JPS59159553A - フイルムキヤリヤ - Google Patents

フイルムキヤリヤ

Info

Publication number
JPS59159553A
JPS59159553A JP58033270A JP3327083A JPS59159553A JP S59159553 A JPS59159553 A JP S59159553A JP 58033270 A JP58033270 A JP 58033270A JP 3327083 A JP3327083 A JP 3327083A JP S59159553 A JPS59159553 A JP S59159553A
Authority
JP
Japan
Prior art keywords
lead
film
film carrier
copper
tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58033270A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0332913B2 (enrdf_load_html_response
Inventor
Junichi Okamoto
岡本　準市
Kenzo Hatada
畑田　賢造
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP58033270A priority Critical patent/JPS59159553A/ja
Publication of JPS59159553A publication Critical patent/JPS59159553A/ja
Publication of JPH0332913B2 publication Critical patent/JPH0332913B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP58033270A 1983-03-01 1983-03-01 フイルムキヤリヤ Granted JPS59159553A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58033270A JPS59159553A (ja) 1983-03-01 1983-03-01 フイルムキヤリヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58033270A JPS59159553A (ja) 1983-03-01 1983-03-01 フイルムキヤリヤ

Publications (2)

Publication Number Publication Date
JPS59159553A true JPS59159553A (ja) 1984-09-10
JPH0332913B2 JPH0332913B2 (enrdf_load_html_response) 1991-05-15

Family

ID=12381830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58033270A Granted JPS59159553A (ja) 1983-03-01 1983-03-01 フイルムキヤリヤ

Country Status (1)

Country Link
JP (1) JPS59159553A (enrdf_load_html_response)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223124A (ja) * 1985-07-23 1987-01-31 Sharp Corp フィルムキャリアｌｓｉ
US5384204A (en) * 1990-07-27 1995-01-24 Shinko Electric Industries Co. Ltd. Tape automated bonding in semiconductor technique

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6223124A (ja) * 1985-07-23 1987-01-31 Sharp Corp フィルムキャリアｌｓｉ
US5384204A (en) * 1990-07-27 1995-01-24 Shinko Electric Industries Co. Ltd. Tape automated bonding in semiconductor technique

Also Published As

Publication number Publication date
JPH0332913B2 (enrdf_load_html_response) 1991-05-15

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