JPS5917779A - 二次元電荷像の読出し装置およびその製造方法 - Google Patents

二次元電荷像の読出し装置およびその製造方法

Info

Publication number
JPS5917779A
JPS5917779A JP58114118A JP11411883A JPS5917779A JP S5917779 A JPS5917779 A JP S5917779A JP 58114118 A JP58114118 A JP 58114118A JP 11411883 A JP11411883 A JP 11411883A JP S5917779 A JPS5917779 A JP S5917779A
Authority
JP
Japan
Prior art keywords
conductor
electrode
fet
board
mos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP58114118A
Other languages
English (en)
Japanese (ja)
Inventor
フランツ・アルトマン
ベルント・グランツ
デイ−タ−・グレンダ
ラルフ・オツペルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Schuckertwerke AG
Siemens Corp
Original Assignee
Siemens Schuckertwerke AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Schuckertwerke AG, Siemens Corp filed Critical Siemens Schuckertwerke AG
Publication of JPS5917779A publication Critical patent/JPS5917779A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
JP58114118A 1982-06-28 1983-06-24 二次元電荷像の読出し装置およびその製造方法 Pending JPS5917779A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE32240260 1982-06-28
DE19823224026 DE3224026A1 (de) 1982-06-28 1982-06-28 Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays

Publications (1)

Publication Number Publication Date
JPS5917779A true JPS5917779A (ja) 1984-01-30

Family

ID=6167006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58114118A Pending JPS5917779A (ja) 1982-06-28 1983-06-24 二次元電荷像の読出し装置およびその製造方法

Country Status (3)

Country Link
US (1) US4592029A (enExample)
JP (1) JPS5917779A (enExample)
DE (1) DE3224026A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3412665A1 (de) * 1984-04-04 1985-10-17 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays
FR2566220B1 (fr) * 1984-06-15 1986-08-22 Cit Alcatel Selecteur opto-electronique
EP0177802A3 (de) * 1984-09-27 1988-12-21 Siemens Aktiengesellschaft Ladungssensoranordnung
JPH0799868B2 (ja) * 1984-12-26 1995-10-25 日本放送協会 固体撮像装置
US4792672A (en) * 1985-04-12 1988-12-20 Grumman Aerospace Corporation Detector buffer board
US4703170A (en) * 1985-04-12 1987-10-27 Grumman Aerospace Corporation Infrared focal plane module
DE3769724D1 (de) * 1986-08-11 1991-06-06 Siemens Ag Vorrichtung zum lesen eines zweidimensionalen ladungsbildes.
US4831601A (en) * 1986-10-31 1989-05-16 Siemens Aktiengesellschaft Apparatus for transmitting and receiving ultrasonic signals
US4985774A (en) * 1988-01-20 1991-01-15 Minolta Camera Kabushiki Kaisha Image sensing device having direct drainage of unwanted charges
JP3117138B2 (ja) * 1989-09-13 2000-12-11 オリンパス光学工業株式会社 電子スチルカメラとその撮像記録素子
FR2653627B1 (fr) * 1989-10-20 1996-11-15 Thomson Composants Militaires Detecteurs d'images a forte capacite de stockage par pixel.
US4987494A (en) * 1989-12-07 1991-01-22 The United States Of America As Represented By The Secretary Of The Army System for parallel transfer between CCD arrays
FR2669423B1 (fr) * 1990-11-16 1993-07-30 Electricite De France Capteur de pression acoustique audiofrequence a haute resolution spatiale.
CA2139151A1 (en) * 1994-01-14 1995-07-15 Amin M. Hanafy Two-dimensional acoustic array and method for the manufacture thereof
EP0744085B1 (en) * 1994-02-11 1998-10-28 1294339 Ontario, Inc. Electromagnetic radiation imaging device using thin film transistors
US5757727A (en) * 1996-04-24 1998-05-26 Acuson Corporation Two-dimensional acoustic array and method for the manufacture thereof
US5938612A (en) * 1997-05-05 1999-08-17 Creare Inc. Multilayer ultrasonic transducer array including very thin layer of transducer elements
US20110034769A1 (en) * 1997-10-06 2011-02-10 Micro-Imaging Solutions Llc Reduced area imaging device incorporated within wireless endoscopic devices

Also Published As

Publication number Publication date
US4592029A (en) 1986-05-27
DE3224026C2 (enExample) 1991-05-29
DE3224026A1 (de) 1983-12-29

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