は、第一実施形態と同様である。 The other basic configurations of the embodiment are the same as those of the first embodiment.

以上、本発明は、上記実施形態に限定されるものではなく、その要旨を逸脱しない範囲において種々の形態で実施可能である。 As described above, the present invention is not limited to the above embodiment, and can be implemented in various forms without departing from the gist thereof.

１００ 回路基板、
１１０ 基板、
１１１ 表面、
１２０ 放熱シート、
１２１ 絶縁層、
１２１ａ 接合面、
１２１ｂ 接合部、
１２１ｃ 第三貫通孔、
１２２ 放熱層、
１２２ａ 第一表面、
１２２ｂ 第二表面、
１２２ｃ 第一端部、
１２２ｄ 表面粗化層、
１２２ｅ 第一貫通孔、
１２３ 接着層、
１２３ａ 貼り付け面、
１２３ｂ 貼り付け端部、
１２３ｃ 第二端部、
１２３ｄ 第二貫通孔、
Ａ１ 第一投影領域、
Ａ１１ 第一投影端部、
Ａ２ 第二投影領域、
Ａ２１ 第二投影端部、
Ｄ１ 第一距離、
Ｄ２ 第二距離、
Ｍ 混合強化層、
Ｒ 空間。 100 circuit board,
110 board,
111 surface,
120 heat dissipation sheet,
121 Insulation layer,
121a Joint surface,
121b joint,
121c third through hole,
122 heat dissipation layer,
122a first surface,
122b Second surface,
122c 1st end,
122d surface roughened layer,
122e first through hole,
123 Adhesive layer,
123a pasting surface,
123b pasted end,
123c second end,
123d second through hole,
A1 first projection area,
A11 first projection end,
A2 second projection area,
A21 Second projection end,
D1 first distance,
D2 second distance,
M mixed reinforcement layer,
R space.

Claims (22)

表面及び回路層を有している基板と、
放熱層及び接着層を有し、放熱シートは前記接着層により前記基板に貼り付け、前記接着層は前記放熱層と前記基板との間に位置し、前記放熱層は前記基板の前記表面に投影し、前記表面に第一投影領域を形成し、前記第一投影領域は第一投影面積を有し、前記接着層は前記基板の前記表面に投影し、前記表面に第二投影領域を形成し、前記第二投影領域は第二投影面積を有している前記放熱シートと、を備える回路基板であって、
前記第二投影領域は前記第一投影領域中に位置し、前記第二投影面積は前記第一投影面積未満であることを特徴とする回路基板。 A substrate having a surface and a circuit layer,
It has a heat radiating layer and an adhesive layer, the heat radiating sheet is attached to the substrate by the adhesive layer, the adhesive layer is located between the heat radiating layer and the substrate, and the heat radiating layer is projected onto the surface of the substrate. The first projection region is formed on the surface, the first projection area has the first projection area, the adhesive layer is projected onto the surface of the substrate, and the second projection region is formed on the surface. , The second projection area is a circuit board comprising the heat dissipation sheet having the second projection area.
A circuit board characterized in that the second projection area is located in the first projection area and the second projection area is smaller than the first projection area. 前記接着層は貼り付け面を有し、前記接着層は前記貼り付け面により前記放熱層の第一表面に貼り付け、前記第一表面は面積を有し、前記貼り付け面は貼り付け面積を有し、前記貼り付け面積は前記面積未満であることを特徴とする請求項１に記載の回路基板。 The adhesive layer has a sticking surface, the adhesive layer is stuck to the first surface of the heat dissipation layer by the sticking surface, the first surface has an area, and the sticking surface has a sticking area. The circuit board according to claim 1, wherein the pasted area is less than the area. 前記貼り付け面は貼り付け端部を有し、前記貼り付け端部と同側の前記放熱層の第一端部との間には第一距離を有していることを特徴とする請求項２に記載の回路基板。 The present invention is characterized in that the sticking surface has a sticking end portion and has a first distance between the sticking end portion and the first end portion of the heat radiation layer on the same side. 2. The circuit board according to 2. 前記第一距離は２０μｍ以上であることを特徴とする請求項３に記載の回路基板。 The circuit board according to claim 3, wherein the first distance is 20 μm or more. 前記第一投影領域の第一投影端部は前記放熱層の第一端部が投影されることにより形成され、前記第二投影領域の第二投影端部は前記接着層の第二端部が投影されることにより形成され、同側の前記第一投影端部と前記第二投影端部との間には第二距離を有していることを特徴とする請求項１に記載の回路基板。 The first projection end of the first projection region is formed by projecting the first end of the heat dissipation layer, and the second projection end of the second projection region is formed by the second end of the adhesive layer. The circuit board according to claim 1, wherein the circuit board is formed by being projected and has a second distance between the first projection end portion and the second projection end portion on the same side. .. 前記第二距離は２０μｍ以上であることを特徴とする請求項５に記載の回路基板。 The circuit board according to claim 5, wherein the second distance is 20 μm or more. 前記第一投影端部、前記第二投影端部、及び前記放熱層の前記第一端部により空間を定義していることを特徴とする請求項５に記載の回路基板。 The circuit board according to claim 5, wherein a space is defined by the first projection end portion, the second projection end portion, and the first end portion of the heat dissipation layer. 前記放熱シートは絶縁層を備え、前記放熱層は前記絶縁層と前記接着層との間に位置し、前記絶縁層は接合面を有し、前記放熱層は第二表面を有し、前記絶縁層は前記接合面が前記放熱層の前記第二表面に向けられ、前記放熱層と一体に接合し、前記放熱層の前記第二表面には粗化することで表面粗化層を形成し、前記絶縁層の接合部は前記表面粗化層に潜入し、前記粗化層及び前記接合部が混合強化層を構成していることを特徴とする請求項１に記載の回路基板。 The heat radiating sheet comprises an insulating layer, the heat radiating layer is located between the insulating layer and the adhesive layer, the insulating layer has a joining surface, the heat radiating layer has a second surface, and the insulating. In the layer, the bonding surface is directed toward the second surface of the heat dissipation layer, the layer is integrally bonded to the heat dissipation layer, and the surface roughening layer is formed by roughening the second surface of the heat dissipation layer. The circuit board according to claim 1, wherein the joint portion of the insulating layer infiltrates into the surface roughened layer, and the roughened layer and the joint portion form a mixed reinforcing layer. 前記接着層の厚さは１μｍ以上であることを特徴とする請求項１に記載の回路基板。 The circuit board according to claim 1, wherein the adhesive layer has a thickness of 1 μm or more. 前記放熱層は前記接着層に連通している少なくとも１つの第一貫通孔を有していることを特徴とする請求項１または８に記載の回路基板。 The circuit board according to claim 1 or 8, wherein the heat radiating layer has at least one first through hole communicating with the adhesive layer. 前記接着層は前記放熱層及び前記基板に連通している少なくとも１つの第二貫通孔を有していることを特徴とする請求項１または８に記載の回路基板。 The circuit board according to claim 1 or 8, wherein the adhesive layer has at least one second through hole communicating with the heat radiation layer and the substrate. 前記放熱層は少なくとも１つの前記第一貫通孔を有し、前記接着層は少なくとも１つの前記第二貫通孔を有し、前記第二貫通孔は前記第一貫通孔及び前記基板に連通していることを特徴とする請求項１または８に記載の回路基板。 The heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, and the second through hole communicates with the first through hole and the substrate. The circuit board according to claim 1 or 8, wherein the circuit board is provided. 前記放熱層は少なくとも１つの前記第一貫通孔を有し、前記接着層は少なくとも１つの前記第二貫通孔を有し、前記絶縁層は少なくとも１つの第三貫通孔を有し、前記第二貫通孔は前記第一貫通孔及び前記第三貫通孔に連通していることを特徴とする請求項８に記載の回路基板。 The heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, the insulating layer has at least one third through hole, and the second through hole. The circuit board according to claim 8, wherein the through hole communicates with the first through hole and the third through hole. 第一表面を有している放熱層と、
貼り付け面を有し、前記貼り付け面により前記放熱層の前記第一表面に貼り付け、回路層を有している基板に放熱シートを貼り付けるために用い、前記第一表面は面積を有し、前記貼り付け面は貼り付け面積を有している接着層と、を備える前記放熱シートであって、
前記接着層の前記貼り付け面積は前記第一表面の前記面積未満であることを特徴とする回路基板の放熱シート。 With a heat dissipation layer that has a first surface,
It has a sticking surface, is stuck to the first surface of the heat dissipation layer by the sticking surface, and is used for sticking a heat dissipation sheet to a substrate having a circuit layer, and the first surface has an area. However, the sticking surface is the heat dissipation sheet including an adhesive layer having a sticking area.
A heat-dissipating sheet for a circuit board, wherein the sticking area of the adhesive layer is smaller than the area of the first surface. 前記貼り付け面は貼り付け端部を有し、前記貼り付け端部と同側の前記放熱層の第一端部との間には第一距離を有していることを特徴とする請求項１４に記載の回路基板の放熱シート。 The present invention is characterized in that the sticking surface has a sticking end portion and has a first distance between the sticking end portion and the first end portion of the heat radiation layer on the same side. 14. The heat dissipation sheet for the circuit board according to 14. 前記第一距離は２０μｍ以上であることを特徴とする請求項１５に記載の回路基板の放熱シート。 The heat dissipation sheet for a circuit board according to claim 15, wherein the first distance is 20 μm or more. 絶縁層を備え、前記放熱層は前記絶縁層と前記接着層との間に位置し、前記絶縁層は接合面を有し、前記放熱層は第二表面を有し、前記絶縁層は前記接合面が前記放熱層の前記第二表面に向けられ、前記放熱層と一体に接合し、前記放熱層の前記第二表面には粗化することで表面粗化層を形成し、前記絶縁層の接合部は前記表面粗化層に潜入し、前記粗化層及び前記接合部が混合強化層を構成していることを特徴とする請求項１４に記載の回路基板の放熱シート。 The insulating layer is provided, the heat radiating layer is located between the insulating layer and the adhesive layer, the insulating layer has a bonding surface, the heat radiating layer has a second surface, and the insulating layer is the bonding. The surface of the heat radiating layer is directed toward the second surface of the heat radiating layer, and the surface is integrally bonded to the heat radiating layer. The heat radiation sheet for a circuit board according to claim 14, wherein the joint portion infiltrates into the surface roughened layer, and the roughened layer and the joint portion form a mixed reinforcing layer. 前記接着層の厚さは１μｍ以上であることを特徴とする請求項１４に記載の回路基板の放熱シート。 The heat-dissipating sheet for a circuit board according to claim 14, wherein the adhesive layer has a thickness of 1 μm or more. 前記放熱層は前記接着層に連通している少なくとも１つの第一貫通孔を有していることを特徴とする請求項１４または１７に記載の回路基板の放熱シート。 The heat-dissipating sheet for a circuit board according to claim 14, wherein the heat-dissipating layer has at least one first through hole communicating with the adhesive layer. 前記接着層は前記放熱層及び前記基板に連通している少なくとも１つの第二貫通孔を有していることを特徴とする請求項１４または１７に記載の回路基板の放熱シート。 The heat-dissipating sheet for a circuit board according to claim 14, wherein the adhesive layer has at least one second through hole communicating with the heat-dissipating layer and the substrate. 前記放熱層は少なくとも１つの第一貫通孔を有し、前記接着層は少なくとも１つの第二貫通孔を有し、前記第二貫通孔は前記第一貫通孔に連通していることを特徴とする請求項１４または１７に記載の回路基板の放熱シート。 The heat radiating layer has at least one first through hole, the adhesive layer has at least one second through hole, and the second through hole communicates with the first through hole. The heat dissipation sheet of the circuit board according to claim 14 or 17. 前記放熱層は少なくとも１つの第一貫通孔を有し、前記接着層は少なくとも１つの第二貫通孔を有し、前記絶縁層は少なくとも１つの第三貫通孔を有し、前記第二貫通孔は前記第一貫通孔及び前記第三貫通孔に連通していることを特徴とする請求項１７に記載の回路基板の放熱シート。 The heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, the insulating layer has at least one third through hole, and the second through hole. 17 is the heat dissipation sheet of the circuit board according to claim 17, wherein the first through hole and the third through hole are communicated with each other.
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