JPS59165439A - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPS59165439A
JPS59165439A JP58039511A JP3951183A JPS59165439A JP S59165439 A JPS59165439 A JP S59165439A JP 58039511 A JP58039511 A JP 58039511A JP 3951183 A JP3951183 A JP 3951183A JP S59165439 A JPS59165439 A JP S59165439A
Authority
JP
Japan
Prior art keywords
resistors
terminals
internal
unnecessary
internal terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58039511A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0520904B2 (enExample
Inventor
Katsuhiko Suyama
須山　勝彦
Eiji Yamamura
山村　栄志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58039511A priority Critical patent/JPS59165439A/ja
Publication of JPS59165439A publication Critical patent/JPS59165439A/ja
Publication of JPH0520904B2 publication Critical patent/JPH0520904B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP58039511A 1983-03-09 1983-03-09 半導体装置 Granted JPS59165439A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58039511A JPS59165439A (ja) 1983-03-09 1983-03-09 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58039511A JPS59165439A (ja) 1983-03-09 1983-03-09 半導体装置

Publications (2)

Publication Number Publication Date
JPS59165439A true JPS59165439A (ja) 1984-09-18
JPH0520904B2 JPH0520904B2 (enExample) 1993-03-22

Family

ID=12555059

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58039511A Granted JPS59165439A (ja) 1983-03-09 1983-03-09 半導体装置

Country Status (1)

Country Link
JP (1) JPS59165439A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6350954B1 (en) * 2000-01-24 2002-02-26 Motorola Inc. Electronic device package, and method
JP2003504874A (ja) * 1999-07-07 2003-02-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 隣接する接着パッドのコード化による配置を備えた半導体デバイス構成

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52100172A (en) * 1976-02-18 1977-08-22 Nippon Electric Co Method of producing hybrid integrated circuit
JPS5315080A (en) * 1976-07-27 1978-02-10 Nec Corp Transistor
JPS5319760A (en) * 1976-08-09 1978-02-23 Hitachi Ltd Integrated circuit device
JPS54162168A (en) * 1978-06-13 1979-12-22 Tokyo Shibaura Electric Co Thin film hybrid circuit
JPS5533073A (en) * 1978-08-30 1980-03-08 Mitsubishi Electric Corp High frequency transistor
JPS5586141A (en) * 1978-12-23 1980-06-28 Fujitsu Ltd Package for hybrid integrated circuit

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52100172A (en) * 1976-02-18 1977-08-22 Nippon Electric Co Method of producing hybrid integrated circuit
JPS5315080A (en) * 1976-07-27 1978-02-10 Nec Corp Transistor
JPS5319760A (en) * 1976-08-09 1978-02-23 Hitachi Ltd Integrated circuit device
JPS54162168A (en) * 1978-06-13 1979-12-22 Tokyo Shibaura Electric Co Thin film hybrid circuit
JPS5533073A (en) * 1978-08-30 1980-03-08 Mitsubishi Electric Corp High frequency transistor
JPS5586141A (en) * 1978-12-23 1980-06-28 Fujitsu Ltd Package for hybrid integrated circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003504874A (ja) * 1999-07-07 2003-02-04 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 隣接する接着パッドのコード化による配置を備えた半導体デバイス構成
US6350954B1 (en) * 2000-01-24 2002-02-26 Motorola Inc. Electronic device package, and method

Also Published As

Publication number Publication date
JPH0520904B2 (enExample) 1993-03-22

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