JPS59175740A - ウエハ検出装置 - Google Patents

ウエハ検出装置

Info

Publication number
JPS59175740A
JPS59175740A JP5080683A JP5080683A JPS59175740A JP S59175740 A JPS59175740 A JP S59175740A JP 5080683 A JP5080683 A JP 5080683A JP 5080683 A JP5080683 A JP 5080683A JP S59175740 A JPS59175740 A JP S59175740A
Authority
JP
Japan
Prior art keywords
wafer
take
arm
elevator
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5080683A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0447976B2 (enrdf_load_stackoverflow
Inventor
Tetsuya Utsunomiya
宇都宮　鉄也
Haruhiko Yoshioka
晴彦 吉岡
Wataru Mochizuki
渉 望月
Yasuto Yamamoto
山本　保人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TELMEC CO Ltd
Original Assignee
TELMEC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TELMEC CO Ltd filed Critical TELMEC CO Ltd
Priority to JP5080683A priority Critical patent/JPS59175740A/ja
Publication of JPS59175740A publication Critical patent/JPS59175740A/ja
Publication of JPH0447976B2 publication Critical patent/JPH0447976B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP5080683A 1983-03-25 1983-03-25 ウエハ検出装置 Granted JPS59175740A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5080683A JPS59175740A (ja) 1983-03-25 1983-03-25 ウエハ検出装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5080683A JPS59175740A (ja) 1983-03-25 1983-03-25 ウエハ検出装置

Related Child Applications (5)

Application Number Title Priority Date Filing Date
JP1071185A Division JPH02333A (ja) 1989-03-23 1989-03-23 半導体ウエハ測定方法
JP1071184A Division JPH01280332A (ja) 1989-03-23 1989-03-23 半導体ウエハ配列検出装置
JP8359891A Division JP2537310B2 (ja) 1991-03-23 1991-03-23 ウエハ検出装置
JP8359991A Division JP2500205B2 (ja) 1991-03-23 1991-03-23 ウエハ移送装置
JP3083600A Division JPH0817199B2 (ja) 1991-03-23 1991-03-23 ウエハ移送装置

Publications (2)

Publication Number Publication Date
JPS59175740A true JPS59175740A (ja) 1984-10-04
JPH0447976B2 JPH0447976B2 (enrdf_load_stackoverflow) 1992-08-05

Family

ID=12869010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5080683A Granted JPS59175740A (ja) 1983-03-25 1983-03-25 ウエハ検出装置

Country Status (1)

Country Link
JP (1) JPS59175740A (enrdf_load_stackoverflow)

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
JPS61258444A (ja) * 1985-05-13 1986-11-15 Canon Inc 基板搬出入装置
JPS6221648A (ja) * 1985-07-17 1987-01-30 Canon Inc ウエハ位置検知装置
JPS6251236A (ja) * 1985-08-30 1987-03-05 Canon Inc ウエハ処理システム
JPS62263647A (ja) * 1986-05-12 1987-11-16 Tokyo Electron Ltd ウエハプロ−バ
JPS6322738U (enrdf_load_stackoverflow) * 1986-07-28 1988-02-15
JPS63308928A (ja) * 1987-06-11 1988-12-16 Fuji Electric Co Ltd ウエハ搬送装置
JPH01244634A (ja) * 1988-03-25 1989-09-29 Teru Barian Kk 半導体ウエハの製造装置
JPH02132840A (ja) * 1988-02-12 1990-05-22 Tokyo Electron Ltd 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法
JPH02142157A (ja) * 1988-11-22 1990-05-31 Nippon M R C Kk ウェハーの有無・傾き判別装置
JPH02164050A (ja) * 1988-12-19 1990-06-25 Tokyo Electron Ltd 半導体製造装置
US4941800A (en) * 1988-10-21 1990-07-17 Tokyo Electron Limited Transfer apparatus for plate-like member
JPH03105201A (ja) * 1989-09-19 1991-05-02 Nidek Co Ltd ウェーハ検出装置
JPH05175292A (ja) * 1992-05-22 1993-07-13 Tokyo Seimitsu Co Ltd ウエハの抜取方法
JPH1067428A (ja) * 1997-03-28 1998-03-10 Texas Instr Japan Ltd ウエハスライス収納・取出方法
US6162010A (en) * 1997-06-23 2000-12-19 Tokyo Electron Limited Method for recovering object to be treated after interruption

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764928A (en) * 1980-10-07 1982-04-20 Nippon Kogaku Kk <Nikon> Carrying apparatus for photo mask or reticle

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5764928A (en) * 1980-10-07 1982-04-20 Nippon Kogaku Kk <Nikon> Carrying apparatus for photo mask or reticle

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61188331A (ja) * 1985-02-15 1986-08-22 Nippon Texas Instr Kk 物体取出装置
JPS61258444A (ja) * 1985-05-13 1986-11-15 Canon Inc 基板搬出入装置
JPS6221648A (ja) * 1985-07-17 1987-01-30 Canon Inc ウエハ位置検知装置
JPS6251236A (ja) * 1985-08-30 1987-03-05 Canon Inc ウエハ処理システム
JPS62263647A (ja) * 1986-05-12 1987-11-16 Tokyo Electron Ltd ウエハプロ−バ
JPS6322738U (enrdf_load_stackoverflow) * 1986-07-28 1988-02-15
JPS63308928A (ja) * 1987-06-11 1988-12-16 Fuji Electric Co Ltd ウエハ搬送装置
JPH02132840A (ja) * 1988-02-12 1990-05-22 Tokyo Electron Ltd 処理装置及びレジスト処理装置及び処理方法及びレジスト処理方法
JPH01244634A (ja) * 1988-03-25 1989-09-29 Teru Barian Kk 半導体ウエハの製造装置
US4941800A (en) * 1988-10-21 1990-07-17 Tokyo Electron Limited Transfer apparatus for plate-like member
JPH02142157A (ja) * 1988-11-22 1990-05-31 Nippon M R C Kk ウェハーの有無・傾き判別装置
JPH02164050A (ja) * 1988-12-19 1990-06-25 Tokyo Electron Ltd 半導体製造装置
JPH03105201A (ja) * 1989-09-19 1991-05-02 Nidek Co Ltd ウェーハ検出装置
JPH05175292A (ja) * 1992-05-22 1993-07-13 Tokyo Seimitsu Co Ltd ウエハの抜取方法
JPH1067428A (ja) * 1997-03-28 1998-03-10 Texas Instr Japan Ltd ウエハスライス収納・取出方法
US6162010A (en) * 1997-06-23 2000-12-19 Tokyo Electron Limited Method for recovering object to be treated after interruption

Also Published As

Publication number Publication date
JPH0447976B2 (enrdf_load_stackoverflow) 1992-08-05

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