JPS59179558A - 熱硬化性樹脂組成物 - Google Patents
熱硬化性樹脂組成物Info
- Publication number
- JPS59179558A JPS59179558A JP5414483A JP5414483A JPS59179558A JP S59179558 A JPS59179558 A JP S59179558A JP 5414483 A JP5414483 A JP 5414483A JP 5414483 A JP5414483 A JP 5414483A JP S59179558 A JPS59179558 A JP S59179558A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- resin composition
- thermosetting resin
- maleimide
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 4
- -1 maleimide compound Chemical class 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 abstract description 17
- 239000004642 Polyimide Substances 0.000 abstract description 12
- 239000000203 mixture Substances 0.000 abstract description 10
- 239000000463 material Substances 0.000 abstract description 5
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 abstract 3
- 239000011810 insulating material Substances 0.000 abstract 1
- 238000010030 laminating Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 13
- 229920005989 resin Polymers 0.000 description 13
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000009719 polyimide resin Substances 0.000 description 5
- 239000000047 product Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- PUKLCKVOVCZYKF-UHFFFAOYSA-N 1-[2-(2,5-dioxopyrrol-1-yl)ethyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CCN1C(=O)C=CC1=O PUKLCKVOVCZYKF-UHFFFAOYSA-N 0.000 description 1
- FJKKJQRXSPFNPM-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)-4-methylphenyl]pyrrole-2,5-dione Chemical compound CC1=CC=C(N2C(C=CC2=O)=O)C=C1N1C(=O)C=CC1=O FJKKJQRXSPFNPM-UHFFFAOYSA-N 0.000 description 1
- SLJJEYCPTRKHFI-UHFFFAOYSA-N 3-[6-(2,5-dioxopyrrol-3-yl)hexyl]pyrrole-2,5-dione Chemical compound O=C1NC(=O)C(CCCCCCC=2C(NC(=O)C=2)=O)=C1 SLJJEYCPTRKHFI-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000013040 bath agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000007859 condensation product Substances 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012772 electrical insulation material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- MJVGBKJNTFCUJM-UHFFFAOYSA-N mexenone Chemical group OC1=CC(OC)=CC=C1C(=O)C1=CC=C(C)C=C1 MJVGBKJNTFCUJM-UHFFFAOYSA-N 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007363 ring formation reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000005628 tolylene group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5414483A JPS59179558A (ja) | 1983-03-30 | 1983-03-30 | 熱硬化性樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5414483A JPS59179558A (ja) | 1983-03-30 | 1983-03-30 | 熱硬化性樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59179558A true JPS59179558A (ja) | 1984-10-12 |
| JPH0129223B2 JPH0129223B2 (enrdf_load_stackoverflow) | 1989-06-08 |
Family
ID=12962361
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5414483A Granted JPS59179558A (ja) | 1983-03-30 | 1983-03-30 | 熱硬化性樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59179558A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0618269A1 (en) * | 1993-04-02 | 1994-10-05 | Hitachi, Ltd. | Thermosetting resin compositions and their use for thin film wiring boards |
-
1983
- 1983-03-30 JP JP5414483A patent/JPS59179558A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0618269A1 (en) * | 1993-04-02 | 1994-10-05 | Hitachi, Ltd. | Thermosetting resin compositions and their use for thin film wiring boards |
| EP0755979A3 (en) * | 1993-04-02 | 1997-06-18 | Hitachi Ltd | Thermosetting resin compositions and their use of thin film circuit boards |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0129223B2 (enrdf_load_stackoverflow) | 1989-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5510425A (en) | Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides | |
| US3712932A (en) | Polysulphone compositions | |
| EP0078039B1 (en) | Thermosetting resin composition, prepolymer thereof and cured article thereof | |
| JPS60166325A (ja) | 耐熱性樹脂の製造方法 | |
| US5608013A (en) | Polyimides and thermosetting resin compositions containing the same | |
| US4486583A (en) | Heat-resistant resin from aromatic cyanamide compound and aromatic amine compound | |
| JPH0312105B2 (enrdf_load_stackoverflow) | ||
| JPH01129025A (ja) | ポリアミノビスイミド系樹脂組成物 | |
| JPS59179558A (ja) | 熱硬化性樹脂組成物 | |
| JPH0312592B2 (enrdf_load_stackoverflow) | ||
| JPH03185066A (ja) | 熱硬化性樹脂組成物 | |
| JPH01157846A (ja) | フレキシブル両面金属張り積層板の製造法 | |
| JPH0346512B2 (enrdf_load_stackoverflow) | ||
| JPH05179141A (ja) | 熱硬化性樹脂組成物 | |
| JPH03111450A (ja) | 末端変性イミドオリゴマー組成物 | |
| JPH0682892B2 (ja) | 可撓性印刷回路用基板の製造方法 | |
| JPH0578481A (ja) | 新規なポリイミド及びその製造法 | |
| JPS59191726A (ja) | 熱硬化性樹脂組成物 | |
| JPH01240526A (ja) | 付加型イミド樹脂プレポリマー組成物の製造方法 | |
| JPH0791382B2 (ja) | 付加型イミド樹脂プレポリマー組成物の製造方法 | |
| JPS6339613B2 (enrdf_load_stackoverflow) | ||
| JPS5879017A (ja) | イソメラミン環を有するポリマ | |
| JPS6218412A (ja) | 熱硬化性樹脂組成物 | |
| JPH02138789A (ja) | 印刷配線板用基板の製造法 | |
| JPH0791381B2 (ja) | 付加型イミド樹脂プレポリマー組成物の製造方法 |