JPS59179558A - 熱硬化性樹脂組成物 - Google Patents

熱硬化性樹脂組成物

Info

Publication number
JPS59179558A
JPS59179558A JP5414483A JP5414483A JPS59179558A JP S59179558 A JPS59179558 A JP S59179558A JP 5414483 A JP5414483 A JP 5414483A JP 5414483 A JP5414483 A JP 5414483A JP S59179558 A JPS59179558 A JP S59179558A
Authority
JP
Japan
Prior art keywords
formula
resin composition
thermosetting resin
maleimide
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5414483A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0129223B2 (enrdf_load_html_response
Inventor
Yasushi Yamamoto
泰 山本
Sadao Sato
貞夫 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP5414483A priority Critical patent/JPS59179558A/ja
Publication of JPS59179558A publication Critical patent/JPS59179558A/ja
Publication of JPH0129223B2 publication Critical patent/JPH0129223B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
JP5414483A 1983-03-30 1983-03-30 熱硬化性樹脂組成物 Granted JPS59179558A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5414483A JPS59179558A (ja) 1983-03-30 1983-03-30 熱硬化性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5414483A JPS59179558A (ja) 1983-03-30 1983-03-30 熱硬化性樹脂組成物

Publications (2)

Publication Number Publication Date
JPS59179558A true JPS59179558A (ja) 1984-10-12
JPH0129223B2 JPH0129223B2 (enrdf_load_html_response) 1989-06-08

Family

ID=12962361

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5414483A Granted JPS59179558A (ja) 1983-03-30 1983-03-30 熱硬化性樹脂組成物

Country Status (1)

Country Link
JP (1) JPS59179558A (enrdf_load_html_response)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618269A1 (en) * 1993-04-02 1994-10-05 Hitachi, Ltd. Thermosetting resin compositions and their use for thin film wiring boards

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0618269A1 (en) * 1993-04-02 1994-10-05 Hitachi, Ltd. Thermosetting resin compositions and their use for thin film wiring boards
EP0755979A3 (en) * 1993-04-02 1997-06-18 Hitachi Ltd Thermosetting resin compositions and their use of thin film circuit boards

Also Published As

Publication number Publication date
JPH0129223B2 (enrdf_load_html_response) 1989-06-08

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