JPS5916341A - 集積回路用基板の製造方法 - Google Patents

集積回路用基板の製造方法

Info

Publication number
JPS5916341A
JPS5916341A JP12554282A JP12554282A JPS5916341A JP S5916341 A JPS5916341 A JP S5916341A JP 12554282 A JP12554282 A JP 12554282A JP 12554282 A JP12554282 A JP 12554282A JP S5916341 A JPS5916341 A JP S5916341A
Authority
JP
Japan
Prior art keywords
single crystal
silicon
substrate
oxide film
crystal silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12554282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6244412B2 (enrdf_load_stackoverflow
Inventor
Akinobu Satou
佐藤　倬暢
Seiji Kato
誠司 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIDO KEISOKU GIJUTSU KENKIYUUKUMIAI
Original Assignee
JIDO KEISOKU GIJUTSU KENKIYUUKUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIDO KEISOKU GIJUTSU KENKIYUUKUMIAI filed Critical JIDO KEISOKU GIJUTSU KENKIYUUKUMIAI
Priority to JP12554282A priority Critical patent/JPS5916341A/ja
Publication of JPS5916341A publication Critical patent/JPS5916341A/ja
Publication of JPS6244412B2 publication Critical patent/JPS6244412B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/7627—Vertical isolation by full isolation by porous oxide silicon, i.e. FIPOS techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components
    • H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
    • H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
    • H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
    • H01L21/76281—Lateral isolation by selective oxidation of silicon

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Element Separation (AREA)
  • Weting (AREA)
JP12554282A 1982-07-19 1982-07-19 集積回路用基板の製造方法 Granted JPS5916341A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12554282A JPS5916341A (ja) 1982-07-19 1982-07-19 集積回路用基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12554282A JPS5916341A (ja) 1982-07-19 1982-07-19 集積回路用基板の製造方法

Publications (2)

Publication Number Publication Date
JPS5916341A true JPS5916341A (ja) 1984-01-27
JPS6244412B2 JPS6244412B2 (enrdf_load_stackoverflow) 1987-09-21

Family

ID=14912768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12554282A Granted JPS5916341A (ja) 1982-07-19 1982-07-19 集積回路用基板の製造方法

Country Status (1)

Country Link
JP (1) JPS5916341A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7829971B2 (en) 2007-12-14 2010-11-09 Denso Corporation Semiconductor apparatus
US8148809B2 (en) 2009-01-15 2012-04-03 Denso Corporation Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7829971B2 (en) 2007-12-14 2010-11-09 Denso Corporation Semiconductor apparatus
US8148809B2 (en) 2009-01-15 2012-04-03 Denso Corporation Semiconductor device, method for manufacturing the same, and multilayer substrate having the same

Also Published As

Publication number Publication date
JPS6244412B2 (enrdf_load_stackoverflow) 1987-09-21

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