JPS59163891A - セラミツク配線板 - Google Patents

セラミツク配線板

Info

Publication number
JPS59163891A
JPS59163891A JP58037781A JP3778183A JPS59163891A JP S59163891 A JPS59163891 A JP S59163891A JP 58037781 A JP58037781 A JP 58037781A JP 3778183 A JP3778183 A JP 3778183A JP S59163891 A JPS59163891 A JP S59163891A
Authority
JP
Japan
Prior art keywords
land
wiring board
ceramic
inner layer
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58037781A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0144034B2 (en, 2012
Inventor
豊 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP58037781A priority Critical patent/JPS59163891A/ja
Publication of JPS59163891A publication Critical patent/JPS59163891A/ja
Publication of JPH0144034B2 publication Critical patent/JPH0144034B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Coupling Device And Connection With Printed Circuit (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
JP58037781A 1983-03-08 1983-03-08 セラミツク配線板 Granted JPS59163891A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58037781A JPS59163891A (ja) 1983-03-08 1983-03-08 セラミツク配線板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58037781A JPS59163891A (ja) 1983-03-08 1983-03-08 セラミツク配線板

Publications (2)

Publication Number Publication Date
JPS59163891A true JPS59163891A (ja) 1984-09-14
JPH0144034B2 JPH0144034B2 (en, 2012) 1989-09-25

Family

ID=12507027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58037781A Granted JPS59163891A (ja) 1983-03-08 1983-03-08 セラミツク配線板

Country Status (1)

Country Link
JP (1) JPS59163891A (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286191A (ja) * 1988-09-22 1990-03-27 Matsushita Electric Ind Co Ltd 電子部品取付け装置
JPH0553268U (ja) * 1991-12-18 1993-07-13 株式会社東芝 多層印刷基板ユニット
JP2018018587A (ja) * 2016-07-25 2018-02-01 日本特殊陶業株式会社 保持装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929975A (en, 2012) * 1972-07-19 1974-03-16
JPS55167659U (en, 2012) * 1979-05-16 1980-12-02
JPS5999794A (ja) * 1982-11-29 1984-06-08 株式会社デンソー 厚膜回路装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4929975A (en, 2012) * 1972-07-19 1974-03-16
JPS55167659U (en, 2012) * 1979-05-16 1980-12-02
JPS5999794A (ja) * 1982-11-29 1984-06-08 株式会社デンソー 厚膜回路装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0286191A (ja) * 1988-09-22 1990-03-27 Matsushita Electric Ind Co Ltd 電子部品取付け装置
JPH0553268U (ja) * 1991-12-18 1993-07-13 株式会社東芝 多層印刷基板ユニット
JP2018018587A (ja) * 2016-07-25 2018-02-01 日本特殊陶業株式会社 保持装置

Also Published As

Publication number Publication date
JPH0144034B2 (en, 2012) 1989-09-25

Similar Documents

Publication Publication Date Title
JPS62229896A (ja) 印刷配線基板
JPS59163891A (ja) セラミツク配線板
JP2642922B2 (ja) プリント配線基板
US5219607A (en) Method of manufacturing printed circuit board
JPH0621283U (ja) プリント配線板
JPH02158194A (ja) 多層セラミック回路基板
JP2000091010A (ja) 電子部品モジュールおよびその実装構造
JPS60201692A (ja) 配線回路装置
EP0375954B1 (en) Method of manufacturing printed circuit board
JPS6045098A (ja) 接続構体
JPH0143877Y2 (en, 2012)
JPH02148791A (ja) プリント配線板
JPH0421257Y2 (en, 2012)
JPH08316595A (ja) フレキシブル回路板
JPS62208691A (ja) 両面実装型混成集積回路
JPS6362396A (ja) スル−ホ−ルを有した基板構造
JPH10209593A (ja) ２層配線基板、及びその製造方法
JPS5941894A (ja) フレキシブルプリント基板の半田付け装置
JPH03255691A (ja) プリント配線板
JPH0437191A (ja) 多層プリント基板
JPS6031289A (ja) 電気回路基板
JPS61139093A (ja) セラミツク多層印刷配線板
JPH01217994A (ja) 印刷配線板
JPS63102392A (ja) セラミツク多層基板
JPS6155629A (ja) 液晶表示装置