CN114521045A - Circuit board and heat dissipation patch thereof - Google Patents
Circuit board and heat dissipation patch thereof Download PDFInfo
- Publication number
- CN114521045A CN114521045A CN202011351003.1A CN202011351003A CN114521045A CN 114521045 A CN114521045 A CN 114521045A CN 202011351003 A CN202011351003 A CN 202011351003A CN 114521045 A CN114521045 A CN 114521045A
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- Prior art keywords
- layer
- hole
- heat dissipation
- adhesive layer
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09554—Via connected to metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09627—Special connections between adjacent vias, not for grounding vias
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board and a heat dissipation patch thereof. The circuit board comprises a substrate and a heat dissipation patch, wherein an adhesive layer of the heat dissipation patch is attached to the substrate, the heat dissipation layer of the heat dissipation patch is projected to the substrate and forms a first projection area, the adhesive layer of the heat dissipation patch is projected to the substrate and forms a second projection area, the second projection area is located in the first projection area, the second projection area of the second projection area is smaller than the first projection area of the first projection area, the adhesion layer is prevented from overflowing or protruding out of the heat dissipation layer to pollute the substrate, and the circuit boards are prevented from being adhered to each other when a plurality of circuit boards are rolled.
Description
Technical Field
The present invention relates to a circuit board and a heat dissipation patch thereof, and more particularly, to a flexible and rollable circuit board and a heat dissipation patch thereof.
Background
In order to increase the heat dissipation effect of the package structure, a heat dissipation material is usually used to attach and cover the chip and the film substrate of the package structure, for example, in taiwan patent 109209860, "flip-chip-on-film package structure", which discloses a first heat dissipation member 13 and a second heat dissipation member 15 having the same structure are respectively attached to the first surface S1 and the second surface S2 of the film substrate 11, refer to fig. 1C of taiwan patent 109209860, which discloses that the first heat dissipation member 13 includes a substrate 131, a first adhesion layer 132, a heat conduction layer 133, a first metal layer 134, a second adhesion layer 135 and a second metal layer 136, and the edges of the first adhesion layer 132 and the second adhesion layer 135 are flush with the edges of the substrate 131, the heat conduction layer 133, the first metal layer 134 and the second metal layer 136.
Therefore, when the flip-chip on film package structure is pressed, the first adhesive layer 132 and the second adhesive layer 135 overflow or protrude from the edges of the substrate 131, the heat conductive layer 133, the first metal layer 134, and the second metal layer 136 due to pressure, so as to contaminate the first surface S1 and/or the second surface S2 of the thin-film substrate 11, and when the flip-chip on film package structure is rolled, the first adhesive layer 132 and the second adhesive layer 135 overflow or protrude from the edges of the substrate 131, the heat conductive layer 133, the first metal layer 134, and the second metal layer 136, so as to cause the flip-chip on film package structure to adhere to each other, which affects the quality and yield of the flip-chip on film package structure.
Disclosure of Invention
The invention mainly aims to avoid the adhesive layer of the heat dissipation patch from overflowing or protruding out of the heat dissipation layer of the heat dissipation patch.
The invention relates to a circuit board which is characterized by comprising a substrate and a heat dissipation patch, wherein the substrate is provided with a surface and a circuit layer, the heat dissipation patch comprises a heat dissipation layer and an adhesive layer, the heat dissipation patch is attached to the substrate through the adhesive layer, the adhesive layer is positioned between the heat dissipation layer and the substrate, the heat dissipation layer is projected to the surface of the substrate, a first projection area is formed on the surface, the first projection area is provided with a first projection area, the adhesive layer is projected to the surface, a second projection area is formed on the surface, the second projection area is provided with a second projection area, the second projection area is positioned in the first projection area, and the second projection area is smaller than the first projection area.
Preferably, the adhesive layer has an attachment surface, the adhesive layer is attached to the first surface of the heat dissipation layer by the attachment surface, the first surface has an area, the attachment surface has an attachment area, and the attachment area is smaller than the area.
Preferably, the attachment surface has an attachment edge, and the attachment edge has a first distance from the first edge of the heat dissipation layer on the same side.
Preferably, wherein the first distance is not less than 20 microns.
Preferably, the first projection edge of the first projection area is formed by projecting the first edge of the heat dissipation layer, the second projection edge of the second projection area is formed by projecting the second edge of the adhesive layer, and a second distance is formed between the first projection edge and the second projection edge on the same side.
Preferably, wherein the second distance is not less than 20 microns.
Preferably, the first projection edge, the second projection edge and the first edge of the heat dissipation layer define a glue accommodating space.
Preferably, the heat dissipation patch further comprises an insulating layer, the heat dissipation layer is located between the insulating layer and the adhesive layer, the insulating layer has a bonding surface, the heat dissipation layer has a second surface, the insulating layer faces the second surface of the heat dissipation layer with the bonding surface and is integrated with the heat dissipation layer, the second surface of the heat dissipation layer is roughened to form a roughened surface layer, and the bonding portion of the insulating layer penetrates into the roughened surface layer, so that the roughened layer and the bonding portion form a mixed strengthening layer.
Preferably, the thickness of the adhesive layer is not less than 1 micron.
Preferably, the heat dissipation layer has at least one first through hole, and the first through hole is communicated with the adhesive layer.
Preferably, the adhesive layer has at least one second through hole, and the second through hole is communicated with the heat dissipation layer and the substrate.
Preferably, the heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, and the second through hole is communicated with the first through hole and the substrate.
Preferably, the heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, and the insulating layer has at least one third through hole, wherein the second through hole is communicated with the first through hole and the third through hole.
The invention relates to a heat dissipation patch of a circuit board, which is characterized by comprising a heat dissipation layer and an adhesive layer, wherein the heat dissipation layer is provided with a first surface, the adhesive layer is provided with an attachment surface, the adhesive layer is attached to the first surface of the heat dissipation layer through the attachment surface, the first surface is provided with an area, the attachment surface is provided with an attachment area, the adhesive layer is used for enabling the heat dissipation patch to be attached to a substrate with a circuit layer, and the attachment area of the adhesive layer is smaller than the area of the first surface.
Preferably, the attachment surface has an attachment edge, and the attachment edge has a first distance from the first edge of the heat dissipation layer on the same side.
Preferably, wherein the first distance is not less than 20 microns.
Preferably, the heat dissipation layer is located between the insulating layer and the adhesive layer, the insulating layer has a bonding surface, the heat dissipation layer has a second surface, the insulating layer faces the second surface of the heat dissipation layer with the bonding surface and is integrated with the heat dissipation layer, the second surface of the heat dissipation layer is roughened to form a roughened surface layer, and the bonding portion of the insulating layer penetrates into the roughened surface layer, so that the roughened layer and the bonding portion form a hybrid strengthening layer.
Preferably, the thickness of the adhesive layer is not less than 1 micron.
Preferably, the heat dissipation layer has at least one first through hole, and the first through hole is communicated with the adhesive layer.
Preferably, the adhesive layer has at least one second through hole, and the second through hole is communicated with the heat dissipation layer and the substrate.
Preferably, the heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, and the second through hole is communicated with the first through hole.
Preferably, the heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, and the insulating layer has at least one third through hole, wherein the second through hole is communicated with the first through hole and the third through hole.
The invention can avoid the adhesion layer overflowing or protruding out of the heat dissipation layer to pollute the substrate and can avoid the circuit boards from adhering to each other when the circuit boards are rolled up.
Drawings
FIG. 1: the invention relates to a perspective view of a circuit board.
FIG. 2: a top view of the circuit board of the present invention.
FIG. 3: a cross-sectional view of the circuit board of the present invention.
FIG. 4: the invention discloses a bottom view of a heat dissipation patch.
FIG. 5: a cross-sectional view of the circuit board of the present invention.
FIG. 6: a cross-sectional view of the circuit board of the present invention.
FIG. 7: a cross-sectional view of the circuit board of the present invention.
[ description of main element symbols ]
100 circuit board 110 substrate
111, surface 120, radiating patch
121 insulating layer 121a bonding surface
121b, a joint part 121c, a third through hole
122 heat dissipation layer 122a first surface
122b, second surface 122c, first edge
122d roughened surface layer 122e first through-holes
123 adhesive layer 123a adhesive surface
123d second perforation A1 first projection area
A11 first projected edge A2 second projected area
A21 second projected edge D1 first distance
D2 second distance M hybrid strengthening layer
R is glue containing space
Detailed Description
Referring to fig. 1 to 3, a circuit board 100 according to the present invention is used to combine a chip (not shown) to form a package structure (such as a chip on film package, COF), where the circuit board 100 includes a substrate 110 and a heat dissipation patch 120, the substrate 110 has a surface 111 and a circuit layer (not shown), and the circuit layer may be disposed on the surface 111 and/or another surface, but the present embodiment is not limited thereto, and the circuit layer is used to combine the chip.
Referring to fig. 1, 3 and 4, the heat dissipation patch 120 includes a heat dissipation layer 122 and an adhesive layer 123, the heat dissipation patch 120 is attached to the substrate 110 by the adhesive layer 123, the heat dissipation layer 122 is made of a heat conductive/dissipating material such as metal and graphite, the adhesive layer 123 is located between the heat dissipation layer 122 and the substrate 110, the thickness of the adhesive layer 123 is not less than 1 micrometer (μm), the adhesive layer 123 is made of an adhesive material such as pressure sensitive adhesive and thermosetting resin, preferably, the heat dissipation patch 120 further includes an insulating layer 121, the heat dissipation layer 122 is located between the insulating layer 121 and the adhesive layer 123, and the insulating layer 121 is made of an insulating material such as Polyimide (PI).
Referring to fig. 1, 3 and 4, the adhesive layer 123 has an attachment surface 123a, the adhesive layer 123 is attached to the first surface 122a of the heat dissipation layer 122 by the attachment surface 123a, the first surface 122a has an area, the attachment surface 123a has an attachment area, the attachment area is smaller than the area, in the embodiment, the attachment surface 123a has an attachment edge 123b, a first distance D1 is provided between the attachment edge 123b and the first edge 122c of the heat dissipation layer 122 on the same side, and preferably, the first distance D1 is not smaller than 20 micrometers (μm).
Referring to fig. 2, the insulating layer 121 is bonded to the heat dissipation layer 122, and in the present embodiment, the insulating layer 121 has a bonding surface 121a, the heat dissipation layer 122 has a second surface 122b, the insulating layer 121 faces the second surface 122b of the heat dissipation layer with the bonding surface 121a, and is integrated with the heat dissipation layer 122, preferably, the second surface 122b of the heat dissipation layer 122 is roughened (e.g., blackened, mechanically roughened, etched, etc., but not limited thereto) to form a roughened surface layer 122d, the bonding portion 121b of the insulating layer 121 penetrates into the roughened surface layer 122d, so that the roughened layer 122d and the bonding portion 121b constitute a hybrid strengthening layer M, the roughened surface layer 122d is used to increase the bonding area between the heat dissipation layer 122 and the insulation layer 121, the hybrid strengthening layer M can increase the bonding strength between the insulating layer 121 and the heat sink layer 122 to prevent the insulating layer 121 from separating from the heat sink layer 122.
Referring to fig. 1, 2 and 3, the heat dissipation patch 120 is attached to the substrate 110 by the adhesive layer 123, the heat dissipation layer 122 is projected onto the surface 111 of the substrate 110, and a first projection area a1 is formed on the surface 111, the first projection area a1 has a first projection area, and a first projection edge a11 of the first projection area a1 is formed by projecting the first edge 122c of the heat dissipation layer 122.
Referring to fig. 1, 2 and 3, the adhesive layer 123 projects onto the surface 111, and a second projection area a2 is formed on the surface 111, the second projection area a2 is located in the first projection area a1, the second projection area a2 has a second projection area, a second projection edge a21 of the second projection area a2 is formed by projecting a second edge 123c of the adhesive layer 123, the second projection area is smaller than the first projection area, and a second distance D2 is formed between the first projection edge a11 and the second projection edge a21 which are located on the same side, and preferably, the second distance D2 is not smaller than 20 micrometers (μm).
Referring to fig. 1, fig. 2 and fig. 3, a glue accommodating space R is defined by the first projection edge a11, the second projection edge a21 and the first edge 122c of the heat dissipation layer 122, and the second projection area a2 is located in the first projection area a1, the second projection area of the second projection area a2 is smaller than the first projection area, the first distance D1 and the second distance D2 of the first projection area a1, so as to accommodate the pressed adhesive layer 123, so as to prevent the adhesive layer 123 from overflowing or protruding from the heat dissipation layer 122 to pollute the substrate 110, and prevent the circuit boards 100 from adhering to each other when the circuit boards 100 are rolled up.
Referring to fig. 5, preferably, in an embodiment, the heat dissipation layer 122 has at least one first through hole 122e, the first through hole is communicated with the adhesive layer 123, when the heat dissipation patch 120 is pressed to press the adhesive layer 123, the first through hole 122e is used to accommodate the pressed adhesive layer 123, so as to prevent the adhesive layer 123 from overflowing or protruding out of the heat dissipation layer 122 to contaminate the substrate 110, and prevent the circuit boards 100 from adhering to each other when the circuit boards 100 are wound, and the first through hole 122e can increase the heat dissipation efficiency of the heat dissipation layer 122.
Referring to fig. 6, in another embodiment, preferably, the adhesive layer 123 has at least one second through hole 123d, the second through hole 123d is communicated with the heat dissipation layer 122 and the substrate 110, when the heat dissipation patch 120 is pressed to press the adhesive layer 123, the second through hole 123d is used to accommodate the pressed adhesive layer 123, so as to prevent the adhesive layer 123 from overflowing out or protruding out of the heat dissipation layer 122 to contaminate the substrate 110, and prevent the circuit boards 100 from adhering to each other when the plurality of circuit boards 100 are wound, or, in this embodiment, the heat dissipation layer 122 has at least one first through hole 122e, the second through hole 123d is communicated with the first through hole 122e and the substrate 110, the first through hole 122e and the second through hole 123d are used to accommodate the pressed adhesive layer 123, so as to prevent the adhesive layer 123 from overflowing out or protruding out of the heat dissipation layer 122 to contaminate the substrate 110, and the circuit boards 100 can be prevented from being adhered to each other when the circuit boards 100 are rolled.
Next, referring to fig. 7, in another embodiment, the heat dissipation layer 122 has at least one first through hole 122e, the adhesive layer 123 has at least one second through hole 123d, the insulating layer 121 has at least one third through hole 121c, the second through hole 123d is communicated with the first through hole 122e and the third through hole 121c, and the first through hole 122e, the second through hole 123d and the third through hole 121c are used for accommodating the extruded adhesive layer 123, so as to prevent the adhesive layer 123 from overflowing or protruding from the heat dissipation layer 122 to contaminate the substrate 110, and prevent the circuit boards 100 from adhering to each other when the circuit boards 100 are taken up.
The second projection area a2 projected by the adhesive layer 123 onto the surface 111 is located in the first projection area a1 projected by the heat dissipation layer 122 onto the surface 111, and the second projection area is smaller than the first projection area, or the attachment area of the attachment surface 123a of the adhesive layer 123 is smaller than the area of the first surface 122a of the heat dissipation layer 122, so as to prevent the adhesive layer 123 from overflowing or protruding from the heat dissipation layer 122 to contaminate the substrate 110, and prevent the circuit boards 100 from adhering to each other when the circuit boards 100 are rolled.
Although the present invention has been described with reference to a preferred embodiment, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (22)
1. A circuit board, comprising:
a substrate having a surface and a circuit layer; and
the heat dissipation patch comprises a heat dissipation layer and an adhesive layer, wherein the heat dissipation patch is attached to the substrate through the adhesive layer, the adhesive layer is located between the heat dissipation layer and the substrate, the heat dissipation layer is projected to the surface of the substrate, a first projection area is formed on the surface, the first projection area is provided with a first projection area, the adhesive layer is projected to the surface, a second projection area is formed on the surface, the second projection area is provided with a second projection area, the second projection area is located in the first projection area, and the second projection area is smaller than the first projection area.
2. The circuit board of claim 1, wherein the adhesive layer has an attachment surface, the adhesive layer is attached to the first surface of the heat sink layer with the attachment surface, the first surface has an area, the attachment surface has an attachment area, and the attachment area is smaller than the area.
3. The circuit board of claim 2, wherein the attachment surface has an attachment edge having a first distance from the first edge of the heat dissipation layer on the same side.
4. The circuit board of claim 3, wherein the first distance is not less than 20 microns.
5. The circuit board of claim 1, wherein a first projected edge of the first projected area is formed by projecting a first edge of the heat dissipation layer, a second projected edge of the second projected area is formed by projecting a second edge of the adhesive layer, and a second distance is formed between the first projected edge and the second projected edge on the same side.
6. The circuit board of claim 5, wherein the second distance is not less than 20 microns.
7. The circuit board of claim 5, wherein the first projected edge, the second projected edge and the first edge of the heat sink layer define a glue receiving space.
8. The circuit board of claim 1, wherein the heat sink further comprises an insulating layer, the heat sink layer is disposed between the insulating layer and the adhesive layer, the insulating layer has a bonding surface, the heat sink layer has a second surface, the insulating layer faces the second surface of the heat sink layer with the bonding surface and is bonded to the heat sink layer, the second surface of the heat sink layer is roughened to form a roughened surface layer, the bonding portion of the insulating layer penetrates into the roughened surface layer, such that the roughened layer and the bonding portion form a hybrid reinforced layer.
9. The circuit board of claim 1, wherein the thickness of the adhesive layer is not less than 1 μm.
10. The circuit board of claim 1 or 8, wherein the heat dissipation layer has at least one first through hole, and the first through hole is connected to the adhesive layer.
11. The circuit board of claim 1 or 8, wherein the adhesive layer has at least one second through hole, and the second through hole is connected to the heat dissipation layer and the substrate.
12. The circuit board of claim 1 or 8, wherein the heat dissipation layer has at least one first through hole, and the adhesive layer has at least one second through hole, the second through hole communicating the first through hole and the substrate.
13. The circuit board of claim 8, wherein the heat dissipation layer has at least one first through hole, the adhesive layer has at least one second through hole, and the insulating layer has at least one third through hole, the second through hole communicating the first through hole and the third through hole.
14. A heat sink patch for a circuit board, comprising:
a heat dissipation layer having a first surface; and
the adhesive layer is provided with an attaching surface, the adhesive layer is attached to the first surface of the heat dissipation layer through the attaching surface, the first surface is provided with an area, the attaching surface is provided with an attaching area, the adhesive layer is used for enabling the heat dissipation patch to be attached to the substrate with the circuit layer, and the attaching area of the adhesive layer is smaller than the area of the first surface.
15. The thermal patch for circuit board of claim 14, wherein the attachment surface has an attachment edge, and the attachment edge has a first distance from the first edge of the thermal layer on the same side.
16. The circuit board heat sink patch of claim 15, wherein the first distance is not less than 20 microns.
17. The heat sink patch as claimed in claim 14, further comprising an insulating layer, wherein the heat sink layer is disposed between the insulating layer and the adhesive layer, the insulating layer has a bonding surface, the heat sink layer has a second surface, the insulating layer faces the second surface of the heat sink layer with the bonding surface and is bonded to the heat sink layer, the second surface of the heat sink layer is roughened to form a roughened surface layer, and the bonding portion of the insulating layer penetrates into the roughened surface layer, such that the roughened layer and the bonding portion form a hybrid reinforced layer.
18. The heat sink patch according to claim 14, wherein the adhesive layer has a thickness of not less than 1 μm.
19. The thermal patch for circuit board of claim 14 or 17, wherein the thermal layer has at least one first through hole, and the first through hole is connected to the adhesive layer.
20. The heat sink patch according to claim 14 or 17, wherein the adhesive layer has at least one second through hole, and the second through hole connects the heat sink layer and the substrate.
21. The heat sink patch according to claim 14 or 17, wherein the heat sink layer has at least one first through hole, and the adhesive layer has at least one second through hole, the second through hole communicating with the first through hole.
22. The thermal patch of circuit board of claim 17, wherein the thermal layer has at least one first through hole, the adhesive layer has at least one second through hole, and the insulating layer has at least one third through hole, the second through hole connecting the first through hole and the third through hole.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW109140448A TWI751797B (en) | 2020-11-19 | 2020-11-19 | Circuit board and thermal paste thereof |
| TW109140448 | 2020-11-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114521045A true CN114521045A (en) | 2022-05-20 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011351003.1A Pending CN114521045A (en) | 2020-11-19 | 2020-11-26 | Circuit board and heat dissipation patch thereof |
| CN202022780435.6U Active CN214070227U (en) | 2020-11-19 | 2020-11-26 | Circuit board and heat dissipation patch thereof |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022780435.6U Active CN214070227U (en) | 2020-11-19 | 2020-11-26 | Circuit board and heat dissipation patch thereof |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7208280B2 (en) |
| KR (1) | KR102556187B1 (en) |
| CN (2) | CN114521045A (en) |
| TW (1) | TWI751797B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI744156B (en) * | 2020-12-31 | 2021-10-21 | 頎邦科技股份有限公司 | Heat-dissipating semiconductor package and method for manufacturing the same |
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| KR102026561B1 (en) * | 2018-04-27 | 2019-11-05 | 매그나칩 반도체 유한회사 | Chip on film type semiconductor package |
| US10642098B2 (en) * | 2018-07-11 | 2020-05-05 | Sharp Kabushiki Kaisha | Illumination device and display device |
| WO2020044594A1 (en) * | 2018-08-28 | 2020-03-05 | 三菱マテリアル株式会社 | Copper/ceramic bonded body, insulation circuit board, method for producing copper/ceramic bonded body, and method for manufacturing insulation circuit board |
| TWM598743U (en) * | 2020-04-27 | 2020-07-21 | 裕晨科技股份有限公司 | Heat dissipation apparatus |
-
2020
- 2020-11-19 TW TW109140448A patent/TWI751797B/en active
- 2020-11-26 CN CN202011351003.1A patent/CN114521045A/en active Pending
- 2020-11-26 CN CN202022780435.6U patent/CN214070227U/en active Active
-
2021
- 2021-02-22 JP JP2021026179A patent/JP7208280B2/en active Active
- 2021-02-23 KR KR1020210024026A patent/KR102556187B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TWI751797B (en) | 2022-01-01 |
| KR20220068878A (en) | 2022-05-26 |
| TW202221868A (en) | 2022-06-01 |
| CN214070227U (en) | 2021-08-27 |
| JP7208280B2 (en) | 2023-01-18 |
| KR102556187B1 (en) | 2023-07-14 |
| JP2022081373A (en) | 2022-05-31 |
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