JPS59159594A - 金属プリント基板の製造方法 - Google Patents
金属プリント基板の製造方法Info
- Publication number
- JPS59159594A JPS59159594A JP3383083A JP3383083A JPS59159594A JP S59159594 A JPS59159594 A JP S59159594A JP 3383083 A JP3383083 A JP 3383083A JP 3383083 A JP3383083 A JP 3383083A JP S59159594 A JPS59159594 A JP S59159594A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- printed circuit
- circuit board
- layer
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 46
- 239000002184 metal Substances 0.000 title claims description 46
- 238000000034 method Methods 0.000 title claims description 16
- 238000007747 plating Methods 0.000 claims description 47
- 239000011347 resin Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 29
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 20
- 238000005553 drilling Methods 0.000 claims description 18
- 238000007772 electroless plating Methods 0.000 claims description 4
- 238000009713 electroplating Methods 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 description 40
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 33
- 229910052802 copper Inorganic materials 0.000 description 26
- 239000010949 copper Substances 0.000 description 26
- 239000004020 conductor Substances 0.000 description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 7
- 239000011888 foil Substances 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 240000002834 Paulownia tomentosa Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- CMWTZPSULFXXJA-VIFPVBQESA-N naproxen Chemical group C1=C([C@H](C)C(O)=O)C=CC2=CC(OC)=CC=C21 CMWTZPSULFXXJA-VIFPVBQESA-N 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3383083A JPS59159594A (ja) | 1983-03-03 | 1983-03-03 | 金属プリント基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3383083A JPS59159594A (ja) | 1983-03-03 | 1983-03-03 | 金属プリント基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59159594A true JPS59159594A (ja) | 1984-09-10 |
| JPH0144037B2 JPH0144037B2 (enrdf_load_stackoverflow) | 1989-09-25 |
Family
ID=12397399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3383083A Granted JPS59159594A (ja) | 1983-03-03 | 1983-03-03 | 金属プリント基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59159594A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0162699U (enrdf_load_stackoverflow) * | 1987-10-14 | 1989-04-21 | ||
| JP2013149808A (ja) * | 2012-01-20 | 2013-08-01 | Yamaichi Electronics Co Ltd | メタルコアフレキシブル配線板およびその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4867764A (enrdf_load_stackoverflow) * | 1971-12-21 | 1973-09-17 | ||
| JPS5259852A (en) * | 1975-11-11 | 1977-05-17 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
-
1983
- 1983-03-03 JP JP3383083A patent/JPS59159594A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4867764A (enrdf_load_stackoverflow) * | 1971-12-21 | 1973-09-17 | ||
| JPS5259852A (en) * | 1975-11-11 | 1977-05-17 | Matsushita Electric Ind Co Ltd | Method of producing printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0162699U (enrdf_load_stackoverflow) * | 1987-10-14 | 1989-04-21 | ||
| JP2013149808A (ja) * | 2012-01-20 | 2013-08-01 | Yamaichi Electronics Co Ltd | メタルコアフレキシブル配線板およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0144037B2 (enrdf_load_stackoverflow) | 1989-09-25 |
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