DE3224026A1 - Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays - Google Patents

Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays

Info

Publication number
DE3224026A1
DE3224026A1 DE19823224026 DE3224026A DE3224026A1 DE 3224026 A1 DE3224026 A1 DE 3224026A1 DE 19823224026 DE19823224026 DE 19823224026 DE 3224026 A DE3224026 A DE 3224026A DE 3224026 A1 DE3224026 A1 DE 3224026A1
Authority
DE
Germany
Prior art keywords
electrodes
circuit boards
dual
fets
sensitive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823224026
Other languages
German (de)
English (en)
Other versions
DE3224026C2 (enExample
Inventor
Franz 8000 München Altmann
Bernd Dr. 8501 Oberasbach Granz
Dieter 8000 München Grenda
Ralph 8522 Herzogenaurach Oppelt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Priority to DE19823224026 priority Critical patent/DE3224026A1/de
Priority to DE19833300831 priority patent/DE3300831A1/de
Priority to DE19833302897 priority patent/DE3302897A1/de
Priority to US06/503,798 priority patent/US4592029A/en
Priority to JP58114118A priority patent/JPS5917779A/ja
Publication of DE3224026A1 publication Critical patent/DE3224026A1/de
Application granted granted Critical
Publication of DE3224026C2 publication Critical patent/DE3224026C2/de
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in subclass H10D
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
DE19823224026 1982-06-28 1982-06-28 Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays Granted DE3224026A1 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE19823224026 DE3224026A1 (de) 1982-06-28 1982-06-28 Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays
DE19833300831 DE3300831A1 (de) 1982-06-28 1983-01-12 Verfahren zum herstellen einer vorrichtung zur auslese eines zweidimensionalen ladungsbildes mit einem array
DE19833302897 DE3302897A1 (de) 1982-06-28 1983-01-28 Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mit einem array
US06/503,798 US4592029A (en) 1982-06-28 1983-06-13 Array apparatus for reading-out a two-dimensional charge image
JP58114118A JPS5917779A (ja) 1982-06-28 1983-06-24 二次元電荷像の読出し装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823224026 DE3224026A1 (de) 1982-06-28 1982-06-28 Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays

Publications (2)

Publication Number Publication Date
DE3224026A1 true DE3224026A1 (de) 1983-12-29
DE3224026C2 DE3224026C2 (enExample) 1991-05-29

Family

ID=6167006

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823224026 Granted DE3224026A1 (de) 1982-06-28 1982-06-28 Vorrichtung zur auslese eines zweidimensionalen ladungsbildes mittels eines arrays

Country Status (3)

Country Link
US (1) US4592029A (enExample)
JP (1) JPS5917779A (enExample)
DE (1) DE3224026A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0160821A3 (en) * 1984-04-04 1986-03-26 Siemens Aktiengesellschaft Apparatus for reading a two-dimensional charge image using an array
EP0177802A3 (de) * 1984-09-27 1988-12-21 Siemens Aktiengesellschaft Ladungssensoranordnung

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2566220B1 (fr) * 1984-06-15 1986-08-22 Cit Alcatel Selecteur opto-electronique
JPH0799868B2 (ja) * 1984-12-26 1995-10-25 日本放送協会 固体撮像装置
US4792672A (en) * 1985-04-12 1988-12-20 Grumman Aerospace Corporation Detector buffer board
US4703170A (en) * 1985-04-12 1987-10-27 Grumman Aerospace Corporation Infrared focal plane module
EP0256378B1 (de) * 1986-08-11 1991-05-02 Siemens Aktiengesellschaft Vorrichtung zum Lesen eines zweidimensionalen Ladungsbildes
US4831601A (en) * 1986-10-31 1989-05-16 Siemens Aktiengesellschaft Apparatus for transmitting and receiving ultrasonic signals
US4985774A (en) * 1988-01-20 1991-01-15 Minolta Camera Kabushiki Kaisha Image sensing device having direct drainage of unwanted charges
JP3117138B2 (ja) * 1989-09-13 2000-12-11 オリンパス光学工業株式会社 電子スチルカメラとその撮像記録素子
FR2653627B1 (fr) * 1989-10-20 1996-11-15 Thomson Composants Militaires Detecteurs d'images a forte capacite de stockage par pixel.
US4987494A (en) * 1989-12-07 1991-01-22 The United States Of America As Represented By The Secretary Of The Army System for parallel transfer between CCD arrays
FR2669423B1 (fr) * 1990-11-16 1993-07-30 Electricite De France Capteur de pression acoustique audiofrequence a haute resolution spatiale.
CA2139151A1 (en) * 1994-01-14 1995-07-15 Amin M. Hanafy Two-dimensional acoustic array and method for the manufacture thereof
JPH09511361A (ja) * 1994-02-11 1997-11-11 リットン システムズ カナダ リミテッド デュアルゲート薄膜トランジスタを用いた電磁放射線画像装置
US5757727A (en) * 1996-04-24 1998-05-26 Acuson Corporation Two-dimensional acoustic array and method for the manufacture thereof
US5938612A (en) * 1997-05-05 1999-08-17 Creare Inc. Multilayer ultrasonic transducer array including very thin layer of transducer elements
US20110034769A1 (en) * 1997-10-06 2011-02-10 Micro-Imaging Solutions Llc Reduced area imaging device incorporated within wireless endoscopic devices

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
IEEE Ultrasonics Symposium 1980, S. 766-769 *
Integrated Acoustic Array and Acoustical Holography, Vol. 7 Kessler (Ed.) Plenumpress, 1975, S. 423-445 *
Journal of Physics E: Scientific Instruments, Vol. 8, 1975, S. 337-349 *
Proceedings of the IEEE, Vol. 67, No. 4, April 1979, S. 620-641 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0160821A3 (en) * 1984-04-04 1986-03-26 Siemens Aktiengesellschaft Apparatus for reading a two-dimensional charge image using an array
US4661814A (en) * 1984-04-04 1987-04-28 Siemens Aktiengesellschaft Device for reading out a two-dimensional charge pattern by means of an array
EP0177802A3 (de) * 1984-09-27 1988-12-21 Siemens Aktiengesellschaft Ladungssensoranordnung

Also Published As

Publication number Publication date
DE3224026C2 (enExample) 1991-05-29
JPS5917779A (ja) 1984-01-30
US4592029A (en) 1986-05-27

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